Abstract: Reworkable thermally conductive adhesive composition including a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

Abstract: A Negative Thermal Expansion system (NTEs) device for TCE compensation or CTE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging. One aspect of the present invention provides a method for fabricating micromachine devices that have negative thermal expansion coefficients that can be made into a composite for manipulation of the TCE of the material. These devices and composites made with these devices are in the categories of materials called “smart materials” or “responsive materials.” Another aspect of the present invention provides microdevices comprised of dual opposed bilayers of material where the two bilayers are attached to one another at the peripheral edges only, and where the bilayers themselves are at a minimum stress conditions at a reference temperature defined by the temperature at which the bilayers are formed.

Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

Abstract: Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.

Abstract: Methods for fabricating microelectronic interconnection structures as well as the structures formed by the methods are disclosed which improve the manufacturing throughput for assembling flip chip semiconductor devices. The use of a bilayer of polymeric materials applied on the wafer prior to dicing eliminates the need for dispensing and curing underfill for each semiconductor at the package level, thereby improving manufacturing throughput and reducing cost.

Abstract: Strippable photoimageable compositions are provided that include a cycloaliphatic diepoxide and a photoactive compound. The compositions are especially useful for patterning a substrate.

Abstract: Reworkable encapsulant formulations are being developed to allow recovery of part-good microelectronic assemblies. According to this invention, a gelled form of the solvent is useful for removing the reworkable encapsulant from a specific region of the assemblies without affecting components on the assembly which do not need to be reworked. This novel method eliminates expensive tooling that would otherwise be required to handle the solvent.

Abstract: An inkjet printer head formed from a photoimageable organic material. This material provides for a spin-on epoxy based photoresist with image resolution and adhesion to hard to bond to metals such as gold or tantalum/gold surfaces that are commonly found in such printer applications. When cured, the material provides a permanent photoimageably defined pattern in thick films (>30) that has chemical (i.e high pH inks) and thermal resistance.

Abstract: Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.

Abstract: Application of a high temperature resistant film forming polymer has previously proved successful in stabilizing photoresist image layers, particularly those used for high resolution geometries in microelectronic applications, against distortion or degradation by the heat generated during subsequent etching, ion implantation processes and the like. It has been found that, when the thickness of the photoresist image layer exceeds about 1 micron, the coating of the film forming polymer tends to distort and/or cause cracks, breaks and the like in the photoresist resulting in loss of the required geometry in the image. In accordance with the invention this problem can be overcome by applying the film forming polymer in the form of an ultrasonically atomized spray under controlled conditions.