Abstract: A cooling device includes a base and a plurality of radiator fins. The base includes an exterior, an interior, an inlet, and an outlet. A heat generation element is connected to the exterior of the base. The radiator fins are located near the heat generation element in the interior of the base. The radiator fins are arranged from the inlet to the outlet. Each radiator fin has a sidewise cross-section with a dimension in a flow direction of the cooling medium and a dimension in a lateral direction orthogonal to the flow direction of the cooling medium. The dimension in the flow direction is longer than the dimension in the lateral direction. The radiator fins are separated from one another by a predetermined distance in the lateral direction.

Abstract: A cooling device to which a heating element is joinable includes a base, a plurality of first groups of pin fins and a plurality of second groups of pin fins. The second groups and the first groups are arranged alternately in a flow direction in which a cooling medium flows through a passage of the base. A second outermost pin fin of each second group is more distant from a side surface of the base than a first outermost pin fin of each first group. Width between a side surface of the second outermost pin fin of each second group and the side surface of the base is the same as or larger than width between a side surface of the pin fin of each first group that is adjacent to the first outermost pin fin of the first group and the side surface of the second outermost pin fin.

Abstract: A semiconductor unit includes a base, an insulating substrate bonded to the base, a conductive plate made of a metal of poor solderability, a semiconductor device mounted to the insulating substrate through the conductive plate, and a metal plate interposed between the conductive plate and the semiconductor device and made of a metal of good solderability as compared to the metal used for the conductive plate. The base, the insulating substrate, the conductive plate and the metal plate are brazed together, and the semiconductor device is soldered to the metal plate.

Abstract: An in-vehicle camera apparatus having improved object visibility of a shaded area in a photographed image includes a shaded area calculation section for calculating a shaded area of interest in a photographed image based on luminance characteristics data of a generated photographed image, a luminance increase amount calculation section for calculating a luminance increase amount for the shaded area of interest, a luminance adjustment section for increasing the luminance of the photographed image based on the luminance increase amount, and a photographed image output section for outputting a luminance-adjusted photographed image adjusted by the luminance adjustment section to an in-vehicle image processing section.

Abstract: A semiconductor unit includes an insulation layer, a conductive layer bonded to one side of the insulation layer, a semiconductor device mounted on the conductive layer, a cooler thermally coupled to the other side of the insulation layer, a first bus bar having a bonding surface bonded to the semiconductor device or the conductive layer and a non-bonding surface that is the part of the first bus bar other than the bonding surface, and a second bus bar having a bonding surface bonded to the semiconductor device or the conductive layer and a non-bonding surface that is the part of the second bus bar other than the bonding surface. The second bus bar has a greater ratio of the area of the bonding surface to the area of the non-bonding surface than the first bus bar. The second bus bar has a lower electric resistance than the first bus bar.

Abstract: A semiconductor unit includes a base having a surface where a first insulation layer is disposed, a second insulation layer spaced apart from the first insulation layer to form a region therebetween and disposed parallel to the surface of the base where the first insulation layer is disposed, a single conductive layer disposed across the first insulation layer and the second insulation layer, and a semiconductor device bonded to the conductive layer.

Abstract: A semiconductor unit includes a first conductive layer, a second conductive layer electrically insulated from the first conductive layer, a first semiconductor device mounted on the first conductive layer, a second semiconductor device mounted on the second conductive layer, a first bus bar for electrical connection of the second semiconductor device to the first conductive layer, and a second bus bar for electrical connection of the first semiconductor device to one of the positive and negative terminals of a battery. The first bus bar is disposed in overlapping relation to the second bus bar in such a manner that mold resin fills between the first bus bar and the second bus bar.

Abstract: Tin-plated copper-alloy material for terminal in which: a CuSn alloy layer/a NiSn alloy layer/a Ni or Ni alloy layer are formed between a Sn-based surface layer and a substrate made of Cu or Cu alloy; the CuSn alloy layer is a compound-alloy layer containing Cu6Sn5 as a major proportion and a part of Cu in the Cu6Sn5 is displaced by Ni; the NiSn alloy layer is a compound-alloy layer containing Ni3Sn4 as a major proportion and a part of Ni in the Ni3Sn4 is displaced by Cu; an average interval S of point peaks of the CuSn alloy layer is not less than 0.8 ?m and not more than 2.0 ?m; an average thickness of the Sn-based surface layer is not less than 0.2 ?m and not more than 0.6 ?m; an exposed-area rate of the CuSn alloy layer exposed at a surface of the Sn-based surface layer is not less than 1% and not more than 40%; an average of equivalent-circle diameter of the exposed portions of the CuSn alloy layer exposed at the surface of the Sn-based surface layer is not less than 0.1 ?m and not more than 1.

Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a, current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.

Abstract: A semiconductor unit includes a cooler having a fluid flow space, an insulating substrate bonded to the cooler through a metal, a semiconductor device soldered to the insulating substrate, an intermediate member interposed between the insulating substrate and the fluid flow space and having a first surface where the insulating substrate is mounted, and a mold resin having a lower coefficient of liner expansion than the intermediate member. The insulating substrate, the semiconductor device and the cooler are molded by the mold resin. The intermediate member has a second surface that extends upward or downward relative to the first surface. The first surface is covered by the mold resin. The second surface is covered by a resin cover.

