Abstract: A pressure-sensitive adhesive type optical film which comprises an optical film and a pressure-sensitive adhesive layer superposed on at least one side thereof through an anchor layer formed from a resin emulsion. It is easy to handle because the pressure-sensitive adhesive does not peel off even when an edge of the film comes into contract during handling in use.

Abstract: A pressure-sensitive adhesive type optical film which comprises an optical film and a pressure-sensitive adhesive layer superposed on at least one side thereof through an anchor layer formed from a polyamine compound. It is easy to handle because the pressure-sensitive adhesive does not peel off even when an edge of the film comes into contract during handling in use. The pressure-sensitive adhesive type optical film can be inhibited from being electrostatically charged upon peeling.

Abstract: An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

Abstract: A process of producing a polymer optical waveguide, including (a) a step of forming an undercladding layer on a substrate; (b) a step of forming a photosensitive resin composition layer containing a 1,4-dihydropyridine derivative and a resin on the undercladding layer; (c) a step of irradiating a region of the photosensitive resin composition layer corresponding to a core pattern with UV light through a mask to form UV light-exposed areas and UV light-unexposed areas on the photosensitive resin composition layer; (d) a step of heating the UV light-exposed areas and UV light-unexposed areas of the photosensitive resin composition layer; and (e) a step of forming an overcladding layer on the photosensitive resin composition layer after heating.

Abstract: An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.

Abstract: A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number “m”: 1

Abstract: A microlens array having a resin layer forming convex lenses, wherein the resin layer comprises a cured product of a polycarbodiimide resin represented by formula:

Abstract: A resin for the encapsulation of a photosemiconductor element which comprises a polycarbodiimide having a specific structure; a photosemiconductor device including a photosemiconductor element encapsulated with the resin; and a process for producing the photosemiconductor device which includes the steps of placing the resin on a photosemiconductor element and heating the resin. The resin enables the photosemiconductor element to maintain high brightness when it is a light-emitting element and to maintain high photodetection sensitivity when it is a photodetector, and also enables the photosemiconductor element to be easily encapsulated.

Abstract: A polycarbodiimide copolymer having a repeating structural unit represented by the following formula (1) in a number “m”: 1

Abstract: An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.

Abstract: A process of producing a polymer optical waveguide, including (a) a step of forming an undercladding layer on a substrate; (b) a step of forming a photosensitive resin composition layer containing a 1,4-dihydropyridine derivative and a resin on the undercladding layer; (c) a step of irradiating a region of the photosensitive resin composition layer corresponding to a core pattern with UV light through a mask to form UV light-exposed areas and UV light-unexposed areas on the photosensitive resin composition layer; (d) a step of heating the UV light-exposed areas and UV light-unexposed areas of the photosensitive resin composition layer; and (e) a step of forming an overcladding layer on the photosensitive resin composition layer after heating.