Patents by Inventor Naoki Kato

Naoki Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210092331
    Abstract: A vehicle inspection device includes a camera mounted to a power folding side-view mirror provided to a vehicle, the camera being configured to switch between an exterior image capture state in which an exterior of the vehicle is within an image capture range and an interior image capture state in which an interior of the vehicle is within the image capture range, while the side-view mirror performs an opening/closing operation between a completely open state and a closed state, and a vehicle processor that executes a vehicle image capture process of capturing an image of the exterior of the vehicle by the camera when the camera has entered the exterior image capture state due to an operation of the side-view mirror, and capturing an image of the interior of the vehicle by the camera when the camera has entered the interior image capture state due to an operation of the side-view mirror.
    Type: Application
    Filed: September 17, 2020
    Publication date: March 25, 2021
    Inventors: Akira Terauchi, Naoki Kato, Kayoko Fukasawa, Hiroyuki Tomosugi, Takahiro Iijima
  • Publication number: 20210041128
    Abstract: When a state in which a driving voltage of a pump is set to an upper limit voltage and an opening degree of at least one of a plurality of flow rate control valves is set to a maximum opening degree continues for a first determination time period, an operation frequency of a compressor is raised at a first time so as to increase an amount of heat exchange by a second heat exchanger. When an operation stop request is input, or an indoor temperature reaches a set temperature, in at least one of a plurality of third heat exchangers after the first time, the operation frequency of the compressor is lowered or the driving voltage of the pump is lowered.
    Type: Application
    Filed: April 4, 2018
    Publication date: February 11, 2021
    Inventors: Naoki KATO, Yuji MOTOMURA, Naofumi TAKENAKA, Kimitaka KADOWAKI
  • Publication number: 20210041130
    Abstract: An air conditioning apparatus has a first mode and a second mode as operation modes. In the first mode, a degree of opening of a first flow rate adjustment valve is fixed to a first degree of opening smaller than 100% and greater than 0%, and an operation frequency of a compressor is varied in accordance with air conditioning performance required of a third heat exchanger. In the second mode, the degree of opening of the first flow rate adjustment valve is varied in accordance with air conditioning performance required of the third heat exchanger. When a difference between the air conditioning performance required of the third heat exchanger and air conditioning performance offered by the third heat exchanger becomes greater than a determination value, the operation mode is changed from the first mode to the second mode.
    Type: Application
    Filed: April 4, 2018
    Publication date: February 11, 2021
    Inventors: Naoki KATO, Yuji MOTOMURA, Naofumi TAKENAKA, Kimitaka KADOWAKI
  • Patent number: 10850706
    Abstract: A control system for a vehicle used by a plurality of users determines, in response to a request for unlocking vehicle doors, whether to permit vehicle door unlocking depending on whether or not another booked usage time range is registered after one booked usage time range in which a usage end procedure has been performed, or whether vehicle door unlocking that does not use an electronic key for the one booked usage time range was performed during the time from the end of the usage end procedure to the current time.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: December 1, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shigenori Hiruta, Naoki Kato, Yuji Saito, Hiroyuki Hayashi
  • Patent number: 10770400
    Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: September 8, 2020
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Naoki Kato, Shogo Mori, Harumitsu Sato, Hiroki Watanabe, Hiroshi Yuguchi, Yuri Otobe
  • Patent number: 10710290
    Abstract: A mold platen includes a mold plate to which a mold is attached, a rear-surface plate provided opposite to the mold plate, coupling portions configured to be coupled to respective tie rods at four corners of the mold plate and the rear-surface plate, a cylindrical rib that is provided between the mold plate and the rear-surface plate and is located at a center part of the mold plate and the rear-surface plate, a diagonal reinforcing rib that is provided between the mold plate and the rear-surface plate and is configured to connect the cylindrical rib and each of the coupling portions, and a longitudinal/lateral reinforcing rib that is provided between the mold plate and the rear-surface plate and extends from the cylindrical rib along a position between the adjacent coupling portions.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: July 14, 2020
    Assignee: U-MHI PLATECH CO., LTD.
    Inventor: Naoki Kato
  • Publication number: 20200189161
    Abstract: A mold platen includes a mold plate to which a mold is attached, a rear-surface plate provided opposite to the mold plate, coupling portions configured to be coupled to respective tie rods at four corners of the mold plate and the rear-surface plate, a cylindrical rib that is provided between the mold plate and the rear-surface plate and is located at a center part of the mold plate and the rear-surface plate, a diagonal reinforcing rib that is provided between the mold plate and the rear-surface plate and is configured to connect the cylindrical rib and each of the coupling portions, and a longitudinal/lateral reinforcing rib that is provided between the mold plate and the rear-surface plate and extends from the cylindrical rib along a position between the adjacent coupling portions.
