Abstract: A film removing apparatus comprises a substrate holding portion which holds a substrate having a coating film, a laser source which locally irradiates an alignment mark position of the substrate on the substrate holding portion with laser beams, and partially abrades the coating film from the substrate, a fluid supply mechanism including a main nozzle which supplies a predetermined fluid to the alignment mark position, a recovery mechanism having a suction opening which sucks the predetermined fluid supplied to the alignment mark position together with an abraded film component on the substrate, and a guide member which guides the predetermined fluid emitted from the main nozzle to the alignment mark position, and guides the predetermined fluid and the abraded film component to the suction opening of the recovery mechanism so as not to be diffused/leaked around the alignment mark position.