Abstract: A laminated glass may be obtained by integrally bonding glass sheets through an adhesive, the adhesive comprising a hydrogenated block copolymer obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating unsaturated bonds of a block copolymer that comprises at least two polymer blocks and at least one polymer block, the polymer block comprising a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block comprising a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block in the block copolymer to a weight fraction wB of the polymer block in the block copolymer being 30:70 to 60:40. The laminated glass may employ a block copolymer hydrogenation product comprising an alkoxysilyl group and excellent light-fastness, heat resistance, moisture resistance and transparency.

Abstract: A laminated glass may be obtained by integrally bonding glass sheets through an adhesive, the adhesive comprising a hydrogenated block copolymer obtained by introducing an alkoxysilyl group into a hydrogenated block copolymer that is obtained by hydrogenating unsaturated bonds of a block copolymer that comprises at least two polymer blocks and at least one polymer block, the polymer block comprising a repeating unit derived from an aromatic vinyl compound as a main component, the polymer block comprising a repeating unit derived from a linear conjugated diene compound as a main component, and a ratio (wA:wB) of a weight fraction wA of the polymer block in the block copolymer to a weight fraction wB of the polymer block in the block copolymer being 30:70 to 60:40. The laminated glass may employ a block copolymer hydrogenation product comprising an alkoxysilyl group and excellent light-fastness, heat resistance, moisture resistance and transparency.

Abstract: A resin composition comprising a hydrogenated block copolymer which is used for a resin composition for encapsulating a solar cell is provided. The hydrogenated block copolymer can be obtained by hydrogenating 90% or more of the total unsaturated bonds of block copolymers which comprise at least two polymer blocks [A] having an aromatic vinyl compound-origin repeating unit as the main component and at least one polymer block [B] comprising a chain-type conjugated diene compound-origin repeating unit as the main component and in which the ratio (wA:wB) of the weight fraction (wA) of the total polymer blocks [A], relative to the total block copolymer, to the weight fraction (wB) of the total polymer block [B] is 20:80 to 60:40. The resin composition has a tensile elasticity (at 23° C.) of 1.

Abstract: When data is an HDTV signal, a buffer memory is used as two banks and pipeline processing is performed. When data is an SDTV signal, on the other hand, the buffer memory is used as a bankless buffer memory, and the pipeline processing is not performed.

Abstract: A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.

Abstract: A plastic member, for example, a hydrocarbon-based transparent polymer molded product is subjected to fluorination processing in a fluorine gas within a reaction device 8 to fluorinate only a surface layer thereof. Thus, a refractive index can be lowered, a surface reflection can be lowered, and light transmittance of a base material can be improved.

Abstract: A lighting device including a metal substrate to prevent temperature rise of LED chip is offered. The lighting device includes the metal substrate, an anode or cathode electrode of the LED chip disposed on the metal substrate, brazing materials connecting the LED chip and the metal substrate, and a groove formed in the anode or cathode electrode. Forming the groove can prevent an occurrence of a crack in the brazing materials. Also, a lighting device includes the metal substrate, an anode and cathode electrode of the LED chip disposed on the metal substrate and brazing materials connecting the LED chip and the metal substrate. Further, a slit is formed in the metal substrate between the anode and cathode electrode. Forming the slit in the metal substrate can prevent an occurrence of a crack in the brazing materials.

Abstract: A laminate including a resin layer and a metal layer, the resin layer being obtained by modifying at least part of the surface of a resin film including a thermoplastic cyclic olefin resin by ionizing irradiation, and the metal layer being formed on the modified area of the surface of the resin film by plating, a method of producing the same, and an electronic circuit board including a circuit formed by etching the metal layer of the laminate by photolithography, are disclosed. The laminate ensures that the insulating resin layer (flat surface) exhibits high adhesion to the conductor layer.

Abstract: A plurality of diffused resistors and a plurality of wirings (resistive elements) are alternately disposed along a virtual line, and those diffused resistors and wirings are connected in series by contact vias. In the same wiring layer as that of the wirings, a dummy pattern is formed so as to surround a formation region of the wirings and the diffused resistors. A space between the dummy pattern and the wirings is set in accordance with, for example, a minimum space between wirings in a chip formation portion.

