Abstract: A gas separation membrane includes a first layer and a second layer that is provided at the surface on one side of the first layer and that includes a compound having gas separation ability. The average thickness of the second layer is smaller than an average thickness of the first layer. The second layer is an inkjet coating. The compound preferably includes a structure derived from PET, POM, PLA, PDMS, cellulose, or a coupling agent.

Abstract: The present invention provides: a metal patterning material which exhibits excellent heat resistance and is suppressed in the formation of a metal thin film on a film surface; an amine compound; a method for forming a metal pattern using these; and an electronic device.

Abstract: A drain wire correcting device 10 includes: a retention device 20 configured to retain a sheathed portion 1a of a multi-core cable 1; gripping members 41, 42 configured to grip a drain wire 2 on an axis Ax; a moving device 60 configured to move at least one of the multi-core cable 1 and the gripping members 41, 42 along the axis Ax; and a rotating device 70 configured to rotate at least one of the multi-core cable 1 and the gripping members 41, 42 around the axis Ax. The drain wire correcting device 10 executes a squeeze control of moving the gripping members 41, 42 along the axis Ax while the gripping members 41, 42 are in contact with the drain wire 2, thereby squeezing the drain wire 2 toward a distal end side, and executes, after the squeeze control, a rotation control causing the gripping members 41, 42 to grip the drain wire 2 with a gripping force increased from that in the squeeze control and rotating the gripping members 41, 42 around the axis Ax.

Abstract: There is provided a lower electrode mechanism for plasma processing, the lower electrode mechanism including: a base portion to which radio-frequency power is applied during the plasma processing; a dielectric portion disposed at an upper surface of the base portion; and an induction heating mechanism, in which the induction heating mechanism includes an induction heating element heated by an induction magnetic field, and a magnetic field generator that is disposed inside the base portion and generates the induction magnetic field.

Abstract: A substrate processing apparatus for processing a substrate includes: a processing chamber in which a processing space for the substrate is formed; a heating mechanism that adjusts an inner temperature of the processing chamber; and an inner member provided inside the processing chamber, wherein the heating mechanism includes an induction heating element that heats at least the inner member by generating heat with an induction magnetic field, and a magnetic field generator that generates the induction magnetic field.

Abstract: A seasoning method implemented in a plasma processing apparatus is provided. The plasma processing apparatus comprises a chamber and an electrostatic chuck, the electrostatic chuck including a central region which supports a substrate and an annular region which surrounds the central region and supports a ring assembly, the seasoning method includes: disposing the ring assembly on the annular region of the electrostatic chuck; disposing the substrate on the central region of the electrostatic chuck; forming a plasma in the chamber; calculating a thermal resistance between the electrostatic chuck and the ring assembly; and determining, based on the calculated thermal resistance, whether to repeat the forming the plasma and the calculating the thermal resistance.

Abstract: The present disclosure provides a detection method implemented in a plasma processing apparatus. The plasma processing apparatus comprising a plasma processing chamber, a substrate support disposed in the plasma processing chamber and a plurality of heaters disposed in the substrate support, the detection method comprising: disposing a substrate on the substrate support; performing plasma processing by generating plasma in the plasma processing chamber; measuring temperatures of each of the plurality of heaters with a plasma being formed in the plasma processing chamber; and detecting a significant point in the substrate support based on the measured temperatures of the plurality of heaters.

Abstract: A plasma processing apparatus includes: a processing chamber, and an electrode mechanism used for plasma processing. The electrode mechanism includes: an electrode portion configured to be applied with radio-frequency power, a dielectric portion disposed to laminate with the electrode portion, an electric circuit at least partially disposed in the dielectric portion, and a shield member disposed in the dielectric portion to overlap at least a part of the electric circuit in at least one of a plan view or a side view.

