Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.

Abstract: The present disclosure provides an integrated circuit (IC) structure that includes a substrate having a circuit region and a chip corner region; IC devices formed on the substrate within the circuit region; a passivation layer formed over the IC devices; and a polyimide layer formed over the passivation layer, wherein the passivation layer and the polyimide layer include a stress-release pattern formed in the chip corner region.

Abstract: A buffering device for a filter bottle. The buffering device is disposed on a body of the filter bottle and has a sidewall, a top, a bottom, and a chamber. The top of the buffering device is moveable up and down along the sidewall of the buffering device. The chamber is formed between the sidewall, the top, and the bottom of the buffering device, and does not communicate with an interior of the filter bottle. The chamber communicates with an exterior via an air gap for air exchange. A filter bottle having the buffering device can provide a function of anti-water-hammer, can reduce a risk of leakage at a connection between the filter bottle and a valve head, and can provide an anti-freeze effect to reduce a risk of rupture of the filter bottle.

Abstract: A filtration apparatus and an electronic device are provided to resolve the problem of housing body sealing failures caused by particulate matter in water damaging the waterproof membrane sealing the electronic device. In the filtration apparatus and electronic device, a first filter layer is disposed on an outer side of an outer surface of a housing body, a second filter layer is disposed between the outer surface and the first filter layer, and both the first filter layer and the second filter layer cover function holes on the housing body.

Abstract: A regeneration system is provided for regenerating at least one regeneration container which has an accommodation space for confining therein an inactive ion-exchange resin. The regeneration system includes a flow-path control device, a first tank, a second tank, a first filtration element, a third tank, and a second filtration element. The flow-path control device is actuated to be operable in a first circulation state and a second circulation state. The first tank is switchable to be in fluid communication with the accommodation space. The second tank is switchable to be in fluid communication with a first circulation path. The first filtration element is disposed to filter a first liquid in the first circulation path. The third tank is switchable to be in fluid communication with the accommodation space. The second filtration element is disposed to filter a third liquid in a second circulation path.

Abstract: A steerable drilling device has an outer tube extending along a longitudinal axis; a drill bit joint inserted into said outer tube, a lower end of said drill bit joint extending out of a lower end of said outer tube for connection to a drill bit; a joint drive mechanism, provided in said outer tube and configured to drive said drill bit joint to swing relative to the longitudinal axis; and a lower connection mechanism. The lower connection mechanism has a connection body connected to said joint drive mechanism in such a manner that said joint drive mechanism is non-rotatable with respect to said connection body, a first centralizer arranged between said connection body and said outer tube, a circuit system arranged in said connection body and configured to provide an electrical signal to said joint driving mechanism, and an attitude sensor arranged in said connection body.

Abstract: Provided is an identification method of plastic microparticles, including: performing an infrared analysis on plastic microparticles to identify whether the plastic microparticles include polyethylene terephthalate, polyethylene, polypropylene, or nylon 66, wherein the identification is to determine whether the plastic microparticles have a characteristic peak of each plastic, and the characteristic peak is selected from signals that do not overlap and interfere with each other in the infrared spectrum signals of each plastic.

Abstract: Mechanisms are provided for intrusion detection based on regular expression matching. The mechanisms partition a regular expression (RegEx) rule set into a plurality of different partitions and distributes the plurality of different partitions to a plurality of different edge computing devices associated with a protected network of computing resources. The mechanisms route data packets of an incoming data stream to the plurality of edge computing devices, each of which processes the data packets to determine whether the data packets match RegEx rules in a partition distributed to the edge computing device. A determination is made as to whether the incoming data stream represents an intrusion based on a combination of results of the processing of the data packets by the plurality of edge computing devices.

Abstract: An electronic package and a heat dissipation structure thereof are provided, in which a supporting member of the heat dissipation structure is disposed around an outer periphery of a central area and has grooves at corner areas. In this way, the grooves can avoid stress concentration in the corner areas, and the rest of the supporting member can well connect and fix the heat dissipation structure and a carrying structure, so as to suppress warpage of the entire electronic package and prevent delamination.

Abstract: An optotype calibration method is disclosed. The optotype calibration method includes steps of: (a) when a first optotype and a second optotype located outside an observable area, moving the observable area from an original position until the first optotype or the second optotype appears in the observable area; (b) adjusting a focus mechanism to make the first optotype and the second optotype close to each other; (c) moving the observable area back to the original position; and (d) repeating the steps (a)˜(c) until the first optotype and the second optotype align with each other.

