Abstract: The invention provides a curable epoxy resin composition having a superior workability and capable of forming a cured product with a thermal expansion resistance, a heat resistance, an adhesiveness and a low water absorbability. The composition is a heat-curable resin composition comprising: (A) an epoxy resin; (B) a carboxyl group-free curing agent; and (C) an annular carbodiimide compound, in which an equivalent ratio of the carboxyl group-free curing agent (B) to the epoxy resin (A) is 0.5 to 1.5, and the annular carbodiimide compound (C) is in an amount of 2 to 50 parts by mass with respect to a total of 100 parts by mass of the epoxy resin (A) and the carboxyl group-free curing agent (B).

Abstract: Provided is a versatile heat-curable resin composition for semiconductor encapsulation that has a favorable water resistance and abradability, and exhibits a superior fluidity and a small degree of warpage even when used to perform encapsulation on a large-size wafer. The heat-curable resin composition of the invention contains: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin; (C) a curing accelerator; and (D) a spherical inorganic filler.

Abstract: Provided is a resin composition superior in reliability and capable of forming a cured product exhibiting a small degree of heat decomposition (weight reduction) even when left under a high temperature of 200 to 250° C. for a long period of time and superior mechanical properties even under a high-temperature and high-humidity environment. The composition is a liquid resin composition comprising: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenol curing agent containing a resorcinol-type phenolic resin (C) an epoxy resin; and (D) a curing accelerator, in which the cyanate ester compound (A) is in an amount of 30 to 80 parts by mass with respect to 100 parts by mass of a sum total of the cyanate ester compound (A), the phenol curing agent (B) and the epoxy resin (C).

Abstract: Provided is a semiconductor encapsulation resin composition exhibiting an insignificant heat decomposition when left under a high temperature of 200 to 250° C. for a long period of time; and a superior reliability and adhesion to a Cu LF and Ag plating under a high-temperature and high-humidity environment. The composition comprises: (A) a cyanate ester compound having not less than two cyanato groups in one molecule; (B) a phenolic compound; (C) at least one epoxy resin; (D) a copolymer obtained by a hydrosilylation reaction of an alkenyl group-containing epoxy compound and an organopolysiloxane; and (E) at least one compound selected from a tetraphenylborate salt of a tetra-substituted phosphonium compound and a tetraphenylborate salt. A molar ratio of phenolic hydroxyl groups in (B) to cyanato groups in (A) is 0.08 to 0.25, and a molar ratio of epoxy groups in (C) and (D) to cyanato groups in (A) is 0.04 to 0.25.

Abstract: The present invention relates to a liquid epoxy resin composition for semiconductor sealing, which contains: (A) a liquid epoxy resin that does not contain a siloxane bond in each molecule; (B) an acid anhydride-based curing agent; (C) a surface-treated spherical inorganic filler which is a spherical inorganic filler having an average particle diameter of 0.1-10 ?m as determined by a laser diffraction method and serving as an inorganic filler, and wherein the surface of the spherical inorganic filler is surface-treated with 0.5-2.0 parts by weight of a (meth)acrylic functional silane coupling agent per 100 parts by weight of the spherical inorganic filler of the component (C); and (D) a curing accelerator. The present invention is able to provide a semiconductor device which has excellent heat resistance and moisture resistance.

Abstract: The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R1 and R2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3).

Abstract: Provided is a liquid underfill material composition which has a favorable curing property without adding a curing catalyst; a favorable thin film penetration ability derived from its low viscosity; a favorable adhesiveness; and a high heat resistance property. The liquid underfill material composition for sealing a semiconductor contains specific amounts of: (A) a cyanate ester resin having at least two cyanate groups in one molecule; (B) a phenolic curing agent including a resorcinol type phenol resin; and (C) an inorganic filler including (C-1) an inorganic filler (A) which is a silica having an average particle size of 0.1 to 3 ?m; and (C-2) an inorganic filler (B) which comprises an amorphous nanosilica having an average particle size of 5 to 70 nm.

Abstract: Provided are a resin composition for semiconductor encapsulation being fluid and exhibiting a low viscosity at a room temperature; and a semiconductor encapsulation method resulting in a small warpage even after performing molding through resin encapsulation i.e. a wafer level package-encapsulation method. The resin composition includes: (A) an alicyclic epoxy compound represented by formula 1: (B) an epoxy resin being liquid at a room temperature and an epoxy resin other than the alicyclic epoxy compound represented by formula 1; (C) an acid anhydride curing agent; (D) a curing accelerator; and (E) an inorganic filler, wherein the component (A) is in an amount of 30 to 95 parts by mass with respect to 100 parts by mass of all the epoxy resins in the total amount of the resin composition, and the component (E) is contained in the total amount of the resin composition by 80 to 95% by mass.

Abstract: The present invention can provide a heat-curable resin composition which is excellent in insulation property, heat resistance, and preservation stability. The heat-curable resin composition includes (A) cyanate ester compound having at least two cyanate groups in a molecule, (B) phenol curing agent including a resorcinol type phenol resin represented by the formula (1), (In the formula, n represents an integer from 0 to 10, each of R1 and R2 independently represents a monovalent group selected from a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an allyl group, and a vinyl group.), and (C) at least one compound selected from a tetraphenylborate of a tetra-substituted phosphonium compound and a tetraphenylborate represented by the formula (2). (In the formula, R3 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer from 1 to 3.