Patents by Inventor Naoyuki KUSHIHARA

Naoyuki KUSHIHARA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190355638
    Abstract: Provided are a heat-curable maleimide resin composition capable of yielding a cured product superior in tracking resistance; and a semiconductor device encapsulated by the cured product of such resin composition. The heat-curable maleimide resin composition for semiconductor encapsulation contains: (A) a maleimide compound being solid at 25° C., and having, per molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two maleimide groups; (B) an inorganic filler; and C) a curing accelerator.
    Type: Application
    Filed: May 9, 2019
    Publication date: November 21, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihiro Tsutsumi, Naoyuki Kushihara, Hiroki Oishi, Yoshihira Hamamoto, Yuki Kudo
  • Publication number: 20190338094
    Abstract: The present invention is a quartz glass fiber-containing prepreg, including: (A) at least one quartz glass fiber selected from the group consisting of a quartz cloth, a quartz chopped strand, a quartz nonwoven fabric, and a quartz wool; as well as a resin composition including (B) a maleimide compound that is a solid at 25° C., containing at least one dimer acid skeleton, at least one linear alkylene group having 6 or more carbon atoms, and at least two maleimide groups in the molecule; and (C) a curing accelerator, wherein the total content of uranium and thorium is 0 to 0.1 ppm. This provides a quartz glass fiber-containing prepreg to give a quartz glass fiber-containing substrate that is used as a PCB to prevent malfunction of a semiconductor device caused by the PCB to decrease transmission loss.
    Type: Application
    Filed: April 3, 2019
    Publication date: November 7, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoshihira HAMAMOTO, Yoshihiro TSUTSUMI, Naoyuki KUSHIHARA, Yuki KUDO
  • Publication number: 20190330414
    Abstract: Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).
    Type: Application
    Filed: April 9, 2019
    Publication date: October 31, 2019
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki Kushihara, Kazuaki Sumita
  • Patent number: 10407536
    Abstract: Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer. The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: September 10, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuaki Sumita, Naoyuki Kushihara
  • Patent number: 10385203
    Abstract: Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: August 20, 2019
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuaki Sumita, Tomoaki Nakamura, Naoyuki Kushihara
  • Publication number: 20190070837
    Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 7, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoichiro ICHIOKA, Naoyuki KUSHIHARA, Kazunori KONDO, Kazuaki SUMITA
  • Publication number: 20190070836
    Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 7, 2019
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Yoichiro ICHIOKA, Naoyuki KUSHIHARA, Kazuaki SUMITA, Kazunori KONDO
  • Publication number: 20180327542
    Abstract: An epoxy resin composition is provided comprising (A) an epoxy resin, (B) an aromatic amine-based curing agent in such amounts that an equivalent ratio of amino groups in component (B) to epoxy groups in component (A) ranges from 0.7/1 to 1.5/1, and (C) a curing accelerant in the form of arylborate salt. The composition has low-temperature curability and workability and is also improved in adhesion and adhesion retention.
    Type: Application
    Filed: May 10, 2018
    Publication date: November 15, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA, Akira YAJIMA
  • Publication number: 20180186925
    Abstract: Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer. The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.
    Type: Application
    Filed: February 26, 2018
    Publication date: July 5, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki SUMITA, Naoyuki KUSHIHARA
  • Patent number: 9972507
    Abstract: Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: May 15, 2018
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoyuki Kushihara, Kazuaki Sumita
  • Publication number: 20180112072
    Abstract: Provided is a liquid epoxy resin composition that is superior in workability and adhesion to a base material, and exhibits an unimpaired resin reliability even under a high-temperature and high-humidity environment. The liquid epoxy resin composition contains (A) an epoxy resin; (B) an imidazole-based curing accelerator; and (C) a maleimide compound. The weight-average molecular weight (Mw) of the maleimide compound (C) is 500 to 2,000, and a maleimide group equivalent per 1 mol of the maleimide compound (C) is 250 to 1,000 g/eq.
    Type: Application
    Filed: October 13, 2017
    Publication date: April 26, 2018
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA
  • Publication number: 20180066101
    Abstract: Provided is a heat-curable epoxy resin composition capable of yielding a cured product exhibiting a high heat resistance, a low water absorbability and a high strength. The composition of the invention is a heat-curable resin composition containing a liquid epoxy resin (A), an aromatic amine-based curing agent (B) and a cyclic carbodiimide compound (C). The aromatic amine-based curing agent (B) is added in an amount at which a total of all the amino groups in the aromatic amine-based curing agent (B) will be in an amount of 0.7 to 1.5 equivalents per one equivalent of all the epoxy groups in the liquid epoxy resin (A). The cyclic carbodiimide compound (C) is in an amount of 2 to 50 parts by mass per a total of 100 parts by mass of the liquid epoxy resin (A) and the aromatic amine-based curing agent (B).
