Abstract: The present invention provides an insulating film forming composition that excels in insulating properties and heat resistance, suppresses the occurrence of warpage, and can form an insulating film with excellent adhesion. The insulating film forming composition of the present invention contains, as a polymerizable compound, a polyorganosilsesquioxane containing siloxane constituent units; wherein the total content of: constituent units represented by formula (I) [RaSiO3/2] (I) and constituent units represented by formula (II) [RaSiO2/2(ORb)] (II) is greater than or equal to 55 mol % of the total amount of the siloxane constituent units; and the polyorganosilsesquioxane has a number average molecular weight of from 500 to 10000 and an epoxy equivalent of from 200 to 2000 g/eq.

Abstract: Provide are: a method for producing a laminate having an adhesive layer on one surface of a semiconductor wafer, with the adhesive layer being less likely to foam during wafer bonding under reduced pressure, curing of an adhesive being less likely to occur, and also allowing a tact time to be shortened; and an adhesive layer forming device to be used in the method. The adhesive layer forming device for forming an adhesive layer by removing a solvent in a coating film coated and formed on one surface of a semiconductor wafer includes: a lower plate on which the semiconductor wafer is placed; an upper cover configured to form a closed space together with the lower plate, the closed space having a volume of 10 liters or less; and pressure reducing means for reducing pressure in the closed space.

Abstract: Provided is a method for manufacturing a semiconductor device suitable for achieving low wiring resistance between semiconductor elements that is bonded via an adhesive layer and multi-layered. The method according to the present invention is as follows. First, a wafer laminate (W) is prepared, the wafer laminate (W) including a wafer (10) having a circuit forming surface (10a), a wafer (20) having a main surface (20a) and a back surface (20b), and an adhesive layer (30) containing an SiOC-based polymer. Then, a hole (H) is formed in the wafer laminate (W) by etching the wafer laminate (W) from the wafer (20) side via a mask pattern masking a portion of the main surface (20a) side of the wafer (20), the hole (H) extending through the wafer (20) and the adhesive layer (30) and reaching a wiring pattern (12b) in the wafer (10). Then, an insulating film (41) is formed on an inner surface of the hole (H). Then, the insulating film (41) on a bottom surface of the hole (H) is removed.

Abstract: The present invention is to provide a curable composition for adhesive agents that cures at a low temperature and that can form a cured article having excellent heat resistance, crack resistance, and adhesive properties and tight bonding properties for adhereds.

Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.

Abstract: Provided is an adhesive composition that can be cured at low temperatures and can form a cured product having excellent insulating property, heat resistance, and adhesiveness. The adhesive composition according to the present invention includes polyorganosilsesquioxane (A) including a constituent unit represented by Formula (1) below, R1SiO3/2(1), in Formula (1), R1 represents a group containing a radically polymerizable group. In the polyorganosilsesquioxane (A), a proportion of the constituent unit represented by Formula (1) and a constituent unit represented by the following Formula (2), relative to a total amount (100 mol %) of siloxane constituent units, is from 55 to 100 mol %, R1SiO2/2(OR2) (2), in Formula (2), R1 is as defined above, and R2 is a hydrogen atom or an alkyl group having from 1 to 4 carbons. The polyorganosilsesquioxane (A) has a number average molecular weight from 1500 to 50000 and a molecular weight dispersity (weight average molecular weight/number average molecular weight) from 1.

Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C.

Abstract: Provided is a curable composition that can, when cured, form a cured product having adhesiveness and adhesion to an adherend at excellent levels. The curable composition contains a polyorganosilsesquioxane and one of (A) a compound represented by Formula (X); and (B) a polymerization stabilizer, where Formula (X) is expressed as follows: wherein r1 represents an integer from 4 to 20; L represents a group containing epoxy, oxetanyl or vinyl ether group; R11 and R12 each represent an optionally substituted hydrocarbon group; s1 represents an integer from 1 to 3; t1 represents an integer from 0 to 2, where s1 plus t1 equals 3; and R13 and R14 are selected from hydrogen and an optionally substituted hydrocarbon group. The polyorganosilsesquioxane has a number-average molecular weight of 1000 to 3000 and a molecular-weight dispersity of 1.0 to 3.

Abstract: Provided is a curable composition having excellent film-formability and can be cured at low temperatures to form a cured product that has heat resistance, cracking resistance, and adhesiveness and adhesion to an adherend at excellent levels. The curable composition according to the present invention is a composition containing polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) include (a-1) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 3000 or more, and (a-2) an epoxy-containing polyorganosilsesquioxane having a weight-average molecular weight of 2500 or less. The polyorganosilsesquioxanes (A) contain the components (a-1) and (a-2) in a total content of 50 weight percent or more of the total amount of the polyorganosilsesquioxanes (A). The polyorganosilsesquioxanes (A) have a ratio in content (weight ratio) of (a-1) to (a-2) of from 10:90 to 70:30.