    Type: Application
    Filed: October 6, 2017
    Publication date: June 18, 2020
    Inventor: Naoki KATO
  • Patent number: 10677844
    Abstract: A logic BIST circuits concurrently execute a first scan test for a scan chain as a target and a second scan test for a scan chain as a target, when they are set to a an LBIST mode, and execute the first scan test without executing the second scan test, when they are set to a simultaneous test mode. Memory BIST circuits execute a test for memory circuits concurrently with the first scan test, when they are set to the simultaneous test mode.
    Type: Grant
    Filed: April 17, 2018
    Date of Patent: June 9, 2020
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Iwao Suzuki, Naoki Kato
  • Publication number: 20200094779
    Abstract: A control system for a vehicle used by a plurality of users determines, in response to a request for unlocking vehicle doors, whether to permit vehicle door unlocking depending on whether or not another booked usage time range is registered after one booked usage time range in which a usage end procedure has been performed, or whether vehicle door unlocking that does not use an electronic key for the one booked usage time range was performed during the time from the end of the usage end procedure to the current time.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 26, 2020
    Inventors: Shigenori Hiruta, Naoki Kato, Yuji Saito, Hiroyuki Hayashi
  • Publication number: 20200097863
    Abstract: A vehicle management system that manages a vehicle that is to be used by a plurality of users generates schedule information based on an action schedule of the next user following the current user, and outputs to the next user a suggestion of changing a return location where the current user terminates the use of the vehicle based on the generated schedule information of the next user.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 26, 2020
    Inventors: Shigenori Hiruta, Naoki Kato, Yuji Saito, Hiroyuki Hayashi
  • Publication number: 20200060269
    Abstract: A plant stress tolerance-inducing agent is provided that contains, as an active ingredient, a compound having a specific quinone skeleton. Alternatively, a plant stress tolerance-inducing agent is provided that contains, as an active ingredient, at least one compound selected from the group consisting of 1,4-naphthoquinone, 5-hydroxy-1,4-naphthoquinone, 5,8-dihydroxy-1,4-naphthoquinone, 2-hydroxy-1,4-naphthoquinone, 5-hydroxy-2-methyl-1,4-naphthoquinone, 2,3-dichloro-1,4-naphthoquinone, 2,3-dichloro-5,8-dihydroxy-1,4-naphthoquinone, 2,3-dichloro-5-nitro-1,4-naphthoquinone, 2,3-dichloro-6-nitro-1,4-naphthoquinone, 2-methoxy-1,4-naphthoquinone, 2-amino-3-chloro-1,4-naphthoquinone, a shikonin compound, and an alkannin compound.
    Type: Application
    Filed: February 9, 2018
    Publication date: February 27, 2020
    Inventors: Toshimasa Sugie, Naoki Kato, Masakazu Hara
  • Patent number: 10525623
    Abstract: Provided is a mold opening/closing device that can prevent a ball screw shaft from reaching a risky speed while using a ball screw having a cantilever supporting structure. A mold clamping device according to the present invention is provided with: a ball screw having a ball screw shaft and a ball screw nut that meshes with the ball screw shaft; and a motor that drives the ball screw. One end of the ball screw shaft is supported by a fixation plate or a movable plate so as to be rotatable or non-rotatable, while being restricted in movement in an axial direction and thereby serving as a fixed end, and the other end thereof serves as a free end. Further, the mold clamping device is characterized in that a distance between the ball screw nut and the fixed end is shorter than a distance between the fixed plate and the movable plate.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: January 7, 2020
    Assignee: U-MHI PLATECH CO., LTD.
    Inventors: Shinichi Takahashi, Naoki Kato, Toshihiko Kariya
  • Patent number: 10482579
    Abstract: Provided is an image processing apparatus, which is configured to perform smoothing processing on a mapping image obtained by detecting a signal emitted from one of a plurality of analysis areas of a specimen. The image processing apparatus includes: a memory; and a processor configured to execute a program stored in the memory to perform: processing for calculating a difference between a maximum value and a minimum value of signal intensity data being intensity information on the signal of one of pixels within the mapping image, and determining a degree of smoothing to be used for the smoothing processing based on the difference; and processing for performing the smoothing processing based on the determined degree of smoothing.
