Abstract: The magnetoresistive effect element is provided with a plurality of magnetoresistive effect laminated bodies, a plurality of lower lead electrodes and upper lead electrodes that electrically connect the plurality of magnetoresistive effect laminated bodies in series, and a film that electrically connects the plurality of lower lead electrodes to each other so that none of the plurality of lower lead electrodes is electrically isolated.

Abstract: A magnetic sensor includes first and second yokes, first and second magnetoresistive elements, and a current path for passing a current through the first and second magnetoresistive elements. Each of the first and second yokes receives an input magnetic field containing an input magnetic field component in a direction parallel to a first virtual straight line Lz, and generates an output magnetic field. The output magnetic field contains an output magnetic field component in a direction parallel to a second virtual straight line Lx orthogonal to the first virtual straight line Lz. The first and second magnetoresistive elements generate respective detection values corresponding to the output magnetic field components of the output magnetic fields generates by the first and second yokes. The first and second yokes are electrically continuous with the first and second magnetoresistive elements, respectively.

Abstract: An electromagnetic wave sensor that limits the influence on bolometer membranes that is caused by heat from a local heat source is provided. Eelectromagnetic wave sensor has first substrate, second substrate that faces first substrate so as to form inner space between first substrate and second substrate, wherein second substrate transmits infrared rays; a plurality of bolometer membranes that is provided in inner space and that is supported by second substrate; local heat source that is formed in first substrate; first electric connection member that connects first substrate to second substrate; and lead that extends on or in second substrate and that connects first electric connection member to bolometer membrane.

Abstract: A sensor system according to an embodiment of the disclosure includes a physical quantity distribution generation source configured to generate a distribution of a physical quantity, and a plurality of sensor packages including respective sensor chips configured to detect the physical quantity. In a plane including the sensor packages, central positions of the respective sensor chips are shifted in directions from central positions of the respective sensor packages toward a central position of the distribution of the physical quantity, and distances from the central position of the distribution of the physical quantity to the central positions of the respective sensor chips of the respective sensor packages are substantially equal to each other.

Abstract: A magnetic sensor device having a spin-valve-type magnetoresistive effect element and capable of stably applying a bias magnetic field on the free layer of the magnetoresistive effect element includes a spin-valve-type magnetoresistive effect element, a substrate on which the magnetoresistive effect element is positioned, a power source that supplies a substantially constant electric current applied on the magnetoresistive effect element, and a magnetic field generator that is connected to the electric current path of the electric current applied on the magnetoresistive effect element in series. The magnetic field generator is provided to be capable of applying a bias magnetic field on at least a portion of the magnetoresistive effect element. The magnetic field generator is close to a portion of the magnetoresistive effect element and is positioned at a different level from the substrate.

Abstract: A magnetic sensor includes a base material, a plurality of magnets provided at predetermined spacing on the base material, and a plurality of magnetic detection parts respectively provided close to the plurality of magnets. Each of the plurality of magnetic detection parts outputs a signal in accordance with change in the magnetic field accompanying deformation of the base material.

Abstract: A resistance change element includes a first lead electrode, a resistance change layer provided on the first lead electrode, and a second lead electrode provided on the resistance change layer. The surface of the first lead electrode on the resistance change layer side includes a first region in which the resistance change layer is provided, and a second region that is a region other than the first region. In the second region, a second material having a work function that is larger than that of a first material configuring the first lead electrode is unevenly distributed.

Abstract: A triaxial magnetic sensor that can detect with high precision magnetic fields in three axial directions comprises a substrate having a first surface and a second surface opposite the first surface, and a magnetic sensor element group provided on the first surface. The magnetic sensor element group includes a first magnetic sensor element for magnetic detection in the x-axis direction, a second magnetic sensor element for magnetic detection in the y-axis direction and a third magnetic sensor element for magnetic detection in the z-axis direction. The first through third magnetic sensor elements respectively contain first through third magneto-resistive effect elements composed of laminated bodies including at least a magnetization fixed layer and a free layer, and the magnetization direction of each of the magnetization fixed layers of the first through third magneto-resistive elements is fixed in a direction inclined at a prescribed angle with respect to the first surface.

Abstract: A magnetic sensor having a yoke that can achieve large magnetic flux density and that can be accurately formed is provided. The magnetic sensor includes magnetic field detection element 21 that detects a magnetic field in first direction X and first yoke 23 that is located near magnetic field detection element 21 and extends in second direction Z that is orthogonal to first direction X. First yoke 23 includes first portion 23a that is located away from magnetic field detection element 21 at least in first direction X and second portion 23b that is located farther away from magnetic field detection element 21 than first portion 23a with respect to second direction Z. The second portion 23b has surface 23f that is opposite to interface 23d with the first portion 23a, surface 23f having a curved shape that protrudes in a direction away from the first portion 23a.

Abstract: A magnetic sensor that ensures the height of the yoke and that guides magnetic flux in the direction in which the magnetic field sensing film detects a magnetic field includes a first magnetic field detection element that has a first magnetic field sensing film that detects a magnetic field in a first direction, and a first yoke that includes a first portion that is located on a side of the first magnetic field sensing film 38 with respect to the first direction, and a second portion that is in contact with the first portion in a direction that is orthogonal to the first direction. The average dimension of the second portion in the first direction is larger than the average dimension of the first portion in the first direction.

