Abstract: A fixing member manufacturing method includes: a step of forming a laser-irradiated region by irradiating a surface of an elastic material with laser light of 120 nm or more and 10600 nm or less in oscillation wavelength; a step of applying an adhesive onto the elastic material on which the laser-irradiated region is formed; a step of coating the elastic material, after the applying step, with a resin tube and then elongating the resin tube on the elastic material in a longitudinal direction; a step of locally fixing the elastic material and the resin tube while maintaining the elongation of the resin tube in the longitudinal direction by heating the laser-irradiated region from above the resin tube; and a step of fixing a whole of the resin tube to the elastic material by curing the adhesive.

Abstract: A fixing member manufacturing method includes: a step of coating an outer peripheral surface of an elastic material with an adhesive; a step of externally fitting a resin tube around the elastic material coated with the adhesive; a step of temporarily fixing the resin tube onto the elastic material by heating the resin tube at a longitudinal end portion; a step of temporarily fixing the resin tube onto the elastic material by heating the resin tube at the other longitudinal end portion except for a circumferential part of the resin tube; a step of squeezing out an excessive adhesive from between the elastic material and the resin tube, in a direction from the longitudinal end portion to the other longitudinal end portion of the resin tube; and a step of fixing the resin tube onto the elastic material by heating the adhesive.

Abstract: A fixing member manufacturing method includes: a first step of externally fitting a resin tube around an elastic material; and a second step of squeezing an excessive adhesive between the elastic material and the resin tube. The second step includes: a step of externally fitting, around the resin tube in a longitudinal end side, a ring member having an inner diameter larger than an outer diameter of the resin tube externally fitted around the elastic material; and a step of moving the ring member from the longitudinal end side toward another longitudinal end side of the resin tube while bringing the ring member into contact with an outer peripheral surface of the resin tube by air pressure.

Abstract: A storage unit stores load information indicating the load of an information processing apparatus by applying each of a plurality of update programs to each virtual machine. An operation unit obtains the load information from the storage unit, and determines, for each virtual machine, an order of applying the plurality update programs to the virtual machine within a predetermined time period on the basis of the load information and an upper load limit allowable for the information processing apparatus.

Abstract: An endless belt for fixing includes a base layer made of nickel, wherein the base layer includes a first layer, a second layer, and a third layer provided between the first layer and the second layer, and a toner parting layer provided on the base layer, wherein a content rate of an element for enhancing hardness in the first layer and the second layer is lower than that in the third layer.

Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Abstract: A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.

Abstract: A mounting method of mounting an element on a substrate, includes a first hydrophilization process of hydrophilizing a region on a surface of the substrate where the element is to be joined; a second hydrophilization process of hydrophilizing the surface of the element; a mounting process of mounting the element on a mounting part such that the hydrophilized surface of the element faces upwards; a coating process of coating a liquid on the hydrophilized surface of the element; and an arrangement process of arranging the substrate above the mounting part such that the region on the surface of the substrate where the element is to be joined faces downwards. The method further includes a contact process of bringing the substrate arranged above the mounting part close to the mounting part on which the element is mounted to bring the liquid into contact with the surface of the substrate.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Abstract: A bonding apparatus for bonding substrates having metal bonding portions, includes: a processing container having an opening formed on the bottom of the processing container; a thermal treating plate disposed within the processing container, the thermal treating plate allowing for substrates to be mounted thereon and allowing for thermal treatment of the substrates; a pressing mechanism disposed within the processing container opposite the thermal treating plate and which presses the substrates to the thermal treating plate; an annular supporter which is disposed in an inner side of the processing container along the opening of the processing container, the annular supporter providing an airtight seal between the processing container and the thermal treating plate, and supporting the thermal treating plate; and a cooling mechanism which is disposed in an inner side of the supporter below the thermal treating plate, the cooling mechanism cooling the thermal treating plate.

Abstract: A bonding apparatus includes a thermal treating unit and a bonding unit that are integrally bonded together. The thermal treating unit includes a first thermal treating plate for supporting and thermally processing a superimposed substrate. The bonding unit includes a second thermal treating plate for supporting and thermally processing the superimposed substrate processed in thermal treating unit, and a pressing mechanism for pressing the superimposed substrate against the second thermal treating plate. The first thermal treating plate includes a cooling mechanism for cooling the superimposed substrate placed on the first heating plate. Each unit can depressurize the internal atmosphere to a specified degree of vacuum. The thermal treating unit has a plurality of carrying mechanisms for conveying the wafers between the two units.

Abstract: An agent for preserving freshness of cut flowers, which contains, as an active ingredient, at least one water-soluble polymer selected from the group consisting of:i) a polycondensation product obtained by a reaction of (a) at least one compound selected from the group consisting of an epihalohydrin, an alkylene dihalide, a diepoxide and a dihalogenoalkyl ether, with (b) at least one compound selected from the group consisting of an amine, a diamine and a polyamine,ii) an alkyleneimine polymer, andiii) a mixture of the polymers i) and ii).

Abstract: Inner olefines are prepared by using 1-olefines having 6 to 34 carbon atoms as a starting material and isomerizing them at temperatures ranging from 130.degree. to 270.degree. C. in the presence of mordenite type zeolites. Optionally, unreacted 1-olefines can be separated and reused as a starting material.

Abstract: A tachogenerator has a magnetoresistance film coil formed on a stator surface along a circular path concentric with a rotor axis. The coil has a spatially periodic structure, with multiple spaced-apart lateral components series connected with longitudinal components. The stator surface is opposite to a rotor surface having multiple equiangularly spaced magnetic pole faces with alternately opposite polarities. Current passed through the coil develops voltage variations. Undesirable small voltage variations resulting from manufacturing tolerances are averaged to zero at the coil output terminals.

Abstract: A coil assembly comprises a plurality of conductive spiral pattern layers which are piled up via (an) insulating layer(s) on a wafer. The electrical connection between the spiral patterns is established by means of a conductive member, which is a portion of the upper spiral pattern layer, filled in a through-hole which is made in the insulating layer so that the spiral patterns are connected in series to develop a high voltage when the coil assembly is moved in a magnetic field.