Abstract: Provided is a polyorganosilsesquioxane capable of forming, when cured, a cured product that offers high surface hardness and good heat resistance, is highly flexible, and has excellent processability. The present invention relates to a polyorganosilsesquioxane including a constitutional unit represented by Formula (1). The polyorganosilsesquioxane includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) in a mole ratio of the constitutional unit represented by Formula (I) to the constitutional unit represented by Formula (II) of 5 or more. The polyorganosilsesquioxane has a total proportion of the constitutional unit represented by Formula (1) and a constitutional unit represented by Formula (4) of 55% to 100% by mole based on the total amount (100% by mole) of all siloxane constitutional units.

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C.

Abstract: Provided are a water-soluble ginger root extract which is a water extract or a hydrous alcohol extract of a ginger root and is substantially free of gingerols; and a hair growth inhibitor and a preparation for external use each containing the extract. The water-soluble ginger root extract of the present invention causes less skin irritation because of being substantially free of gingerols, and has excellent body-hair growth inhibiting effects, so that it is useful as a hair grown inhibitor and a preparation for external use, each having a high degree of safety.

Abstract: The present invention relates to a hair growth inhibitor and a depilation accelerator, each comprising a crude drug selected from Bupleuri Radix, Perillae Herba, Rhei Rhizoma and Akebiae Caulis, or an extract thereof. This inhibitor or accelerator makes it possible to inhibit the growth of body hair or promote depilation, respectively, thereby reducing the frequency of hair removal treatment. Moreover, it makes the hair body finer, thereby facilitating the removal of the hair from feet or arms.

Abstract: The present invention relates to a hair growth inhibitor and a depilation accelerator, each comprising a crude drug selected from Bupleuri Radix, Perillae Herba, Rhel Rhizoma and Akebiae Caulis, or an extract thereof. This inhibitor or accelerator makes it possible to inhibit the growth of body hair or promote depilation, respectively, thereby reducing the frequency of hair removal treatment. Moreover, it makes the hair body finer, thereby facilitating the removal of the hair from feet or arms.

Abstract: treating method for hair growth inhibition, which comprises administering (A) the extract of a plant of the family Juniperus or a malt. In addition, the present invention relates to a dermatologic composition for external use, which comprises (B) an elastase inhibitor or neutral endopeptidase inhibitor, and the above-described component (A) and/or (C) at least one proteolytic enzyme selected from the group consisting of papain, trypsin, chymotrypsin, pepsin, bromelain, ficin and pancreatin.

Abstract: A topical skin composition containing a dipeptide compound represented by formula (1) or a salt of the dipeptide: wherein R1 represents a hydrogen atom, an alkyl group, an alkanoyl group, or —CH(R6)COOR7 (wherein R6 represents a hydrogen atom or a lower alkyl group, and R7 represents a hydrogen atom, a lower alkyl group, a lower alkenyl group, or an aralkyl group); R2 represents a hydrogen atom or an alkyl group which may have a substituent; R3 represents a lower alkyl group or a phenyl group; R4 represents a hydrogen atom or a lower alkyl group, and may form a heterocyclic ring together with R5 and an adjacent nitrogen atom; R5 represents a hydrogen atom, an alkyl group which may have a substituent, or an aralkyl group which may have a substituent, and may form the heterocyclic ring together with R4; X represents —COOR8 (wherein R8 represents a hydrogen atom, a lower alkyl group, a lower alkenyl group, or an aralkyl group) or —SO3H; and n is an integer of 0-4; and a pharmaceutically acceptable carrier

Abstract: The present invention relates to a treating method for hair growth inhibition, which comprises administering (A) the extract of a plant of the family Juniperus or a malt. In addition, the present invention relates to a dermatologic composition for external use, which comprises (B) an elastase inhibitor or neutral endopeptidase inhibitor, and the above-described component (A) and/or (C) at least one proteolytic enzyme selected from the group consisting of papain, trypsin, chymotrypsin, pepsin, bromelain, ficin and pancreatin.

Abstract: Provided are a water-soluble ginger root extract which is a water extract or a hydrous alcohol extract of a ginger root and is substantially free of gingerols; and a hair growth inhibitor and a preparation for external use each containing the extract. The water-soluble ginger root extract of the present invention causes less skin irritation because of being substantially free of gingerols, and has excellent body-hair growth inhibiting effects, so that it is useful as a hair grown inhibitor and a preparation for external use, each having a high degree of safety.

Abstract: Disclosed herein are a method of inhibiting hair growth, which comprises administering an inhibitor of elastase-like enzymes or a neutral endopeptidase inhibitor, and use of an inhibitor of elastase-like enzymes or a neutral endopeptidase inhibitor for the preparation of a hair-growth inhibitor.