    Type: Application
    Filed: August 16, 2017
    Publication date: March 8, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA
  • Publication number: 20180057663
    Abstract: Provided is a highly versatile heat-curable resin composition for semiconductor encapsulation that exhibits a favorable water resistance and abradability when used to encapsulate a semiconductor device; and a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-sized wafer. The heat-curable resin composition for semiconductor encapsulation comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule, and containing a particular cyanate ester compound that has a viscosity of not higher than 50 Pa·s; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; (D) an inorganic filler surface-treated with a silane coupling agent; and (E) an ester compound.
    Type: Application
    Filed: August 30, 2017
    Publication date: March 1, 2018
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki SUMITA, Tomoaki NAKAMURA, Naoyuki KUSHIHARA
  • Publication number: 20170362428
    Abstract: Provided is an epoxy resin composition exhibiting an unimpaired adhesion force by employing a particular acrylic resin that is highly compatible with epoxy resins. The epoxy resin composition of the invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a liquid acrylic resin, wherein the liquid acrylic resin (C) exhibits a weight-average molecular weight (Mw) of 2,000 to 20,000, a reactive functional group equivalent of 400 to 10,000 g/eq per one molecule, and a solvent content of not higher than 1% by mass.
    Type: Application
    Filed: May 11, 2017
    Publication date: December 21, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA
  • Publication number: 20170316956
    Abstract: Provided is an encapsulation method not causing molding failures such as filling failures and flow marks when collectively encapsulating a large-area silicon wafer or substrate with a resin composition. Specifically, provided is a method for encapsulating a semiconductor element-mounted base material, using a curable epoxy resin composition containing: an epoxy resin (A), a curing agent (B), a pre-gelatinizing agent (C) and a filler (D). The semiconductor element-mounted base material is collectively encapsulated under conditions of (a) molding method: compression molding, (b) molding temperature: 100 to 175° C., (c) molding period: 2 to 20 min and (d) molding pressure: 50 to 350 kN.
    Type: Application
    Filed: April 10, 2017
    Publication date: November 2, 2017
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA
  • Patent number: 9711378
    Abstract: The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 ?m as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: July 18, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Kazuaki Sumita, Tatsuya Uehara, Naoyuki Kushihara
  • Publication number: 20170174879
    Abstract: Provided is a liquid epoxy resin composition superior in rubber particle dispersibility, and exhibiting a lower elastic modulus without impairing a high heat resistance and mechanical strength that are inherent to epoxy resins. The liquid epoxy resin composition contains: (A) a liquid epoxy resin; (B) a rubber particle-dispersed epoxy resin composition containing (B-1) 50 to 90% by mass of a liquid epoxy resin; (B-2) 10 to 50% by mass of rubber particles, the rubber particles having an average particle diameter of 10 to 10,000 nm; (C) a curing agent; (D) an inorganic filler; and (E) a curing accelerator.
    Type: Application
    Filed: December 21, 2016
    Publication date: June 22, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA, Akira YAJIMA
  • Patent number: 9633921
    Abstract: Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: April 25, 2017
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoichi Osada, Naoyuki Kushihara, Ryuhei Yokota
  • Publication number: 20170058102
    Abstract: Provided is a heat-curable resin composition for use in electric and electronics industry which is suitable as an underfill and for performing potting, and is superior in fluidity, moisture resistance reliability and adhesiveness at a high temperature. The heat-curable resin composition of the invention contains (A) a heat-curable resin; and (B) a bismaleimide compound in liquid form at 25° C., and exhibits a viscosity of 1 mPa·s to 850 Pa·s when measured at 25° C. in accordance with a method described in JIS Z8803:2011.
    Type: Application
    Filed: August 23, 2016
    Publication date: March 2, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA
  • Publication number: 20170037238
    Abstract: The invention provides a curable epoxy resin composition having a superior workability and capable of forming a cured product with a thermal expansion resistance, a heat resistance, an adhesiveness and a low water absorbability. The composition is a heat-curable resin composition comprising: (A) an epoxy resin; (B) a carboxyl group-free curing agent; and (C) an annular carbodiimide compound, in which an equivalent ratio of the carboxyl group-free curing agent (B) to the epoxy resin (A) is 0.5 to 1.5, and the annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of the epoxy resin (A) and the carboxyl group-free curing agent (B).
    Type: Application
    Filed: August 3, 2016
    Publication date: February 9, 2017
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Naoyuki KUSHIHARA, Kazuaki SUMITA