Abstract: A method of manufacturing a silicon carbide semiconductor device includes the following steps. In a silicon carbide substrate including a silicon carbide single-crystal substrate and a silicon carbide epitaxial film provided on the silicon carbide single-crystal substrate, a reference mark serving as a reference of two dimensional position coordinates is formed. After forming the reference mark, at least one of polishing or cleaning is performed on a reference mark formation surface of the silicon carbide substrate. Position coordinates of a defect present in the silicon carbide substrate are specified based on the reference mark. A device active region is formed in the silicon carbide substrate. Position coordinates of the device active region are specified based on the reference mark. A pass/fail judgement of the device active region is made by associating the position coordinates of the defect with the position of the device active region.

Abstract: A printed wiring board includes an electrode pad to be soldered to an electrode of an electronic component, an electrode pad to be soldered to an electrode of the electronic component, a barrier conductor continuous with the electrode pad, and a barrier conductor continuous with the electrode pad, the barrier conductor and the barrier conductors are located at positions facing each other with a gap area therebetween, the barrier conductor and the electrode pads are positioned such that the electrode pad faces the gap area with the barrier conductor therebetween and that the electrode pad faces the gap area with the barrier conductor therebetween, and the gap area is an area in which an adhesive is placed when adhering the electronic component.

Abstract: A semiconductor device 1a includes: a first external terminal 31 to which a first voltage is to be applied; a second external terminal 32 to which a second voltage is to be applied; a third external terminal 33; first wiring 17 connected to the first external terminal 31; second wiring 18 connected to the second external terminal 32; an internal block circuit 11 connected to the first wiring 17; a first resistor 12 and a transistor 14 serially connected between the first wiring 17 and the second wiring 18; and a second resistor 13 connected between the first wiring 17 and the second wiring 18. The transistor 14 turns on or off based on a test signa fed from the third external terminal 33. This configuration enables product identification using a resistance value, even if a predetermined resistance value cannot be changed.

Abstract: A pulse wave measurement device includes an electrode unit and a pulse wave measurement unit including pairs of current applying electrodes and voltage measuring electrodes. The electrode unit includes a substrate with insulating properties, measurement electrodes, connection electrodes electrically connected to the measurement electrodes in a 1-to-1 manner, and an adhesive layer. The pulse wave measurement unit includes a belt member configured to wrap around a living body and cover the electrode unit attached to a body surface. The pair of current applying electrodes and the pair of voltage measuring electrodes are disposed on an inner circumferential surface of the belt member so that, when the belt member is in a wrapped state around a living body, each one of the pair of current applying electrodes and each one of the pair of voltage measuring electrodes come into contact with any one of the connection electrode.

Abstract: A semiconductor device 1a includes: a first external terminal 31 to which a first voltage is to be applied; a second external terminal 32 to which a second voltage is to be applied; a third external terminal 33; first wiring 17 connected to the first external terminal 31; second wiring 18 connected to the second external terminal 32; an internal block circuit 11 connected to the first wiring 17; a first resistor 12 and a transistor 14 serially connected between the first wiring 17 and the second wiring 18; and a second resistor 13 connected between the first wiring 17 and the second wiring 18. The transistor 14 turns on or off based on a test signal fed from the third external terminal 33. This configuration enables product identification using a resistance value, even if a predetermined resistance value cannot be changed.

Abstract: A pulse wave measurement device including: a belt to be worn around a measurement target site; first and second pulse wave sensors that are mounted on the belt spaced from each other with respect to a width direction of the belt, and that detect pulse waves of opposing portions of an artery passing through the measurement target site; a pressing unit that is mounted on the belt is capable of changing pressing forces of the pulse wave sensors against the measurement target site; a waveform comparing unit that acquires pulse wave signals which are time-sequentially output by the pulse wave sensors respectively, and compares waveforms of the pulse wave signals; and a pulse wave sensor pressing force setting unit that variably sets the pressing forces by the pressing unit such that the waveforms of the pulse wave signals compared by the waveform comparing unit become identical to each other.