    Type: Grant
    Filed: August 10, 2017
    Date of Patent: November 19, 2019
    Assignee: JEOL Ltd.
    Inventors: Norihisa Mori, Naoki Kato
  • Publication number: 20190172788
    Abstract: A semiconductor module includes a substrate, two bare chips (semiconductor elements) mounted on the substrate, and a case fixed to the substrate. A conductor pattern and five signal patterns are provided for each bare chip on an upper surface of an insulating substrate. Signal electrodes and the signal patterns of the bare chips are connected to by conductive plates. An insulating member is provided on connecting portions of the conductive plates.
    Type: Application
    Filed: May 12, 2017
    Publication date: June 6, 2019
    Applicant: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Naoki KATO, Shogo MORI, Harumitsu SATO, Hiroki WATANABE, Hiroshi YUGUCHI, Yuri OTOBE
  • Publication number: 20190160721
    Abstract: Provided is a half nut opening/closing device that makes it possible to easily secure engagement between a tie rod and a half nut even if the tie rod to be engaged is bent. The half nut opening/closing device according to the present invention includes a half nut including a half nut piece and a half nut piece that are moved between a closed position and an open position and engage with a tie rod at the closed position, and an alignment roller that is provided on one or both of the half nut piece and the half nut piece, and is configured to convert moving force, of that the half nut piece and the half nut piece move to the closed position, into upward force in a vertical direction to lift and align the tie rod.
    Type: Application
    Filed: September 26, 2017
    Publication date: May 30, 2019
    Inventors: Hiroaki KYUNO, Kazunori KUGA, Isao HASHIMOTO, Toshihiko KARIYA, Naoki KATO
  • Publication number: 20190119599
    Abstract: A lubricating oil for press working contains a base oil and a fat or oil-containing additive and a calcium-containing additive added to the base oil. The proportion of the fat or oil-containing additive with respect to the whole volume of the lubricating oil for press working is 10 to 30%. The proportion of the calcium-containing additive with respect to the whole volume of the lubricating oil for press working is 5 to 15%.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 25, 2019
    Applicant: TOYOTA BOSHOKU KABUSHIKI KAISHA
    Inventors: Ryota SASAKI, Kazuyuki HIRATA, Naoki KATO
  • Publication number: 20180313894
    Abstract: A logic BIST circuits concurrently execute a first scan test for a scan chain as a target and a second scan test for a scan chain as a target, when they are set to an LBIST mode, and execute the first scan test without executing the second scan test, when they are set to a simultaneous test mode. Memory BIST circuits execute a test for memory circuits concurrently with the first scan test, when they are set to the simultaneous test mode. Logic BIST circuits complete a test with the LBIST mode, at a stage where the second scan test has completed.
    Type: Application
    Filed: April 17, 2018
    Publication date: November 1, 2018
    Inventors: Iwao SUZUKI, Naoki KATO
  • Patent number: 10085368
    Abstract: An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: September 25, 2018
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Shogo Mori, Naoki Kato, Hiroshi Yuguchi, Yoshitaka Iwata, Masahiko Kawabe, Yuri Otobe
  • Patent number: 10047448
    Abstract: A tin-plated copper alloy terminal material in which an Sn-based surface layer is formed on a surface of a base material that is made of copper or a copper alloy, and a Cu—Sn alloy layer and an Ni layer or an Ni alloy layer are sequentially formed between the Sn-based surface layer and the base material from the Sn-based surface layer side: the Cu—Sn alloy layer is a layer that is formed only of an intermetallic compound alloy which is obtained by substituting some of Cu in Cu6Sn5 alloy with Ni; and parts of the Cu—Sn alloy layer are exposed from the Sn-based surface layer, thereby forming a plurality of exposed portions; an average thickness of the Sn-based surface layer is from 0.2 ?m to 0.6 ?m (inclusive); and an area rate of the exposed portions of the Cu—Sn alloy layer relative to a surface area of is 1% to 40% (inclusive).
    Type: Grant
    Filed: August 18, 2015
    Date of Patent: August 14, 2018
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Naoki Kato, Yuki Inoue, Kiyotaka Nakaya
  • Patent number: 10049978
    Abstract: A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: August 14, 2018
    Assignee: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Naoki Kato, Shogo Mori, Harumitsu Sato, Hiroki Watanabe, Hiroshi Yuguchi, Koji Nishimura