Abstract: A semiconductor element including an electrically insulating substrate, semiconductor layers including first and second semiconductor layers of different conduction types and formed on the electrically insulating substrate, a first electrode formed on the first semiconductor layer, and a second electrode formed on the second semiconductor layer revealed by etching at least the first semiconductor layer, wherein a die-bonding electrode is formed on a side surface of the second electrode, on a side surface of the second semiconductor layer and on a region of from a side surface to a bottom surface of the electrically insulating substrate. Metal-metal contact is formed between the die-bonding electrode and the side surface of the second electrode, so that low-resistance contact is obtained here.

Abstract: A light emitting element has: a light emitting layer of semiconductor; and a diffusion layer that has a refractive index equal to or greater than that of the light emitting layer and that diffuses light emitted from the light emitting layer to increase the external radiation efficiency of the light emitting element. The light emitting layer has a refractive index equal to or greater than that of any layers formed between the light emitting layer and the diffusion layer.

Abstract: Disclosed is a manufacturing method of a liquid jet recording head which includes a forming step of forming a recess portion between a flexible film wiring board and a recording element board, a providing step of providing in the recess portion an electrical connecting portion for electrically connecting the flexible film wiring board and the recording element board, a membrane curing step of injecting first resin into the recess portion to cure the first resin in a membrane form, and a covering step of covering an upper portion of the electrical connecting portion and the first resin with second resin subsequent to the membrane curing step. The electrical connecting portion is protected against liquid droplets and the like, and its electrical reliability is improved.

Abstract: A semiconductor element including an electrically insulating substrate, semiconductor layers including first and second semiconductor layers of different conduction types and formed on the electrically insulating substrate, a first electrode formed on the first semiconductor layer, and a second electrode formed on the second semiconductor layer revealed by etching at least the first semiconductor layer, wherein a die-bonding electrode is formed on a side surface of the second electrode, on a side surface of the second semiconductor layer and on a region of from a side surface to a bottom surface of the electrically insulating substrate. Metal-metal contact is formed between the die-bonding electrode and the side surface of the second electrode, so that low-resistance contact is obtained here.

Abstract: A wafer surface is irradiated with ultraviolet rays which has a central wavelength of 172 nm and which is emitted from an excimer lamp so that organic contaminations such as photo resist residues and so on are oxidized and removed from the wafer surface. Thus, cleaning of the wafer surface is carried out.