Abstract: A resistive element array circuit includes word lines, bit lines, resistive elements, a selector, a differential amplifier, and a ground terminal. The word lines are coupled to a power supply. The resistive elements are each disposed at an intersection of corresponding one of the word lines and corresponding one of the bit lines. The selector is configured to select one word line and one bit line. The differential amplifier includes a positive input terminal configured to be coupled to the selected one of the bit lines which is selected by the selector, a negative input terminal configured to be coupled to non-selected one of the bit lines which is not selected by the selector and to non-selected one of the word lines which is not selected by the selector, an output terminal being coupled to the negative input terminal. The ground terminal is coupled to the positive input terminal.

Abstract: A magnetic sensor that is easy to ensure the height of the yoke and that is also easy to guide magnetic flux in the direction in which the magnetic field sensing film detects a magnetic field is provided. The magnetic sensor includes first magnetic field detection element 21 that has first magnetic field sensing film 38 that detects a magnetic field in first direction X, and first yoke 23 that includes first portion 23a that is located on a side of first magnetic field sensing film 38 with respect to first direction X, and second portion 23b that is in contact with first portion 23a in direction Z that is orthogonal to first direction X. The average dimension of second portion 23b in first direction X is larger than the average dimension of first portion 23a in first direction X.

Abstract: A magnetic sensor includes a magnetic detection element circuit that includes first and second magnetic detection elements, which are connected in series, and an output terminal, which is positioned between the first and second magnetic detection elements; an impedance matching device, which has a prescribed input voltage range and is connected to an output terminal of the magnetic detection element circuit; a first current supply source, which supplies an electric current to the magnetic detection element circuit; and a second current supply source, which supplies an electric current to the impedance matching device. A resistor is provided between the output terminal of the magnetic detection element circuit and the first current supply source and/or a reference electric potential point.

Abstract: A magnetoresistive element is provided with a plurality of magnetoresistive laminated bodies arranged in an array and a plurality of lead electrodes that electrically connect the plurality of magnetoresistive laminated bodies in series. A first lead electrode electrically connected to a first surface in the lamination direction of a first magnetoresistive laminated body among the plurality of magnetoresistive laminated bodies and a second lead electrode electrically connected to a first surface in the lamination direction of a second magnetoresistive laminated body adjacent in the series direction are electrically connected without a magnetoresistive laminated body being interposed in between.

Abstract: The magnetoresistive effect element is provided with a plurality of magnetoresistive effect laminated bodies, a plurality of lower lead electrodes and upper lead electrodes that electrically connect the plurality of magnetoresistive effect laminated bodies in series, and a film that electrically connects the plurality of lower lead electrodes to each other so that none of the plurality of lower lead electrodes is electrically isolated.

Abstract: A magnetic sensor is provided which can improve density of magnetoresistance effect elements without narrowing the wiring pitch. A plurality of element array layers 10 are stacked one on another, each of the element array layers including a plurality of magnetoresistance effect elements 1 arranged in parallel in an in-plane direction, and magnetoresistance effect elements 1 in the plurality of element array layers 10 are connected in series to each other.

Abstract: A magnetoresistive element is provided with a plurality of magnetoresistive laminated bodies arranged in an array and a plurality of lead electrodes that electrically connect the plurality of magnetoresistive laminated bodies in series. A first lead electrode electrically connected to a first surface in the lamination direction of a first magnetoresistive laminated body among the plurality of magnetoresistive laminated bodies and a second lead electrode electrically connected to a first surface in the lamination direction of a second magnetoresistive laminated body adjacent in the series direction are electrically connected without a magnetoresistive laminated body being interposed in between.

Abstract: A key input apparatus includes a key top capable of moving up and down through a pressing operation; a first substrate, which includes a first surface, which is positioned on the key top side, and a second surface, which is opposite to the first surface, and the first substrate supports the key top and is provided to be movable up and down along with the key top; a second substrate, which is provided between the key top and the first substrate in the direction of the up-and-down movement of the key top, and the second substrate includes a first surface, which is positioned on the first substrate side, and a second surface, which is opposite to the first surface; a magnetic field generation unit; a magnetic sensor unit, which includes a magnetic detection element that detects a magnetic field generated from the magnetic field generation unit; and an adhesion unit, which includes a soft magnetic material capable of adhering to the magnetic field generation unit.

Abstract: A sensor system according to an embodiment of the disclosure includes a physical quantity distribution generation source configured to generate a distribution of a physical quantity, and a plurality of sensor packages including respective sensor chips configured to detect the physical quantity. In a plane including the sensor packages, central positions of the respective sensor chips are shifted in directions from central positions of the respective sensor packages toward a central position of the distribution of the physical quantity, and distances from the central position of the distribution of the physical quantity to the central positions of the respective sensor chips of the respective sensor packages are substantially equal to each other.

Abstract: A semiconductor device according to an embodiment of the disclosure includes a base, a semiconductor element, a first conductor, and a second conductor. The base has an outer edge including a first part, a second part, and a third part. The first part and the second part are substantially parallel to each other. The third part extends in a direction that intersects both of the first part and the second part. The semiconductor element is covered with the base. The first conductor is coupled to the semiconductor element, and protrudes to an outside of the base from the first part of the outer edge. The second conductor is coupled to the semiconductor element, and protrudes to the outside of the base from the third part of the outer edge.