Abstract: It is an object to prevent dies from interfering with each other when the dies are closed and effectively prevent overshoot of cavity temperature while efficiently performing heating of the dies. In an injection molding machine for two-material molding including two sets of a first injecting unit and a second injecting unit that respectively plasticize different resin materials and inject and fill the resin materials, prior to performing injection molding on the first injecting unit side on a secondary side, after injection molding on the second injecting unit side on a primary side, heating of the dies is started before 180-degree rotation of a rotary die plate is completed. After the start of heating, until the 180-degree rotation of the rotary die plate is completed, i.e., die closing is performed, die temperatures are maintained within a temperature range set higher than die temperatures during the heating start and lower than die temperatures during injection.

Abstract: Breakage of the actuator moving the movable platen in the clamping device of an injection moulder is prevented. The clamping device includes a movable platen shifting device increasing and decreasing a horizontal distance between the movable platen (3) and the fixed platen (2). It includes an actuator (41), a clevis pin connecting the actuator (41) and the movable platen (3), a clevis pin holding part holding a central axis of the clevis pin perpendicular to a moving direction of the movable platen (3), and a clevis pin connecting part that connects the actuator (41) and the clevis in. The clevis pin connecting part is a supporting structure rotating with the clevis pin. The clevis pin connecting part is supported by the movable platen (3). The clevis pin, the clevis pin connecting part, and the front end of the actuator are aligned in a straight line.

Abstract: Provided are a highly pure copper anode for electrolytic copper plating, a method for manufacturing the same, and an electrolytic copper plating method using the highly pure copper anode. The highly pure copper anode obtains a crystal grain boundary structure having a special grain boundary ratio L?N/LN of 0.35 or more. LN is a unit total special grain boundary length. L?N is a unit total special boundary length. By having the configuration described above, plating defect can be reduced by suppressing the occurrence of the particles, such as the slime or the like, which are generated on the anode side in the plating bath.

Abstract: An aqueous dispersion-type acrylic pressure-sensitive adhesive composition includes acrylic copolymer emulsion particles dispersed in an aqueous medium. The acrylic copolymer emulsion particles has a ratio (ANIN)/(ANSUR) of 1 or more, wherein (ANIN) is an amount of acid groups in the acrylic copolymer emulsion particles, and (ANSUR) is an amount of acid groups on the surfaces of the acrylic copolymer emulsion particles, (ANIN) and (ANSUR) being calculated from a titration curve of potentiometric titration performed by adding an inorganic base solution to an acidic sample dispersion solution containing the acrylic copolymer emulsion particles dispersed in ion exchange water. A pressure-sensitive adhesive tape which strongly adheres to an adherend and has excellent removability can be formed using the aqueous dispersion-type acrylic pressure-sensitive adhesive composition.

Abstract: In a mold clamping device including a fixed platen, a movable platen, a plurality of tie bars, and mold clamping half nuts, a pair of additional half members which is restricted in the axial direction of the tie bar and moves in an opening/closing direction of the half nuts relative to the mold clamping half nuts is further provided, and when the mold clamping half nuts are closed and mated with the screw or the ring groove of the tie bar, the additional half members are closed to hold the tie bar so that play at mated parts is removed or cancelled by fixation.

Abstract: An automatic transmission includes: a differential mechanism which includes a ring gear; a case which forms a differential chamber that houses the differential mechanism; and an oil pan which is fitted to the case, and which stores oil. The differential chamber includes a first space in which the oil supplied from the oil pan is gathered, and a second space which is formed on the opposite side of the first space with respect to the ring gear in the direction in which the rotational axis of the ring gear extends, and which is communicated with a space inside the oil pan. An oil passage, through which the oil is introduced from the first space to the second space, is formed in the case. The oil passage is formed in a bottom portion of the differential chamber.

Abstract: In an embodiment of the present invention, a piston apparatus of an automatic transmission includes a piston member capable of moving in the axial direction of the rotation shaft, and a hydraulic chamber, and has been configured so that the piston member moves in the axial direction due to pressure in the hydraulic chamber. The piston member includes a cylinder part that extends in the axial direction and to which pressure in the hydraulic chamber is transmitted, a pressing part that extends in the radial direction and presses against a friction engaging element of the automatic transmission, and a connecting part that connects the cylinder part and the pressing part and, with respect to the axial direction, is offset from the pressing part in a direction of separation from the friction engaging element. Also, the axial direction offset amount of the connecting part from the pressing part of the piston member has been set larger than the stroke amount of the piston member.

Abstract: An automatic transmission including a first clutch selectively connecting a first rotary member and a second rotary member disposed coaxially with the first rotary member, a second clutch selectively connecting the first rotary member and a third rotary member disposed coaxially with the first rotary member, a first drum in which a first piston of the first clutch is axially slidably received, a second drum disposed coaxially with the first drum, to accommodate the first drum, and in which a second piston of the second clutch is axially slidably received, an abutting portion abutting contact of the first and second drums with each other in an axial direction of the first and second drums, and a fitting portion at which the first drum is fitted in the second drum and that inhibits relative rotation of the first and second drums about a common axis of the first and second drums.