Abstract: A dezincing apparatus according to the present invention is provided with an inductive heating container 50, inductive heating coils 60, 61, and a hollow pipe 70. The inductive heating container 50 has a feeding port into for feeding a scrap steel plate 41, and is an outer container of the dezincing apparatus 2. The inductive heating coils 60, 61 are wound around the outer periphery of the inductive heating container 50, and are connected to a high-frequency power supply. The hollow pipe 70 is a hollow rod body erected at the center of the inductive heating container 50, and is made of alloy steel. A reducing atmosphere is established in the container by the feeding of a carbon-containing material 42, or the like. Slits 71, 72, 73 for discharging zinc vapor or the like to the outside are formed in the hollow pipe 70.

Abstract: A plurality of diffused resistors and a plurality of wirings (resistive elements) are alternately disposed along a virtual line, and those diffused resistors and wirings are connected in series by contact vias. In the same wiring layer as that of the wirings, a dummy pattern is formed so as to surround a formation region of the wirings and the diffused resistors. A space between the dummy pattern and the wirings is set in accordance with, for example, a minimum space between wirings in a chip formation portion.

Abstract: There is disclosed a clock regeneration circuit having a PCR buffer including a register which buffers a PCR extracted from a transmission signal, a counter which counts a reception side reference clock CKr, an STC buffer including a register which buffers a counted value of the counter, and a CPU which generates a signal indicating a difference between a transmission side reference clock and the reception side reference clock CKr based on values held in the PCR buffer and the STC buffer. If, at this point, a new PCR is input before the values held in the PCR buffer and the STC buffer are read by the CPU, the PCR buffer and the STC buffer are not updated.

Abstract: A plastic member, for example, a hydrocarbon-based transparent polymer molded product is subjected to fluorination processing in a fluorine gas within a reaction device 8 to fluorinate only a surface layer thereof. Thus, a refractive index can be lowered, a surface reflection can be lowered, and light transmittance of a base material can be improved.

Abstract: A light guide plate for liquid crystal display, made of a resin, which has a surface layer portion (preferably on the light incident surface side of the light guide plate) comprising a region containing fluorine atoms in an amount larger than that in the inner layer portion. The resin is preferably an alicyclic structure-containing resin. The light guide plate is produced by exposing a surface of a light guide plate substrate to an atmosphere containing fluorine gas. Preferably, prior to the exposure to a fluorine-gas containing atmosphere and after the exposure to a fluorine-gas containing atmosphere, the light guide plate substrate is maintained in an inert gas-containing atmosphere, or in the air under reduced pressure, for the production of the light guide plate.

Abstract: In order to provide a method of manufacturing a polymer containing an extremely small amount of residual unreacted monomer component, and a material using the polymer, megasonic is directly radiated to a polymer containing a residual unreacted monomer under an atmosphere free of oxygen and moisture to thereby perfectly complete polymerization.

Abstract: A plurality of diffused resistors and a plurality of wirings (resistive elements) are alternately disposed along a virtual line, and those diffused resistors and wirings are connected in series by contact vias. In the same wiring layer as that of the wirings, a dummy pattern is formed so as to surround a formation region of the wirings and the diffused resistors. A space between the dummy pattern and the wirings is set in accordance with, for example, a minimum space between wirings in a chip formation portion.

Abstract: When data is an HDTV signal, a buffer memory is used as two banks and pipeline processing is performed. When data is an SDTV signal, on the other hand, the buffer memory is used as a bankless buffer memory, and the pipeline processing is not performed.

Abstract: A cascode connection circuit includes a first field effect transistor (FET) which has a source terminal and a drain terminal, the source terminal being connected to ground; a second FET which has a source terminal and a gate terminal, the source terminal being connected to the drain terminal of the first FET; and a first resistor and a first capacitor connected in series between the source terminal of the first FET and the gate terminal of the second FET. The first FET and the second FET are cascode-connected to each other. The product of the resistance of the first resistor and the capacitance of the first capacitor does not exceed 0.1 times the period of an operating frequency of the circuit.

Abstract: There is disclosed a clock regeneration circuit having a PCR buffer including a register which buffers a PCR extracted from a transmission signal, a counter which counts a reception side reference clock CKr, an STC buffer including a register which buffers a counted value of the counter, and a CPU which generates a signal indicating a difference between a transmission side reference clock and the reception side reference clock CKr based on values held in the PCR buffer and the STC buffer. If, at this point, a new PCR is input before the values held in the PCR buffer and the STC buffer are read by the CPU, the PCR buffer and the STC buffer are not updated.

Abstract: A member for a resin molding machine wherein it has a face contacting with a molten resin, and at least a part of the face is covered with a film of an oxide of a base material of the face or a component contained in the base material. The use of the member in the molding of a resin allows the prevention of the incorporation of a contaminant associated with the deterioration of a melt of the resin into a molded article from the resin.