Abstract: A water vapor distribution measurement apparatus comprises: a light source that emits near-infrared light; a near-infrared light measurement device that is located across a measurement space from the light source and that measures the near-infrared light; an optical system that expands and applies the near-infrared light emitted from the light source in the measurement space in which a cross-section of the measurement space perpendicular to a direction connecting the light source to the near-infrared light measurement device has an area; and a distribution deriving means for deriving a water vapor distribution in the cross-section of the measurement space on the basis of a measurement result obtained by the near-infrared light measurement device. Water vapor in a measurement region having a prescribed size can be measured by this water vapor distribution measurement apparatus.

Abstract: A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

Abstract: A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.

Abstract: A method is disclosed for manufacturing a substrate soldered by a solder agent, which contains solder and a contained material that can be boiled at a temperature below a melting temperature of the solder. The method includes: setting the substrate onto a heat generation body heated to a first predetermined temperature, which is lower than a boiling point of the contained material and higher than an ordinary temperature; increasing a temperature of the substrate, which is set on the heat generation body, to a second predetermined temperature, which is lower than the melting temperature of the solder and is a reduction-enabling temperature, to reduce an oxide on the substrate by a reducing agent; and, after reduction, heating the substrate to a third predetermined temperature, which is equal to or higher than the melting temperature of the solder, to melt the solder.

Abstract: An oxide removing apparatus includes: a chamber; a discharge section configured to discharge a fluid from the chamber; a heating section configured to heat an object; a reducing gas supply section having a gasification device configured to produce a reducing gas; and a controller. The controller controls each component such that, after substantially all the fluid in the chamber is discharged, the reducing gas substantially fills the chamber at a pressure that is equal to or higher than 1000 Pa and lower than a saturated vapor pressure of the reducing gas, while the object is heated.

Abstract: A soldered product manufacturing device 1 includes a stage 13 on which a substrate W is placed, solder being arranged on the substrate W; a cover 16 configured to cover at least an upper part of the substrate W placed on the stage 13 at a predetermined distance therefrom; a chamber 11 configured to house the stage 13 and the cover 16; a heater 15 configured to heat the substrate W on the stage 13; and a reducing gas supply device 19 configured to supply a reducing gas F. A method for manufacturing a soldered product includes, by using the soldered product manufacturing device 1, placing the substrate W on the stage 13; covering the substrate W placed on the stage 13 with the cover 16; heating the substrate W; and supplying the reducing gas F into the chamber 11.

Abstract: The heating apparatus includes a chamber configured to accommodate an object, a stage on which the object is placed and partitioning an internal space of the chamber into a lower region and an upper region, a heating mechanism configured to heat the object on the stage, and a gas supplier configured to supply gas to the lower region. The chamber has an outlet port being formed in the upper region. The stage includes a gap through which the gas supplied to the lower region by the gas supplier flows from the lower region to the upper region along a wall surface of the chamber. The method includes providing the object in the chamber, supplying the gas such that the gas flows from the lower region to the upper region along a wall surface of the chamber, and effecting a solder joint by increasing a temperature of the object.

Abstract: A method for manufacturing a target object coated with a coating substance, whose edge face portions and flat face portion can be covered with the coating substance with a predetermined thickness, is provided. The target object T includes a flat face portion Tf and an edge face portion Te continuous from the portion Tf which includes a coating flat surface Tsp formed thereon which has a flat face. The portion Te includes a coating edge surface Tsc which includes at least one of a curved surface or a flat surface that is not parallel to the surface Tsp. The method includes a coating substance supply step of supplying the substance R along at least the surface Tsp, and an edge face portion coating substance adjustment step of adjusting the substance R supplied to the surface Tsc or moved from the surface Tsp to cover the surface Tsc at a predetermined thickness.

Abstract: A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T.

