Abstract: An array sensor comprises: first wirings that, when viewed from the third direction, each extend in the first direction and are adjacent to each other in the second direction that is different from the first direction; second wirings each extending in the second direction and adjacent to each other in the first direction; detection elements each connected to both one of the first wirings and one of the second wirings; a readout circuit that reads out output signals from the detection elements; and first terminals electrically connected to the readout circuit. The first terminals form at least one first terminal line in which at least some of the first terminals are arranged side by side in the second direction. The number of the first terminals is greater than the number of the first wirings, and only some of the first terminals are electrically connected to the respective first wirings.

Abstract: A magnetic sensor includes a first path and a second path, a plurality of structures, and a plurality of first electrodes and a plurality of second electrodes. The first path includes at least one first array. The second path includes at least one second array. The at least one first array and the at least one second array are disposed so that they are arranged in a first direction. The at least one first array and the at least one second array each include an odd number of structures disposed so that they are arranged in a second direction.

Abstract: Electronic device member comprises a first substrate, at least one protruding portion that protrudes from the first substrate, and a solder layer, wherein the at least one protruding portion includes at least one side surface, a tip surface, and a connection portion between the at least one side surface and the tip surface, and wherein the solder layer is in contact with the tip surface. At the connection portion, the at least one side surface and the tip surface form obtuse angle.

Abstract: A modified conjugated diene-based polymer is produced by a method which includes a step of polymerizing a monomer containing a conjugated diene compound in the presence of a polymerization initiator which contains a silicon-containing initiator having a group F2 and an alkali metal element or an alkaline earth metal element. F2: a group “*1—Si(R1)n(Y1)3-n” (wherein R1 represents a C1 to C20 hydrocarbyl group; Y1 represents group “—OR2” or group “—NR3R4”; each of R2, R3, and R4 independently represents a C1 to C20 hydrocarbyl group; n is an integer of 0 to 2).

Abstract: A magnetic sensor includes a first path and a second path, a plurality of structures, and a plurality of first electrodes and a plurality of second electrodes. The first path includes at least one first array. The second path includes at least one second array. The at least one first array and the at least one second array are disposed so that they are arranged in a first direction. The at least one first array and the at least one second array each include an odd number of structures disposed so that they are arranged in a second direction.

Abstract: The present invention provides a method for culturing a fish germ stem cell, including culturing the stem cell on a surface coated with vitronectin and in a medium containing the following 8 components: (1) insulin, (2) selenium, (3) transferrin, (4) L-ascorbic acid, (5) FGF2, (6) TGF?, (7) NaHCO3 or KHCO3, (8) L-glutamine.

Abstract: An electronic component package has an outer edge including a first side and a second side adjacent to each other. The electronic component package includes a first electronic component chip, a second electronic component chip provided at a distance from the first electronic component chip, one or more first terminals disposed along the first side, one or more second terminals disposed along the second side, and one or more first conductors. The one or more first conductors couple the one or more first terminals to the first electronic component chip, with the one or more first terminals being uncoupled to the second electronic component chip.

Abstract: An image forming apparatus includes a plurality of image forming units, an exposure device, and circuitry. Each image forming unit includes an image bearer, a charger, and a developer bearer. The circuitry acquires an image-density cycle fluctuation in a visible image for each image forming unit and performs image-density fluctuation-reduction control to cyclically change image forming conditions to reduce the image-density cycle fluctuation.

Abstract: Conductive member 31 comprises a plurality of conductive nitride layers 32 and at least one nitride-metal layer 33 that includes a conductive nitride and a metal. The conductive nitride layers 32 and the at least one nitride-metal layer 33 are alternately stacked. Nitride-metal layer 33 includes metal dispersion layer 33A in which the metal is dispersed in the conductive nitride.

Abstract: An element array circuit includes first wirings including respective first parts, second wirings including respective second parts, and impedance elements each coupled to both one of the first wirings and one of the second wirings. The second parts extend in a direction different from that in which the first parts extend. Each of the second wirings includes a readout line through which signals flow, the signals indicating states of multiple ones of the impedance elements coupled to relevant one of the second wirings. Each of the first parts is a part, of relevant one of the first wirings, to which multiple ones of the impedance elements are coupled. Each of the second parts is a part, of relevant one of the second wirings, to which multiple ones of the impedance elements are coupled. The first parts are smaller than the second parts in electrical resistance value per unit length.

