Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

Abstract: A semiconductor substrate cutting method which can efficiently cut a semiconductor substrate having a front face formed with a functional device together with a die bonding resin layer is provided. A wafer 11 having a front face 3 formed with a functional device 15 is irradiated with laser light L while positioning a light-converging point P within the wafer 11 with the rear face 17 of the wafer 11 acting as a laser light incident face, so as to generate multiphoton absorption, thereby forming a starting point region for cutting 8 due to a molten processed region 13 within the wafer 11 along a line along which the substrate should be cut 5. Consequently, a fracture can be generated from the starting point region for cutting 8 naturally or with a relatively small force, so as to reach the front face 3 and rear face 17.

Abstract: When a drive wheel (3) of a vehicle is driven by a motor generator (10) that operates as a motor, electric power is supplied from a storage battery (20) to the motor generator (10). When the drive wheel (3) is braked by the motor generator (10) that operates as a generator, electric power is supplied from the motor generator (10) to the storage battery (20), and a first thermoelectric conversion element (11) is supplied with electric power from the motor generator (10) to cool the motor generator (10).

Abstract: In a hydrogen sensor (10a, 10b, 10c, 10d), a thin film layer (12) is formed over a substrate (11) and a buffer layer (13) is formed over the thin film layer (12). Further, over the buffer layer (13) is formed a catalyst layer (14) which, by being contacted by hydrogen gas, hydrogenates the thin film layer (12), thereby changing optical reflectance of the thin film layer (12). A constituent of the thin film layer (12) diffusing into the catalyst layer (14) combines with a constituent that has diffused from the buffer layer (13) into the catalyst layer (14), so that oxidation of the catalyst film layer (14) is prevented. Consequently, oxidation of the catalyst layer (14), etc. caused by repetition of hydrogenation of the thin film layer (12) is prevented, and therefore, decrease in hydrogen detection sensitivity of the hydrogen sensor (10a, 10b, 10c, 10d) is restrained.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A hydrogen-gas concentration sensor comprises a substrate, and a plurality of hydrogen detecting films formed on the substrate, adjacent to one another. The hydrogen detecting films have a thin film layer, and a catalyst layer formed on the thin film layer. Each catalyst layer, when in contact with a hydrogen gas, exerts photocatalysis to hydrogenate each thin film layer reversibly and causes the electric resistance value thereof to change reversibly. The individual thin film layers have different sensitivities of a change in the hydrogen gas concentration vs. a change in the resistance value and different hydrogen gas concentration measurement ranges. The hydrogen-gas concentration sensor measures the hydrogen gas concentration with a thin film layer having a high sensitivity when the hydrogen gas concentration is low, and measures the hydrogen gas concentration with a thin film layer having a wide measurement range when the hydrogen gas concentration is high.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.

Abstract: A hydrogen gas visualization device comprises a hydrogen sensor having a thin film layer formed on the surface of a substrate and a catalyst layer formed on the surface of the thin film layer which, when contacted by hydrogen gas contained in an atmosphere, hydrogenates the thin film layer and thereby changes the optical reflectance of the thin film layer, and one or more sensor faces provided with the hydrogen sensor. The hydrogen gas visualization device visualizes, on the sensor faces, the distribution of hydrogen gas contained in the atmosphere contacting the hydrogen sensor and thereby visualizes the existence and flow of the hydrogen gas.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A hydrogen sensor includes a thin film layer formed on a top surface of a planar optical transmission medium, and a catalyst layer formed on a top surface of the thin film layer. A first interface is created between the planar optical transmission medium and the thin film layer. A substrate is joined to a bottom surface of the planar optical transmission medium so that a second interface is created between the planar optical transmission medium and the substrate. On entering a first end portion of the planer optical transmission medium, light from a light source is spread by an entrance section, and the spread light is transmitted inside the planar optical transmission medium to a second end portion by being reflected by the first and second interfaces alternately. Light exiting from the second end portion is transmitted to an optical sensor by an exit light-collecting section.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: A solid-oxide fuel cell having a fuel pole and an air pole joined to a solid oxide electrolyte is arranged in a combustion exhaust gas flow channel of an engine or the like (fuel cell containing section), thereby placed in a flow of high-temperature combustion exhaust gas introduced through an exhaust gas introduction section into the fuel cell containing section and discharged through an exhaust gas discharge section, so that the solid-oxide fuel cell is heated by the thermal energy of the combustion exhaust gas and generates electric power using a hydrocarbon compound and carbon oxide in the combustion exhaust gas, as fuel gas.

Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

Abstract: In a hydrogen gas detection device, light emitted from a light source is irradiated onto a hydrogen sensor whose reflectance (optical reflectance) varies upon contact with hydrogen gas, and the light transmitted through the hydrogen sensor or reflected by a reflective film of the hydrogen sensor is received by an optical sensor. On the basis of the signal output from the optical sensor and indicative of the amount of light received, the hydrogen gas detection device detects leakage of hydrogen gas.

Abstract: An electric power generation device includes a cell body and a secondary electric power generator. The cell body has an electrolyte, a fuel electrode and an air electrode. The secondary electric power generator is joined to at least one of the fuel and air electrodes and includes P- and N-type thermoelectric conversion members. With the electric power generation device, the cell body generates electric power at temperatures higher than or equal to an power generation start temperature, and at the same time, the P- and N-type thermoelectric conversion members joined to the cell body and functioning as a thermocouple produce electric power by utilizing the Seebeck effect.