Abstract: A blood pressure estimation device includes a display unit (10), a belt portion (20), a first contact electrode (61) and a second contact electrode (62) for detecting an electrocardiographic waveform, and a pulse wave sensor. The display unit (10) displays a blood pressure estimation result. The belt portion (20) is connected to the display unit (10) and surrounds a target measurement site. The pulse wave sensor includes a pulse wave detection unit (40E) that detects a pulse wave of an artery (91) passing through the target measurement site. The first contact electrode (61) and the pulse wave detection unit (40E) are provided on an inner circumferential portion (20a) of the belt portion (20). The second contact electrode (62) is provided on an outer circumferential portion (20b) of the belt portion (20).

Abstract: A plasma processing apparatus includes a microwave output unit, a wave guide tube, a tuner, a demodulation unit, and a calculation unit. The microwave output unit outputs a microwave having power corresponding to setting power while frequency-modulating the microwave in a setting frequency range. The wave guide tube guides the microwave to an antenna of a chamber main body. The tuner is provided in the wave guide tube and adjusts a position of a movable plate. The demodulation unit is provided in the wave guide tube, and acquires travelling wave power and reflected wave power for each frequency. The calculation unit calculates a frequency at which a reflection coefficient, which is calculated on the basis of the travelling wave power and the reflected wave power, for each frequency becomes a minimum point as an absorption frequency.

Abstract: A molding material for producing the carbon clusters using biomass as the main raw material, comprising the biomass and a binder as the derived raw material, wherein the molding material is graphitized, the electrical resistivity of the molding material is equal to or less than 100 ??m, the diffraction pattern of the molding material by powder X-ray diffraction method has one peak between 2?(? is the Bragg angle) of 26 to 27°, and the value of ? width divided by the base of the peak is equal to or less than 0.68. The method for producing the molding material for producing the carbon clusters according to any of claims 1 to 6, comprising following steps of: obtaining a molded precursor containing a calcined biomass and a binder; optionally, further baking the precursor; and graphitizing the precursor at a temperature of 2500° C. or higher.

Abstract: A belt to be mounted around a measurement site; first pulse wave sensor and second pulse wave sensor mounted on the belt, separated from each other, configured to detect pulse waves in an artery passing through the measurement site; and pressing member mounted on the belt, capable of pressing first pulse wave sensor and second pulse wave sensor against the measurement site while varying pressing force. Time difference between first and second pulse wave signals is acquired as pulse transit time. Blood pressure is calculated based on the pulse transit time acquired by the measurement processing unit by using a predetermined correspondence equation between pulse transit time and blood pressure. Pulse transit time is acquired with the measurement processing unit while pressing force by pressing member is changed in resting state, and corresponding equation is calibrated based on plurality of pulse transit times corresponding to plurality of respective pressing forces.

Abstract: There is provided a biological sound measuring device that, in a contact state of being in contact with a body surface of a living body, measures a biological sound of the living body, the biological sound measuring device including: a first sound measuring instrument that is configured to measure the biological sound; a second sound measuring instrument that is configured to measure an ambient sound of the biological sound measuring device; and a controller that determines measurement accuracy of the biological sound in the first sound measuring instrument based on a difference in intensity at a predetermined specified frequency between a first sound measured by the first sound measuring instrument and a second sound measured by the second sound measuring instrument, and that performs notification when the measurement accuracy is less than a predetermined value.

Abstract: A printed wiring board includes an electrode pad to be soldered to an electrode of an electronic component, an electrode pad to be soldered to an electrode of the electronic component, a barrier conductor continuous with the electrode pad, and a barrier conductor continuous with the electrode pad, the barrier conductor and the barrier conductors are located at positions facing each other with a gap area therebetween, the barrier conductor and the electrode pads are positioned such that the electrode pad faces the gap area with the barrier conductor therebetween and that the electrode pad faces the gap area with the barrier conductor therebetween, and the gap area is an area in which an adhesive is placed when adhering the electronic component.