Patents by Inventor Nan Rong
Nan Rong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220016765Abstract: A method for object grasping, including: determining features of a scene; determining candidate grasp locations; determining a set of candidate grasp proposals for the candidate grasp locations; optionally modifying a candidate grasp proposal of the set; determining grasp scores associated with the candidate grasp proposals; selecting a set of final grasp proposals based on the grasp scores; and executing a grasp proposal from the set of final grasp proposals.Type: ApplicationFiled: July 14, 2021Publication date: January 20, 2022Inventors: Li Yang Ku, Michael Stark, Ahmad Humayun, Nan Rong, Bhaskara Marthi
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Publication number: 20220016767Abstract: A method for object grasping can include: generating a set of keypoints for one or more detected objects in a scene; subdividing the set of keypoints into subsets, each corresponding to a subregion of a detected object; determining a graspability score for the subregion; determining a grasp location for the subregion; selecting a candidate grasp location; and optionally grasping an object using the candidate grasp location.Type: ApplicationFiled: July 14, 2021Publication date: January 20, 2022Inventors: Li Yang Ku, Nan Rong, Bhaskara Mannar Marthi
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Publication number: 20210187741Abstract: Systems and method for grasp execution using height maps.Type: ApplicationFiled: December 17, 2020Publication date: June 24, 2021Inventors: Bhaskara Mannar Marthi, Nan Rong
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Publication number: 20200384601Abstract: The invention provides a polymer-polymer composite polishing pad comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. A polymeric matrix forms the polishing layer. Fluoropolymer particles are embedded in the polymeric matrix. Wherein diamond abrasive materials cut the fluoropolymer particles and rubbing the cut fluoropolymer against a patterned silicon wafer forms a thin film covering at least a portion of the polishing layer and the thin film has a zeta potential more negative than the polymeric matrix at a pH of 7. The polishing surface formed from rubbing with the wafer has a fluorine concentration at a penetration depth of 1 to 10 nm of at least ten atomic percent higher than the bulk fluorine concentration at a penetration depth of 1 to 10 ?m.Type: ApplicationFiled: June 10, 2019Publication date: December 10, 2020Inventors: Mohammad T. Islam, Nan-Rong Chiou, Matthew R. Gadinski, Youngrae Park, Gregory Scott Blackman, Lei Zhang, George C. Jacob
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Publication number: 20200384602Abstract: The invention provides a method for polishing or planarizing a substrate. First, the method comprises attaching a polymer-polymer composite polishing pad to a polishing device. The polishing pad has a polymer matrix and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a zeta potential more negative than the polymeric matrix. Cationic particle-containing slurry is applied to the polishing pad. Conditioning the polymer-polymer composite polishing pad exposes the fluoropolymer particles to the polishing surface and creates fluoropolymer-containing debris particles in the slurry. Polishing or planarizing the substrate with the increased electronegativity from the fluoropolymer at the polishing surface and in the fluoropolymer-containing debris particles stabilizes the cationic particle-containing slurry to decreases the precipitation rate of the cationic particle-containing slurry.Type: ApplicationFiled: June 10, 2019Publication date: December 10, 2020Inventors: Matthew R. Gadinski, Mohammad T. Islam, Nan-Rong Chiou, Youngrae Park, George C. Jacob
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Publication number: 20200384600Abstract: The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 ?m to polish or planarize the substrate.Type: ApplicationFiled: June 10, 2019Publication date: December 10, 2020Inventors: Mohammad T. Islam, Nan-Rong Chiou, Matthew R. Gadinski, Youngrae Park, Gregory Scott Blackman, Lei Zhang, George C. Jacob
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Publication number: 20200384603Abstract: The invention provides a polymer-polymer composite polishing pad useful for polishing or planarizing a substrate of at least one of semiconductor, optical and magnetic substrates. The polymer-polymer composite polishing pad includes a polishing layer having a polishing surface for polishing or planarizing the substrate; a polymeric matrix forming the polishing layer and including gas-filled or liquid-filled polymeric microelements; and fluoropolymer particles embedded in the polymeric matrix. The fluoropolymer particles have a tensile strength lower than the tensile strength of the polymeric matrix wherein diamond abrasive materials cut the fluoropolymer to form a reduced number of pad debris particles in the 1 ?m to 10 ?m size range.Type: ApplicationFiled: June 10, 2019Publication date: December 10, 2020Inventors: Nan-Rong Chiou, Joseph So, Mohammad T. Islam, Matthew R. Gadinski, Youngrae Park, George C. Jacob