Abstract: An optical biometer includes a light-source module, a light-splitting module, a reference-arm, a sensing-arm and a sensing module. The light-source module emits incident-light. The light-splitting module, disposed corresponding to light-source module, divides the incident-light into reference light and sensing light. The reference-arm, disposed corresponding to light-splitting module, generates a first reflected-light according to the reference light. The sensing-arm, disposed corresponding to the light-splitting module, emits the sensing light to the eye and receives a second reflected-light from the eye. The sensing module generates a sensing result according to the first reflected-light and second reflected-light. In a first mode, the sensing light is emitted to a first position of the eye. In a second mode, the sensing light is emitted to a second position of the eye.

Abstract: An electronic package and a heat dissipation structure thereof are provided, in which supporting members of the heat dissipation structure are arranged in edge areas, and no supporting member is arranged in corner areas. In this way, the supporting members are interrupted at the corner areas, so that stress can be prevented from concentrating in the corner areas, and the entire electronic package can be prevented from warping and delamination.

Abstract: A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.

Abstract: A water filter includes a filtering head, a filter bottle assembly, a switch member, and a quick release device. The filtering head includes a flow channel module. The filter bottle assembly includes a filter bottle. The quick release device includes a press lever, two links, and two push members. When the press lever is pivoted, the two links and the two push members are driven by the press lever to move the filter bottle simultaneously so that the filter bottle is mounted on or detached from the filtering head quickly. A switch member functions as a waterway switch to control a water supply of the filtering head and functions as a locking mechanism for locking or unlocking the quick release device.

Abstract: A method controls a piece of exercise equipment when a user of the exercise equipment is using a virtual reality headset. The method begins by receiving sensor inputs detecting a position of the user with respect to the exercise equipment. An operational zone of the exercise equipment is then determined. It is then identified when the user is moving toward a warning area within the operational zone of the exercise equipment. The method then sends signals to the virtual reality headset. Based on the signals, the virtual reality headset creates audible and visual outputs to instruct the user to move back fully into the operational zone of the exercise equipment.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: A semiconductor device with a barrier layer between a gate structure and gate spacer layers, and a method of fabricating the same are disclosed. The a method includes forming a fin structure on a substrate, forming a polysilicon structure on the fin structure, performing a nitridation operation to form a barrier layer on the polysilicon structure and the fin structure, forming gate spacer layers on the barrier layer, forming a source/drain region in the fin structure and adjacent to the barrier layer, annealing the gate spacer layers, and replacing the polysilicon structure with a gate structure.

Abstract: A backflow-preventing filter module includes a filter unit and a backflow-prevention valve. The filter unit includes a filter cartridge that has a connector formed with an annular groove, and a filter shell that defines an accommodating space and that includes a connecting head. The connecting head has an inner surrounding wall defining an annular slot. The backflow-prevention valve is sleeved on the connector, and has a fixing portion disposed in the annular groove and an abutting portion moveable between an open position, where a distal end of the abutting portion is pushed by water to be away from the inner surrounding wall so that the annular slot is not blocked, and a closed position, where the abutting portion is expanded to abut the distal end thereof against the inner surrounding wall, thereby blocking the annular slot.

Abstract: The present invention relates to dental medical instruments, and specifically discloses an automatic grinding drill device for oral caries, including a mounting frame. Two retainers are arranged on the mounting frame, the bottom of the mounting frame is connected with a support plate through drive assemblies, a drill bit assembly is arranged at the bottom of the support plate, and a visual recognition module is also arranged on the support plate. The present invention has the advantage that the retainers keep a real-time relative static state with teeth of a patient during use, needing no frequent correction, so that operation steps are simplified.

Abstract: A structure of stable liquid crystal display (LCD) module includes at least one data driver for receiving data control signals from a master control unit (MCU) and transmitting data driving signals via a part of data lines to liquid crystal units in the stable LCD module; at least one data switch component for grounding the data lines via capacitors when the data lines do not have the data driving signals; at least one scan driver for receiving scan control signals from the MCU and transmitting scan driving signals via a part of scan lines to the liquid crystal units in the stable LCD module; and at least one scan switch component for grounding the scan lines via capacitors when the scan lines do not have the scan driving signals. In this way, crosstalk interference caused by energy spillover generated by neighboring data and/or scan lines can be eliminated.