Abstract: A thermistor element includes: a thermistor film formed of an oxide having a spinel crystal structure; a first surface-side electrode provided in contact with a first surface of the thermistor film; and a second surface-side electrode provided in contact with a second surface of the thermistor film, wherein the first surface-side electrode includes a first electrode and a second electrode, and at least a part of the first electrode and at least a part of the second electrode are disposed to overlap the second surface-side electrode, and in the thermistor film, an oxygen concentration of a second region between the first electrode and the second electrode in a plan view is higher than that of a first region consisting of a region that overlaps the first electrode and the second surface-side electrode and a region that overlaps the second electrode and the second surface-side electrode.

Abstract: An electromagnetic wave detection element has: an electromagnetic wave detection portion; a conductive layer that is electrically connected to the electromagnetic wave detection portion; a conductive pillar having an end surface that is electrically connected to the conductive layer, wherein the end surface includes an inner region that is in contact with the conductive layer and an outer region that is positioned outside the inner region; and a dielectric layer that is positioned between at least a part of the outer region and the conductive layer.

Abstract: The electromagnetic wave sensor includes: a first substrate; a first wire which extends in a first direction parallel to a substrate surface of the first substrate in a plan view from a direction perpendicular to the substrate surface; a second wire which extends in a direction parallel to the substrate surface and different from the first direction in the plan view; and an electromagnetic wave detector which is electrically connected to the first wire and is electrically connected to the second wire, wherein the first wire is located on the first substrate side in relation to the electromagnetic wave detector in a third direction orthogonal to the first direction and the second direction and the second wire is located on a side opposite to the first substrate in relation to the electromagnetic wave detector in the third direction.

Abstract: An electromagnetic wave sensor includes: a first wire which extends in a first direction; a second wire which extends in a second direction different from the first direction; and an electromagnetic wave detector which is electrically connected to the first wire and is electrically connected to the second wire, wherein the second wire is provided so as to leave an interval with respect to the first wire in a third direction orthogonal to the first direction and the second direction, and the second wire is disposed to three-dimensionally intersect the first wire. At least one wire of the first wire and the second wire includes a wide portion, which is wider than an average value of a width of a portion excluding an overlapping portion of the at least one wire, in the overlapping portion in which the first wire and the second wire overlap each other.

Abstract: An electromagnetic wave sensor 1 has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each electromagnetic wave absorber at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each electromagnetic wave absorber is away from the second extending portions with the connection portions as fulcrums.

Abstract: An element array circuit includes one or more first wiring lines, second wiring lines, impedance elements, one or more operational amplifiers, one or more conversion elements, and one or more switchers. The second wiring lines each extend in a direction different from a direction of extension of the first wiring lines. The impedance elements are each coupled to one each of the first and second wiring lines. The operational amplifiers each include a positive input terminal, a negative input terminal couplable to one of the second wiring lines, and an output terminal. The conversion elements are each coupled to the negative input terminal and the output terminal, and each convert a current flowing through the second wiring line coupled to the negative input terminal into a voltage. The switchers are each coupled to one of the conversion elements and come into a conducting state or a nonconducting state.

Abstract: An image forming apparatus includes a plurality of image forming units, an exposure device, and circuitry. Each image forming unit includes an image bearer, a charger, and a developer bearer. The circuitry acquires an image-density cycle fluctuation in a visible image for each image forming unit and performs image-density fluctuation-reduction control to cyclically change image forming conditions to reduce the image-density cycle fluctuation.

Abstract: An electronic component package has an outer edge including a first side and a second side adjacent to each other. The electronic component package includes a first electronic component chip, a second electronic component chip provided at a distance from the first electronic component chip, one or more first terminals disposed along the first side, one or more second terminals disposed along the second side, and one or more first conductors. The one or more first conductors couple the one or more first terminals to the first electronic component chip, with the one or more first terminals being uncoupled to the second electronic component chip.

Abstract: A thermistor element includes: a thermistor film; a first electrode provided in contact with one surface of the thermistor film; and a pair of second electrodes provided in contact with an other surface of the thermistor film, wherein the thermistor film is provided to cover a periphery of the first electrode.

Abstract: Electromagnetic wave sensor (infrared sensor) 1 has: a first substrate; a second substrate that faces the first substrate and that allows infrared rays to pass through at least a part of the second substrate; first circumferential wall 4a that is positioned between the first substrate and the second substrate and that forms first space 8a together with the first and second substrates; bolometer structures 7 that are provided in first space 8a; first measuring element 9a that is provided in first space 8a and that is used for taking a first measurement relating to pressure P1 in first space 8a; and a monitoring portion. The monitoring portion acquires the first measurement that is taken using first measuring element 9a and outputs a predetermined signal indicating an abnormality based on at least the first measurement.