Patents by Inventor Naoki Kumura

Naoki Kumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties
    Publication number: 20060202296
    Abstract: A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.
    Type: Application
    Filed: May 10, 2006
    Publication date: September 14, 2006
    Applicant: ROHM CO., LTD.
    Inventors: Shinji Yano, Naoki Kumura, Tetsuya Yamasaki
  • Encapsulated light receiving and processing semiconductor module with enhanced shielding and grounding properties
    Patent number: 7071523
    Abstract: A semiconductor module that includes a resin package having a first surface and a second surface which is different from the first surface. A lead includes an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package. A semiconductor element is mounted to the inner portion of the lead and is covered by the resin package. A conductive film, provided separately from the lead, covers at least the second surface of the resin package, with the conductive film provided with a connecting portion held in contact with the outer portion of the lead at the first surface of the resin package. The inner portion of the lead includes an extension extending toward the second surface of the resin package the extension being held in contact with the conductive film at the second surface of the resin package.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: July 4, 2006
    Assignee: Rohm Co., Ltd.
    Inventors: Shinji Yano, Naoki Kumura, Tetsuya Yamasaki
  • Semiconductor module
    Publication number: 20050073018
    Abstract: A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.
    Type: Application
    Filed: July 27, 2004
    Publication date: April 7, 2005
    Applicant: ROHM CO., LTD.
    Inventors: Shinji Yano, Naoki Kumura, Tetsuya Yamasaki