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Patent number: 10391606Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixture of a curative of 4,4?-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4?-methylene-bis-o-(2-chloroaniline) (MbOCA), and a polyisocyanate prepolymer formed from one or two aromatic diisocyanates, such as toluene diisocyanate (TDI), or a mixture of an aromatic diisocyanate and an alicyclic diisocyanate, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG and having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. %. The polyurethane in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 60 to 90, a shear storage modulus (G?) at 65° C.Type: GrantFiled: June 6, 2017Date of Patent: August 27, 2019Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Jonathan G. Weis, Nan-Rong Chiou, George C. Jacob, Bainian Qian
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Patent number: 10293456Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average to molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine or bismuth neodecanoate, all weight percent's based on the total solids weight of the reaction mixture.Type: GrantFiled: March 2, 2018Date of Patent: May 21, 2019Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.Inventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob, Teresa Brugarolas Brufau
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Patent number: 10207388Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine, all weight percent's based on the total solids weight of the reaction mixture.Type: GrantFiled: April 19, 2017Date of Patent: February 19, 2019Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob
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Publication number: 20180345449Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixture of a curative of 4,4?-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4?-methylene-bis-o-(2-chloroaniline) (MbOCA), and a polyisocyanate prepolymer formed from one or two aromatic diisocyanates, such as toluene diisocyanate (TDI), or a mixture of an aromatic diisocyanate and an alicyclic diisocyanate, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG and having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. %. The polyurethane in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 50 to 90, a shear storage modulus (G?) at 65° C.Type: ApplicationFiled: March 19, 2018Publication date: December 6, 2018Inventors: Jonathan G. Weis, Nan-Rong Chiou, George C. Jacob, Bainian Qian
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Publication number: 20180345448Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing three dimensional semiconductor or memory substrates comprising a polishing layer of a polyurethane reaction product of a thermosetting reaction mixture of a curative of 4,4?-methylenebis(3-chloro-2,6-diethylaniline) (MCDEA) or mixtures of MCDEA and 4,4?-methylene-bis-o-(2-chloroaniline) (MbOCA), and a polyisocyanate prepolymer formed from one or two aromatic diisocyanates, such as toluene diisocyanate (TDI), or a mixture of an aromatic diisocyanate and an alicyclic diisocyanate, and a polyol of polytetramethylene ether glycol (PTMEG), polypropylene glycol (PPG), or a polyol blend of PTMEG and PPG and having an unreacted isocyanate (NCO) concentration of from 8.6 to 11 wt. %. The polyurethane in the polishing layer has a Shore D hardness according to ASTM D2240-15 (2015) of from 60 to 90, a shear storage modulus (G?) at 65° C.Type: ApplicationFiled: June 6, 2017Publication date: December 6, 2018Inventors: Jonathan G. Weis, Nan-Rong Chiou, George C. Jacob, Bainian Qian
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Publication number: 20180304439Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average to molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine or bismuth neodecanoate, all weight percent's based on the total solids weight of the reaction mixture.Type: ApplicationFiled: March 2, 2018Publication date: October 25, 2018Inventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob
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Publication number: 20180304438Abstract: The present invention provides a chemical mechanical (CMP) polishing pad for polishing, for example, a semiconductor substrate, having one or more endpoint detection windows (windows) which at a thickness of 2 mm would have a UV cut-off at a wavelength of 325 nm or lower which are the product of a reaction mixture of (A) from 30 to 56 wt. % of one or more cycloaliphatic diisocyanates or polyisocyanates with (B) from 43 to 69.9999 a polyol mixture of (i) a polymeric diol having an average molecular weight of from 500 to 1,500, such as a polycarbonate diol for hard windows and a polyether polyol for soft windows and (ii) a triol having an average molecular weight of from 120 to 320 in a weight ratio of (B)(i) polymeric diol to (B)(ii) triol ranging from 1.6:1 to 5.2:1, and a catalyst, preferably a secondary or tertiary amine, all weight percent's based on the total solids weight of the reaction mixture.Type: ApplicationFiled: April 19, 2017Publication date: October 25, 2018Inventors: Nan-Rong Chiou, Mohammad T. Islam, George C. Jacob
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Patent number: 10100300Abstract: A simple and low cost method of producing sealed arrays of laterally ordered nanochannels interconnected to microchannels of tunable size, over large surface areas, is disclosed. The method incorporates DNA combing and subsequent imprinting. Associated micro and macroscale inlets and outlets can be formed in the same process or manufactured later in low cost, non-cleanroom techniques. The techniques embrace two procedures, generating DNA nanostrands and translating these strands into nanoscale constructs via imprinting. Devices incorporating the novel arrays have a first microchannel, a second microchannel and a nanochannel that is substantially linear and which defines an axis. The nanochannel is connected at its open ends to the microchannels, which are aligned along the axis. Methods for precise dose delivery of agents into cells employing the devices in nanoelectroporation methods are also disclosed.Type: GrantFiled: November 10, 2017Date of Patent: October 16, 2018Inventors: Ly James Lee, Pouyan E. Boukany, Jingjiao Guan, Nan-Rong Chiou
