Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.

Abstract: An optical lens head, an camera module, and an assembling method therefor, wherein the camera module comprises a photosensitive chip (23) and an optical lens head (10); said optical lens head (10) comprises a plurality of optical lenses (111); the assembly position of one of the optical lenses (111) is adjustable; each of the optical lenses (111) is black-lacquered and matte-treated; a connecting portion (1113), a light-beam entrance hole (1114) and a light-shielding portion (1115) are formed on the corresponding optical lenses (111), such that the individual optical lenses (111) can be successively and jointly assembled together, eliminating the need of a spacing ring, a diaphragm, a lens barrel and other structural components used in a conventional camera module, thereby improving manufacture precision, production yield and imaging quality of the camera module.

Abstract: Approaches presented herein enable hot upgrading a microservices sequence in a cloud computing environment. More specifically, a next microservice of microservice subsequence in a running sequence is obtained, in response to a message to invoke the microservice or subsequence. The running microservice sequence includes at least one unexecuted microservice or subsequence that is to be hot upgraded. The running microservice sequence is generated based on a sequence that is to be hot upgraded which comprises an ordered list of microservices and/or subsequences. The approach may include determining the status of a next microservice or subsequence. The approach may further include invoking the next microservice or subsequence in the running sequence, in response to the status of the next microservice or subsequence being upgrade-complete.

Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.

Abstract: A state monitoring method for vibration drilling of a stack structure material is provided. A load power and a torque value of a drilling spindle is monitored during machining. Drilling state are divided according to a machining material of a drill. According to a data of a test library, reference thresholds of two monitoring objects for judging the change of the drilling state are set to achieve the state monitoring for the drilling process. The method monitors the machining process through the monitoring module in the machining system.

Abstract: A network service load distribution system and a method thereof are disclosed. In the system, each of service servers generates a message queue for hardware performance data thereof based on identification information and service content thereof, a load distribution server receives the message queues from the service servers through subscription. The load distribution server polls one of the service servers to acquire the message queue to retrieve the hardware performance data of the polled service server. When the hardware performance data or the hardware performance calculation data of the polled service server is higher than or equal to a threshold value, the load distribution server accumulates a performance alert indicator of the polled service server and polls another of the service servers, thereby achieving the technical effect of providing a reasonable network service load distribution.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof.

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board.

Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

Abstract: The present disclosure discloses a method for compensating for image quality of an optical system by means of a lens adjustment, applicable to a camera module comprising an adjustable lens or an adjustable lens set, the method comprising the following steps: (A) determining, based on imaging information of a to-be-adjusted optical system, parameters that need to be adjusted for compensating for the image quality; (B) establishing functions of relation between the parameters that need to be adjusted for compensating for the image quality and a to-be-adjusted lens factors; and (C) determining an adjustment mode and an adjustment amount for the to-be-adjusted lens based on the relation between the parameters that need to be adjusted for compensating for the image quality and the to-be-adjusted lens factors.

Abstract: The present application provides an anti-PD-L1 antibody, an antigen-binding fragment thereof, and use thereof. The present application also provides a multispecific antibody such as a bispecific antibody, a conjugate, and a composition comprising the anti-PD-L1 antibody or the antigen-binding fragment thereof, and use thereof in treatment of diseases such as cancer.

Abstract: A camera module and a molded circuit board assembly thereof, a semi-finished product of the molded circuit board assembly, and an array camera module and a molded circuit board assembly thereof, as well as a manufacturing method and an electronic device, wherein the camera module comprises at least one optical lens, at least one back surface molded portion, at least one photosensitive element and a circuit board.

Abstract: The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Abstract: A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.

Abstract: A camera module, an integral base component of same, and a manufacturing method therefor are provided. The camera module includes at least one lens, at least one photosensitive chip, at least one filter, and at least one integral base component. The integral base component includes a base part and a circuit board part. The base part is integrally packaged in the circuit board part. The photosensitive chip is mounted on the circuit board part. The base part forms at least one through hole so as to provide the photosensitive chip with a light path. The lens is arranged on the light path of the photosensitive chip.

Abstract: An example operation may include one or more of connecting, by a virtual blockchain manager node, to a blockchain configured to store a plurality of user transactions committed by a user node, identifying, by the virtual blockchain manager node, a user request transaction from the plurality of the user transactions for a creation of a virtual blockchain for the user, wherein the user request transaction contains a rule, creating, by the virtual blockchain manager node, the virtual blockchain based on the user request transaction, populating, by the virtual blockchain manager node, the virtual blockchain with the user transactions from the plurality of the user transactions from the blockchain based on the rule, and executing, by the virtual blockchain manager node, a smart contract to record the rule and a hash of all blocks from the virtual blockchain onto the blockchain.

Abstract: An array camera module having a height difference, a circuit board assembly and a manufacturing method therefor, and an electronic device. The array camera module comprises a first camera module unit and a second camera module unit, wherein the first camera module unit comprises at least one first photosensitive assembly and at least one first lens; the first lens is located on a photosensitive path of the first photosensitive assembly; the first photosensitive assembly comprises at least one extension portion; the extension portion at least partially extends towards the direction away from the first photosensitive assembly; and the second camera module unit is fixedly connected to a second extension portion, so that the ends of the two camera module units are consistent.

Abstract: The present disclosure discloses a lens assembly, a camera module, and a method for assembling the same. An embodiment of the method for assembling a lens assembly includes: preparing a first lens subassembly and a second lens subassembly, the first lens subassembly including a first lens cylinder and a first lens, and the second lens subassembly including a second lens cylinder and a second lens; arranging the first lens subassembly on an optical axis of the second lens subassembly to form an imaging optical system comprising the first lens and the second lens; moving the first and the second lens subassemblies relatively along the optical axis, and matching an actually measured image plane of the optical system and a target plane; and connecting the first and the second lens subassemblies to fix a relative distance between the first and the second lens subassemblies along the optical axis.

Abstract: Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.