Abstract: Provided is a resin composition that has a low viscosity when in the state of a composition, and provides a cured product having a high thermal conductivity, a high resin strength and a high adhesive force. The composition is a thermally conductive resin composition containing: (A) 100 parts by mass of a heat-curable resin containing at least one kind selected from an epoxy resin, a cyclic imide compound and a cyanate ester resin; and (B) a thermally conductive filler that has a thermal conductivity of not smaller than 10 W/m·K, and is in an amount of 100 to 3,000 parts by mass per 100 parts by mass of the component (A), wherein the component (B) contains therein 40 to 85% by mass of a thermally conductive filler (B1) that has an average particle size of 35 to 200 ?m and a specific surface area of not larger than 0.3 mm2/g.

Abstract: Provided is a heat-curable epoxy resin composition having an excellent flexibility when in an uncured state, an excellent storage stability and moldability, a high glass-transition temperature when in the state of a cured product, and an excellent adhesive force to a metal substrate, particularly to a Cu (alloy) substrate. The heat-curable epoxy resin composition contains: (A) a crystalline epoxy resin; (B) a non-crystalline epoxy resin solid at 25° C.; (C) a phenolic compound; (D) a nitrogen atom-containing curing accelerator; (E) a reaction inhibitor; and (F) an inorganic filler.

Abstract: Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

Abstract: Provided is a resin composition that has a low viscosity before curing, and is capable of being turned into a cured product having superior dielectric properties (low relative permittivity and low dielectric tangent), a low elastic modulus and also an excellent heat resistance. The resin composition is a heat-curable citraconimide resin composition containing: (A) a citraconimide compound having a saturated or unsaturated divalent hydrocarbon group(s) having 6 to 100 carbon atoms; (B) an epoxy resin having at least two epoxy groups in one molecule; and (C) a reaction promoter, wherein a mass ratio between the components (A) and (B) is (A):(B)=99:1 to 1:99.

Abstract: Provided is a resin composition that has a low melt viscosity, and is capable of being turned into a cured product having a high heat resistance, a high adhesion and a high glass-transition temperature, though having a low permittivity and a low dielectric tangent. The resin composition is a cyclic imide resin composition containing: (a) a cyclic imide compound represented by the following formula (1), (b) a cyclic imide compound represented by the following formula (2), and (c) a curing catalyst.

Abstract: A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa·s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

Abstract: The present invention is a method for producing a power module, including processes (1) to (4) in the following order: (1) a disposition process of disposing a thermosetting resin composition that is solid at 25° C. into a container housing an insulator substrate with multiple semiconductor components mounted thereon; (2) a melt process involving disposing the container having the thermosetting resin composition disposed therein into a molding apparatus capable of heating, pressurization, and depressurization, and heating the container to melt the thermosetting resin composition; (3) a pressurization-depressurization process of performing one or more depressurizations and one or more pressurizations inside the molding apparatus; and (4) a cure process of heating the inside of the molding apparatus to cure the thermosetting resin composition. This is to provide a method for producing a power module having few voids at the time of molding and excellent reliability.

Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.

Abstract: Provided are a heat-curable resin composition capable of being turned into a cured product having a high glass-transition temperature, a low dielectric tangent and a superior adhesion to a metal foil; and an adhesive agent, film, prepreg, laminate, circuit board as well as printed-wiring board using such heat-curable resin composition. The heat-curable resin composition contains: (A) a polyphenylene ether resin having reactive double bonds at molecular chain ends; (B) a (meth)acrylic acid ester compound; (C) a cyclic imide compound containing, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, and at least two cyclic imide groups; and (D) a reaction initiator.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) a phenolic curing agent; and (D) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength and excellent adhesion and flexibility, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Abstract: Provided is a heat-curable resin composition having an excellent workability, and capable of yielding a cured product having both a heat resistance and a low water-absorption property. The heat-curable resin composition contains: (A) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 50 to 140; (B) a cyanate ester compound having in one molecule at least two cyanato groups, and having a cyanate ester group equivalent of 150 to 500; and (C) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 20 to 85% by mass per a total of 100% by mass of the components (A) and (B), and the cyanate ester compound (B) is in an amount of 15 to 80% by mass per the total of 100% by mass of the components (A) and (B).

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

Abstract: Provided is a heat-curable resin composition exhibiting a superior handling property and workability in the form of a film, having a high adhesion to a base material, and capable of yielding a cured product with a low elasticity. The heat-curable resin composition contains: (A) 90 to 10 parts by mass of a silicone-modified epoxy resin; (B) 10 to 90 parts by mass of a maleimide compound having a weight-average molecular weight (Mw) of 2,500 to 50,000; and (C) a curing catalyst, provided that a total of the components (A) and (B) is 100 parts by mass.

Abstract: Provided are a heat-curable resin composition for semiconductor encapsulation that is capable of yielding a cured product superior in tracking resistance and dielectric property, and has a favorable continuous moldability; and a semiconductor device encapsulated by a cured product of such resin composition. The heat-curable resin composition for semiconductor encapsulation contains: (A) an epoxy resin other than a silicone-modified epoxy resin, being solid at 25° C.; (B) a silicone-modified epoxy resin; (C) a cyclic imide compound having, in one molecule, at least one dimer acid backbone, at least one linear alkylene group having not less than 6 carbon atoms, at least one alkyl group having not less than 6 carbon atoms, and at least two cyclic imide groups; (D) an organic filler; and (E) an anionic curing accelerator.

Abstract: Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: (A) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (B) an inorganic filler; and (C) a radical polymerization initiator. The semiconductor device is encapsulated by the cured product of such heat-curable resin composition.

Abstract: Provided are a resin composition superior in moldability, and capable of yielding a cured product exhibiting a low elastic modulus even at a high temperature and no decrease in glass-transition temperature and having a favorable reflow resistance and heat resistance; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition for semiconductor encapsulation, and contains: (A) an epoxy resin being solid at 25° C.; (B) an organopolysiloxane having, in one molecule, at least one cyclic imide group and at least one siloxane bond; (C) an inorganic filler; and (D) an anionic curing accelerator.