Abstract: An electrical interconnect for an inkjet printhead comprising an ink-ejecting semiconductor die is described. The ink-ejecting die further comprises a substrate having an opposing upper surface, lower surface, and a thin film stack. The upper surface of the substrate is beveled on at least one edge such that a lower portion of the bevel is below an upper portion of the bevel. A conductive material trace is disposed on top of at least a portion of the upper surface and the thin film stack and on the bevel towards the lower portion of the bevel. An electrical conductor is coupled to the conductive material trace at a predetermined location below the upper portion of the bevel.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: A fluid ejection device capable of ejecting fluid onto media. The device includes a carrier having an upper surface that defines a recess. The device further includes a fluid ejecting substrate disposed therein that is configured for establishing electrical and fluidic coupling with the carrier. The fluid ejecting substrate has a generally planar orifice layer defining a plurality of orifices therein and a generally planar contact surface positioned below the orifice layer. The device further includes an encapsulant that at least partially encapsulates the fluid ejecting substrate and the carrier to form a substantially co-planar surface with the orifice layer.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: An inkjet printer printhead utilizes a substrate, an orifice layer, and a directionally biased electrostrictive polymer ink actuator disposed between the orifice layer and the substrate to eject ink from the printhead.

Abstract: An inkjet printer includes a printhead having a plurality of ink orifices formed therein. During printing, ink drops are ejected through the ink orifices into a print zone between the printhead and a print medium with an intended ink drop trajectory toward the print medium. An air movement system directs an air stream to the print zone substantially parallel to the intended ink drop trajectory as the ink drops are ejected during printing so as to affect air currents acting on the ink drops during printing and prevent print defects caused by the air currents. The air stream, however, does not disrupt the intended trajectory of the ink drops during printing.

Abstract: The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.

Abstract: In one embodiment, a fluid ejection device comprises a substrate having a fluid slot defined from a first surface through to a second opposite surface; an ejection element formed over the first surface and that ejects fluid therefrom; and a filter having feed holes positioned over the fluid slot near the first surface. Fluid moves from the second surface through the feed holes to the ejection element. In a particular embodiment, the filter is formed of a first material that is surrounded by a second material. In another particular embodiment, the filter is formed from the back side and is formed of the same material as the substrate.

Abstract: A monolithic inkjet printhead is formed using single-side fabrication processes. Printing elements and feed channels are formed by processes working from a top of the die. During formation of the printing elements filler material is applied to the feed channel. Such material is later removed by an anisotropic etch. Such etchant works from the top surface and a side edge of the substrate. The single-side fabrication process is distinguished from fabrication processes that work from a bottom of a die to form the feed channel and fill channels and work from a top of the die to form printing elements.

Abstract: When additional information is embedded into image data, both image quality and tolerance are improved. The image processing method includes the steps of: providing a plurality of pixels or a plurality of spatial-frequency components into which additional information is to be embedded; and changing the data value of the plurality of embedding pixels or spatial-frequency components in accordance with a value corresponding to the data value of the spatial-frequency components in order to embed the additional information.

Abstract: Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers. A phosphosilicate glass (PSG) layer, providing an insulation layer beneath the resistive layers, is etched back from the ink feed holes and is protected by a passivation layer to prevent the ink from interacting with the PSG layer. Other layers may also be protected from the ink by being etched back.

Abstract: A fluid ejection device includes a substrate, a stack of thin film layers and a further substrate. The substrate has a first surface and a second surface, and defines a fluid supply conduit. The stack of thin film layers has a first surface and a second surface, with the first surface of the stack of thin film layers being affixed to the second surface of the substrate. In one embodiment, the stack of thin film layers includes at least one ink energizing element, and defines a plurality of fluid filter openings that are in fluid communication with the fluid supply conduit of the substrate. The fluid filter openings function as a fluid. The further substrate has a first surface coupled to the second surface of the stack of thin film layers, and an exterior second surface.

Abstract: Inkjet printheads capable of printing smaller and larger drop-weight quantities of ink, and methods of manufacturing the inkjet printheads, are disclosed. The inkjet printhead includes a substrate. One or more portions of the substrate may be etched such that the substrate might have different thicknesses. A thin-film layer is connected to the substrate and contains independently addressable ink-energizing elements, preferably resistors. An orifice layer having a substantially planar exterior surface is applied directly to the thin-film layer. Consequently, the thickness of the orifice layer varies with the thickness of the substrate. At least one firing chamber is defined in each portion of the orifice layer with a different thickness and, preferably, different-sized resistors. Alternatively, the orifice layer has a substantially uniform thickness. In order to achieve the multiple drop-weight capability of the present invention, firing chambers of different volumes are provided.

Abstract: A porous foam based ink containment system is provided with grooves defined in the exterior portion thereof, for storing ink, while preventing ink leakage from the ink-jet pen. The grooves provide passageways to allow air diffused throughout the ink and trapped air bubbles within the foam to expand and move to the atmosphere. An atmospheric vent is in fluid communication with at least one of the grooves.

Abstract: Described herein is a monolithic printhead formed using integrated circuit techniques. Thin film layers, including ink ejection elements, are formed on a top surface of a silicon substrate. The various layers are etched to provide conductive leads to the ink ejection elements. At least one ink feed hole is formed through the thin film layers for each ink ejection chamber. A trench is etched in the bottom surface of the substrate so that ink can flow into the trench and into each ink ejection chamber through the ink feed holes formed in the thin film layers. An orifice layer is formed on the top surface of the thin film layers to define the nozzles and ink ejection chambers. A phosphosilicate glass (PSG) layer, providing an insulation layer beneath the resistive layers, is etched back from the ink feed holes and is protected by a passivation layer to prevent the ink from interacting with the PSG layer. Other layers may also be protected from the ink by being etched back.

Abstract: An inkjet printing device is arranged to employ a first set of multiple nozzle drop generators activated by a first address signal and a second set of multiple nozzle drop generators activated by a second address signal. The multiple nozzles of each drop generator of the first set are arranged in a predetermined geometric pattern, each of which encompasses at least one nozzle of a drop generator of the second set. The ink ejectors of one drop generator of the first drop generator set are arranged in subgroups, one subgroup of which shares a switched power return with one subgroup of ink ejectors of one drop generator of the second drop generator set.

Abstract: Pillars are formed in a fully integrated thermal inkjet printhead to prevent particles from entering into a nozzle chamber along an ink refill channel. The pillars are formed after a step of applying a thin film structure to a substrate. At one step, pits are etched through the thin film structure. At another step, material for an orifice layer is deposited into the pits. At another step, a firing chamber is etched into the orifice layer. At another step, a trench is etched into the backside of the wafer in the vicinity of the filled pits. The material filling each pit is not removed and remains in place to define the respective pillars. Two or more pillars are formed within the trench for each inkjet nozzle chamber. Alternatively pillars are formed by depositing material into the underside trench and performing photoimaging processes.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: Inkjet printheads capable of printing smaller and larger drop-weight quantities of ink, and methods of manufacturing the inkjet printheads, are disclosed. The inkjet printhead includes a substrate. One or more portions of the substrate may be etched such that the substrate might have different thicknesses. A thin-film layer is connected to the substrate and contains independently addressable ink-energizing elements, preferably resistors. An orifice layer having a substantially planar exterior surface is applied directly to the thin-film layer. Consequently, the thickness of the orifice layer varies with the thickness of the substrate. At least one firing chamber is defined in each portion of the orifice layer with a different thickness and, preferably, different-sized resistors. Alternatively, the orifice layer has a substantially uniform thickness. In order to achieve the multiple drop-weight capability of the present invention, firing chambers of different volumes are provided.