Abstract: A method for manufacturing a target object coated with a coating substance, whose edge face portions and flat face portion can be covered with the coating substance with a predetermined thickness, is provided. The target object T includes a flat face portion Tf and an edge face portion Te continuous from the portion Tf which includes a coating flat surface Tsp formed thereon which has a flat face. The portion Te includes a coating edge surface Tsc which includes at least one of a curved surface or a flat surface that is not parallel to the surface Tsp. The method includes a coating substance supply step of supplying the substance R along at least the surface Tsp, and an edge face portion coating substance adjustment step of adjusting the substance R supplied to the surface Tsc or moved from the surface Tsp to cover the surface Tsc at a predetermined thickness.

Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Abstract: A method for manufacturing a coated object and a coating substance spreading apparatus, which coat, as uniformly as possible, a coating substance on a curved coating target surface are provided. A method for manufacturing a coated object, the coated object being an object coated with a coating substance on a coating target surface Tf of the object T, the coating target surface Tf having a curved surface, includes dispensing the coating substance onto the coating target surface Tf; and revolving the object T, having the coating substance dispensed onto the coating target surface Tf, about a revolution axis 13a located remotely from the object T. A coating substance spreading apparatus 1 includes a revolution section 10 configured to revolve an object T about a revolution axis 13a located remotely from the object T.

Abstract: The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig.

Abstract: To provide a work processing apparatus equipped with a vaporizer that requires no carrier gas and can vaporize a vaporization target liquid having a relatively high flow rate, and a method for manufacturing a processed work. A vaporizer 1 includes a vaporization part 10 including a heat storage body 11 having a heat capacity higher than that of a vaporization target liquid Fq by a predetermined ratio, and a heat supplier 20 for supplying heat to the vaporization part 10. The predetermined ratio is a ratio of heat capacity at which a temperature drop of the heat storage body 11 by heat transfer from the heat storage body 11 to the liquid Fq flowing through a path 12 is within a predetermined range, wherein the amount of heat transferred from the heat storage body 11 to the liquid Fq is an amount of heat necessary to vaporize the liquid Fq at a planned proportion. A work processing apparatus 100 includes the vaporizer 1, a chamber 5, and a vacuum pump 6 for creating a negative pressure in the chamber 5.

Abstract: To provide a work processing apparatus equipped with a vaporizer that requires no carrier gas and can vaporize a vaporization target liquid having a relatively high flow rate, and a method for manufacturing a processed work. A vaporizer 1 includes a vaporization part 10 including a heat storage body 11 having a heat capacity higher than that of a vaporization target liquid Fq by a predetermined ratio, and a heat supplier 20 for supplying heat to the vaporization part 10. The predetermined ratio is a ratio of heat capacity at which a temperature drop of the heat storage body 11 by heat transfer from the heat storage body 11 to the liquid Fq flowing through a path 12 is within a predetermined range, wherein the amount of heat transferred from the heat storage body 11 to the liquid Fq is an amount of heat necessary to vaporize the liquid Fq at a planned proportion. A work processing apparatus 100 includes the vaporizer 1, a chamber 5, and a vacuum pump 6 for creating a negative pressure in the chamber 5.

Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.

Abstract: To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

Abstract: The present invention relates to a method for producing a soldered product by which soldering can be accomplished without using a jig.

Abstract: To provide a method for estimating a concentration of carboxylic acid gas, which is capable of measuring safely the concentration of carboxylic acid gas such as formic acid gas or the like in a chamber of a soldering apparatus in real time, and a soldering apparatus capable of estimating the concentration of the carboxylic acid gas in the chamber. The method includes the steps of measuring a surface temperature of a same object placed in the chamber at a same point in time by using a thermometer (first thermometer) for measuring a temperature without any influence of infrared absorption by carboxylic acid, and a radiation thermometer (second thermometer) for measuring a temperature by infrared in a wavelength region that the carboxylic acid absorbs, and estimating the concentration of the carboxylic acid gas in the chamber on the basis of a temperature difference (?Tx) between temperatures indicated by the first and second thermometers.