Abstract: A resin composition comprises a resin, a vulcanization-activating agent, and a stabilizer. The vulcanization-activating agent may be a compound having a plurality of polymerizable unsaturated bonds (e.g., a compound having a plurality of (meth)acryloyl groups). The stabilizer may be an antioxidant, or a light stabilizer (particularly, a stabilizer is capable of capturing a radical). Use of the resin composition as a resin material ensures to directly join between a resin and a rubber certainly and firmly. The proportion of the vulcanization-activating agent may be about 0.1 to 10 parts by weight relative to 100 parts by weight of the resin. The proportion of the stabilizer may be about 0.01 to 5 parts by weight relative to 100 parts by weight of the resin. The present invention provides a resin composition excellent in adhesiveness to a rubber.

Abstract: In a molded composite article formed by directly joining a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, as the polyamide-series resin, a polyamide-series resin having an amino group of not less than 10 mmol/kg is used. The molded composite article may be produced by heating at least any one of the polyamide-series resin and the thermoplastic polyurethane-series resin to join to the other resin.

Abstract: A resin composition comprises a resin, a vulcanization-activating agent, and a stabilizer. The vulcanization-activating agent may be a compound having a plurality of polymerizable unsaturated bonds (e.g., a compound having a plurality of (meth)acryloyl groups). The stabilizer may be an antioxidant, or a light stabilizer (particularly, a stabilizer is capable of capturing a radical). Use of the resin composition as a resin material ensures to directly join between a resin and a rubber certainly and firmly. The proportion of the vulcanization-activating agent may be about 0.1 to 10 parts by weight relative to 100 parts by weight of the resin. The proportion of the stabilizer may be about 0.01 to 5 parts by weight relative to 100 parts by weight of the resin. The present invention provides a resin composition excellent in adhesiveness to a rubber.

Abstract: In a molded composite article formed by directly joining a resin member comprising a polyamide-series resin to a resin member comprising a thermoplastic polyurethane-series resin, as the polyamide-series resin, a polyamide-series resin having an amino group of not less than 10 mmol/kg is used. The molded composite article may be produced by heating at least any one of the polyamide-series resin and the thermoplastic polyurethane-series resin to join to the other resin.

Abstract: A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to ?40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to ?50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3. Accordingly, low-temperature impact resistance can significantly be improved without deterioration in the other inherent excellent physical properties of the thermoplastic resin.

Abstract: The invention relates to an electroconductive composite plastics sheet preferable as a carrier tape for accommodating electronic parts. Specifically, it relates to an electroconductive composite plastics sheet comprising a thermoplastic resin-containing sheet substrate and an electroconductive resin layer formed on the surface of the sheet substrate, wherein the sheet substrate comprises a styrene-based resin, and the electroconductive resin layer is a layer consisting of an electroconductive resin composition comprising (A-1) styrene-based resin, (A-2) carbon black, and (A-3) one kind of copolymer, or a mixture consisting of a combination of two or more kinds of copolymers, obtained from ethylene and other monomers copolymerizable with ethylene, wherein the content of the other monomers copolymerizable with ethylene is 6 to 14 mass % on the average, and the ratio in thickness of the sheet substrate and electroconductive resin layer is in the range of 4/1 to 20/1, and the total thickness is in the range of 0.

Abstract: In the disclosed invention, the influence of the dispersions of the gate lengths and the gate widths is prevented from adversely affecting circuit parameters except for the specific circuit parameter. According to this invention, the circuit parameters can be correctly extracted, and circuit characteristics can be accurately predicted.

Abstract: A thermoplastic resin composition material 1 includes a resin portion (a) 2 made of a thermoplastic resin (A); elastomer portions (b) 3 made of a thermoplastic elastomer (B) having substantially no compatibility with the thermoplastic resin (A) and having a glass transition temperature of lower than or equal to −40° C.; and polymer portions (c) 4 made of a high polymer (C) having substantially no compatibility with the thermoplastic resin (A) and the thermoplastic elastomer (B), having a glass transition temperature or crystallization temperature of lower than or equal to −50° C., and having a viscosity at 40° C. of 0.1 to 200000 cP. The material has a structure in which the elastomer portions (b) 3 are dispersed in the resin portion (a) 2, and the polymer portions (c) 4 are dispersed in the elastomer portions (b) 3.

Abstract: In the disclosed invention, the influence of the dispersions of the gate lengths and the gate widths is prevented from adversely affecting circuit parameters except for the specific circuit parameter. According to this invention, the circuit parameters can be correctly extracted, and circuit characteristics can be accurately predicted.

Abstract: A method of cooking edible foods by heating the foods on an electromagnetic cooker cover plate, formed by molding using a composition comprising a wholly aromatic, liquid crystalline polyester and a filler, said composition having a heat deformation temperature of not lower than 200.degree. C. at a load of 18.5 kg/cm.sup.2.

Abstract: The present invention provides a resin composition which is lowly water-absorbent and is excellent in properties such as mechanical strength, flexibility and heat resistance while improving the compatibility of the conventional resin composition comprising a polyamide resin and a thermoplastic polyester resin, and which comprises 100 parts by weight of a mixture composed of:(A) 10 to 90% by weight of a polyamide resin having a molar ratio of the terminal carboxyl group to the terminal amino group of 1.5 or more, and(B) 90 to 10% by weight of a thermoplastic polyester resin, and incorporated therein, and(C) 0.1 to 10 parts by weight of a vinylic copolymer comprising 40 to 99% by weight of a specified vinyl monomer and 60 to 1% by weight of a specified vinyl monomer having a glycidyl ester group.