Abstract: The method for increasing the accuracy of grasping an object can include: labelling an image based on an attempted object grasp by a robot and generating a trained graspability network using the labelled images. The method can additionally or alternatively include determining a grasp point using the trained graspability network; executing an object grasp at the grasp point S400; and/or any other suitable elements.

Abstract: A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

Abstract: A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the two or more curatives, wherein the polishing layer is characterized by one or more of a ratio of viscous modulus (G?) at 104° C. to shear loss modulus (G?) at 150° C. of at least 5:1; and a specific gravity of the polishing layer is less than or equal to 95% of a calculated specific gravity for the isocyanate terminated oligomer or polymer, the curative blend and the pre-expanded fluid filled polymeric microspheres.

Abstract: A polishing pad for chemical mechanical polishing comprises: a polishing layer that comprises a polymer matrix that is the reaction product of an isocyanate terminated oligomer or polymer with a curative blend comprising a mono-aromatic polyamine curative and a polyamine curative having two or more aromatic rings, wherein the polymer matrix has hard segment domains and soft segment domains wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the mono-aryl amine curative and the poly-aryl amine curative, wherein the pores have a unimodal size distribution and wherein the polishing layer has a specific gravity of less than 0.70 g/cm3.

Abstract: A polishing pad for chemical mechanical polishing comprises a polishing layer which comprises a polymer matrix which is the reaction product of an isocyanate terminated oligomer or polymer, with a curative blend comprising two or more polyamine curatives wherein pores are present in the polymer matrix, such pores being formed by expansion of pre-expanded fluid filled polymeric microspheres such expansion occurring during reaction of the isocyanate terminated oligomer or polymer with the two or more curatives, wherein the polishing layer is characterized by one or more of a ratio of shear loss modulus (G?) at 104° C. to shear loss modulus (G?) at 150° C. of at least 5:1; and a specific gravity of the polishing layer is less than or equal to 95% of a calculated specific gravity for the isocyanate terminated oligomer or polymer, the curative blend and the pre-expanded fluid filled polymeric microspheres.

Abstract: A chemical mechanical polishing pad comprising a substantially non-porous polishing layer, the polishing layer comprising a polymer matrix and agglomerates of polymer particles embedded in the polymer matrix wherein the polymer particles are present in amounts of 5 to 35 weight percent based on weight of the polishing layer, the agglomerates have a size of greater than 1 ?m, the polymer particles have a tensile modulus higher than a tensile modulus of the polymer matrix. The polishing layer viscoelastic and has a GEL of greater than 1000 Pa?1. Polishing a metal/insulator composite with such a pad can result in low amounts of dishing of the metal feature.

Abstract: Systems and method for grasp execution using height maps.

Abstract: A method for object grasping, including: determining features of a scene; determining candidate grasp locations; determining a set of candidate grasp proposals for the candidate grasp locations; optionally modifying a candidate grasp proposal of the set; determining grasp scores associated with the candidate grasp proposals; selecting a set of final grasp proposals based on the grasp scores; and executing a grasp proposal from the set of final grasp proposals.

Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixture of a curative of 4,4?-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4?-methylene-bis-o-(2-chloroaniline) (MbOCA), and a polyisocyanate prepolymer formed from one or two aromatic diisocyanates, such as toluene diisocyanate (TDI), or a mixture of an aromatic diisocyanate and an alicyclic diisocyanate, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG and having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. %. The polyurethane in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 50 to 90, a shear storage modulus (G?) at 65° C.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating grasps for objects within a container. One of the methods includes determining a set of grasp proposals with associated grasping windows, wherein each grasp proposal has a different respective position within a workspace. A respective set of waypoints is determined for each grasp proposal, each set comprising a pre-grasp pose and a grasp pose within the workspace. A final selected grasp proposal is used to control an end effector of a robot to grasp an object in the workspace based on a calculated grasp trajectory associated to the selected grasp proposal.

Abstract: The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface for polishing or planarizing the substrate; a polymeric matrix forming the polishing layer and including gas-filled or liquid-filled polymeric microelements; and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 ?m to 10 ?m size range.

Abstract: The method for increasing the accuracy of grasping an object can include: labelling an image based on an attempted object grasp by a robot and generating a trained graspability network using the labelled images. The method can additionally or alternatively include determining a grasp point using the trained graspability network; executing an object grasp at the grasp point S400; and/or any other suitable elements.

Abstract: The method for increasing the accuracy of grasping an object can include: labelling an image based on an attempted object grasp by a robot and generating a trained graspability network using the labelled images. The method can additionally or alternatively include determining a grasp point using the trained graspability network; executing an object grasp at the grasp point S400; and/or any other suitable elements.

Abstract: A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

Abstract: A method for object grasping, including: determining features of a scene; determining candidate grasp locations; determining a set of candidate grasp proposals for the candidate grasp locations; optionally modifying a candidate grasp proposal of the set; determining grasp scores associated with the candidate grasp proposals; selecting a set of final grasp proposals based on the grasp scores; and executing a grasp proposal from the set of final grasp proposals.

Abstract: The invention provides a method for polishing or planarizing a substrate. First, the method comprises attaching a polymer-polymer composite polishing pad to a polishing device. The polishing pad has a polymer matrix and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a zeta potential more negative than the polymeric matrix. Cationic particle-containing slurry is applied to the polishing pad. Conditioning the polymer-polymer composite polishing pad exposes the fluoropolymer particles to the polishing surface and creates fluoropolymer-containing debris particles in the slurry. Polishing or planarizing the substrate with the increased electronegativity from the fluoropolymer at the polishing surface and in the fluoropolymer-containing debris particles stabilizes the cationic particle-containing slurry to decreases the precipitation rate of the cationic particle-containing slurry.

Abstract: A method for object grasping can include: generating a set of keypoints for one or more detected objects in a scene; subdividing the set of keypoints into subsets, each corresponding to a subregion of a detected object; determining a graspability score for the subregion; determining a grasp location for the subregion; selecting a candidate grasp location; and optionally grasping an object using the candidate grasp location.

Abstract: The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 ?m to polish or planarize the substrate.

Abstract: A method for object grasping can include: generating a set of keypoints for one or more detected objects in a scene; subdividing the set of keypoints into subsets, each corresponding to a subregion of a detected object; determining a graspability score for the subregion; determining a grasp location for the subregion; selecting a candidate grasp location; and optionally grasping an object using the candidate grasp location.

Abstract: The method for increasing the accuracy of grasping an object can include: labelling an image based on an attempted object grasp by a robot and generating a trained graspability network using the labelled images. The method can additionally or alternatively include determining a grasp point using the trained graspability network; executing an object grasp at the grasp point S400; and/or any other suitable elements.