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Patent number: 10086494Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a polyol blend of polypropylene glycol (PPG) and polytetramethylene ether glycol (PTMEG) and containing a hydrophilic portion of polyethylene glycol or ethylene oxide repeat units, a toluene diisocyanate, and one or more isocyanate extenders, wherein the polyurethane reaction product exhibits a wet Shore D hardness of from 10 to 20% less than the Shore D hardness of the dry polyurethane reaction product.Type: GrantFiled: September 13, 2016Date of Patent: October 2, 2018Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Jonathan G. Weis, George C. Jacob, Bhawesh Kumar, Sarah E. Mastroianni, Wenjun Xu, Nan-Rong Chiou, Mohammad T. Islam
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Publication number: 20180127739Abstract: A simple and low cost method of producing sealed arrays of laterally ordered nanochannels interconnected to microchannels of tunable size, over large surface areas, is disclosed. The method incorporates DNA combing and subsequent imprinting. Associated micro and macroscale inlets and outlets can be formed in the same process or manufactured later in low cost, non-cleanroom techniques. The techniques embrace two procedures, generating DNA nanostrands and translating these strands into nanoscale constructs via imprinting. Devices incorporating the novel arrays have a first microchannel, a second microchannel and a nanochannel that is substantially linear and which defines an axis. The nanochannel is connected at its open ends to the microchannels, which are aligned along the axis. Methods for precise dose delivery of agents into cells employing the devices in nanoelectroporation methods are also disclosed.Type: ApplicationFiled: November 10, 2017Publication date: May 10, 2018Inventors: Ly James Lee, Pouyan E. Boukany, Jingjiao Guan, Nan-Rong Chiou
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Publication number: 20180071888Abstract: A chemical mechanical polishing pad for polishing a semiconductor substrate is provided containing a polishing layer that comprises a polyurethane reaction product of a reaction mixture comprising a curative and a polyisocyanate prepolymer having an unreacted isocyanate (NCO) concentration of from 8.3 to 9.8 wt. % and formed from a polyol blend of polypropylene glycol (PPG) and polytetramethylene ether glycol (PTMEG) and containing a hydrophilic portion of polyethylene glycol or ethylene oxide repeat units, a toluene diisocyanate, and one or more isocyanate extenders, wherein the polyurethane reaction product exhibits a wet Shore D hardness of from 10 to 20% less than the Shore D hardness of the dry polyurethane reaction product.Type: ApplicationFiled: September 13, 2016Publication date: March 15, 2018Inventors: Jonathan G. Weis, George C. Jacob, Bhawesh Kumar, Sarah E. Mastroianni, Wenjun Xu, Nan-Rong Chiou, Mohammad T. Islam
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Patent number: 9816086Abstract: A simple and low cost method of producing sealed arrays of laterally ordered nanochannels interconnected to microchannels of tunable size, over large surface areas, is disclosed. The method incorporates DNA combing and subsequent imprinting. Associated micro and macroscale inlets and outlets can be formed in the same process or manufactured later in low cost, non-cleanroom techniques. The techniques embrace two procedures, generating DNA nanostrands and translating these strands into nanoscale constructs via imprinting. Devices incorporating the novel arrays have a first microchannel, a second microchannel and a nanochannel that is substantially linear and which defines an axis. The nanochannel is connected at its open ends to the microchannels, which are aligned along the axis. Methods for precise dose delivery of agents into cells employing the devices in nanoelectroporation methods are also disclosed.Type: GrantFiled: May 20, 2014Date of Patent: November 14, 2017Inventors: Ly James Lee, Pouyan E. Boukany, Jingjiao Guan, Nan-Rong Chiou
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Publication number: 20150307710Abstract: Embodiments of the present disclosure include a hardener compound for curing with an epoxy resin, where the hardener compound includes a copolymer having a first constitutional unit of the formula (I), a second constitutional unit of the formula (II), and a third constitutional unit of the formula (III), where each q, n and m is independently a positive integer; each b is independently selected from the group of 6, 8, 10 and 12; each Y is independently an organic group; and each R is independently selected from the group of a hydrogen, an organic group and a halogen. Embodiments of the present disclosure include an epoxy system that includes the hardener compound and an epoxy resin.Type: ApplicationFiled: December 12, 2012Publication date: October 29, 2015Applicant: Dow Global Technologies LLCInventors: Michael J. Mullins, Chao Zhang, Jia wen Xiong, Hongyu Chen, Michael D. Read, Nan-Rong Chiou