Abstract: An electric deionized water production apparatus in which a direct current field is applied to a deionizing chamber packed with an ion-exchange material such that ions to be discharged are allowed to migrate in the direction identical or opposite to the direction of the water flow in the ion-exchange material, whereby ionic impurities adsorbed in the ion-exchange material are discharged from the system, the ion-exchange material being a mixture of a monolith-shaped organic porous ion-exchange material and ion-exchange resin particles. The electric deionized water production apparatus has a simple structure that can reduce material cost, process cost, and assembly cost, capable of accelerating migration of the adsorbed ionic impurities to facilitate discharge of the adsorbed ions and free from a deflected flow due to swelling or shrinkage accompanying an ion-exchanging reaction, and from poor contact with an ion-exchange membrane.

Abstract: An electric deionized water production apparatus in which a direct current field is applied to a deionizing chamber packed with an ion-exchange material such that ions to be discharged are allowed to migrate in the direction identical or opposite to the direction of the water flow in the ion-exchange material, whereby ionic impurities adsorbed in the ion-exchange material are discharged from the system, the ion-exchange material being a mixture of a monolith-shaped organic porous ion-exchange material and ion-exchange resin particles. The electric deionized water production apparatus has a simple structure that can reduce material cost, process cost, and assembly cost, capable of accelerating migration of the adsorbed ionic impurities to facilitate discharge of the adsorbed ions and free from a deflected flow due to swelling or shrinkage accompanying an ion-exchanging reaction, and from poor contact with an ion-exchange membrane.

Abstract: In the electrodeionization deionized water producing apparatus, water is passed through a deionizing chamber(s) packed with an organic porous ion exchange material having a three-dimensional network structure to remove ionic impurities in the water, thereby producing deionized water. At the same time, a DC electric field is applied to the deionizing chamber(s) to discharge ionic impurities adsorbed on the organic porous ion exchange material outside the system, wherein the DC electric field is applied so that the ions to be discharged may electrophoretically move in the direction reverse to the flow of water through the organic porous ion exchange material.

Abstract: In the electrodeionization deionized water producing apparatus, water is passed through a deionizing chamber(s) packed with an organic porous ion exchange material having a three-dimensional network structure to remove ionic impurities in the water, thereby producing deionized water. At the same time, a DC electric field is applied to the deionizing chamber(s) to discharge ionic impurities adsorbed on the organic porous ion exchange material outside the system, wherein the DC electric field is applied so that the ions to be discharged may electrophoretically move in the direction reverse to the flow of water through the organic porous ion exchange material.

Abstract: A tape carrier package is provided, which includes: a line provided on one surface of a tape substrate; and a semiconductor chip mounted on an other surface of the tape substrate, the semiconductor chip having an electrode which is electrically connected to the line. The line extends from one end to an opposite end of the tape substrate and includes a connection where an intermediate line portion provided in a middle between the ends is electrically connected to the electrode.

Abstract: A tape carrier package comprising a tape carrier, a semiconductor chip, and an anisotropic conductive resin. The tape carrier includes an insulating film having a through-hole, a conductor pattern formed on the insulating film including leads projecting into the through-hole, and inner wiring electrically connected to a part of the conductor pattern. The semiconductor chip is provided in the through-hole and has connecting bumps electrically connected to end portions of the leads. The anisotropic conductive resin are provided so as to cover at least a portion of the semiconductor chip including a junction of the connecting bumps and the end portions of the leads.

Abstract: A tape carrier package is provided, which includes: a line provided on one surface of a tape substrate; and a semiconductor chip mounted on an other surface of the tape substrate, the semiconductor chip having an electrode which is electrically connected to the line. The line extends from one end to an opposite end of the tape substrate and includes a connection where an intermediate line portion provided in a middle between the ends is electrically connected to the electrode.

Abstract: A tape carrier package comprising a tape carrier, a semiconductor chip, and an anisotropic conductive resin. The tape carrier includes an insulating film having a through-hole, a conductor pattern formed on the insulating film including leads projecting into the through-hole, and inner wiring electrically connected to a part of the conductor pattern. The semiconductor chip are provided in the through-hole and has connecting bumps electrically connected to end portions of the leads. The anisotropic conductive resin are provided so as to cover at least a portion of the semiconductor chip including a junction of the connecting bumps and the end portions of the leads.

Abstract: A tape carrier package includes a semiconductor chip including a first row of electrode bumps formed on a surface of a semiconductor chip and a second row of electrode bumps formed on the surface of the semiconductor chip parallel to the first row. The tape carrier package also includes an insulating film, at least a portion of the insulating film being formed on the semiconductor chip, a conductor pattern including a first lead section formed on the insulating film and connectable to an external device and a second lead section extending from the first lead section so as to electrically connect to the first and second rows of electrode bumps. At least a part of the first lead section is positioned on the semiconductor chip. A sealing resin is provided for sealing at least a junction between the first and second rows of electrode bumps and the second lead section.

Abstract: A tape carrier comprises an insulating film and a pattern formed of a metal foil on at least one side surface of said film, said tape carrier being characterized in that an adhesive resin overcoat is applied to the pattern surface portion around a portion to be coated with an IC sealing resin, and a polyimide resin-based overcoat is applied to the remaining pattern surface portion.

Abstract: A tape carrier package of the invention includes: an insulating film having a device hole; a conductor pattern formed on the insulating film; and conductor leads electrically connected to the conductor pattern and projected inward beyond the edge of the device hole, and the conductor leads is electrically connected to electrode pads of a semiconductor chip. In this arrangement, the electrode pads of the semiconductor chip are arranged in at least two rows which are parallel to opposite two sides of the semiconductor chip, the two opposite rows of pads are disposed closer to the center of the two rows than to the edge of semiconductor chip, and the element-forming surface of the entire semiconductor chip containing the region between the insulating film and the semiconductor chip, is sealed with a sealing resin, except the part of the electrode pads.

Abstract: In a TCP (tape carrier package) semiconductor device having opposing, inner lead arrays bonded to a semiconductor device, a projection or projections are provided on each of the inner leads disposed at intervals of a greater distance on one side of the semiconductor, within a range for allowing the resin to flow out.

Abstract: In a semiconductor device of a tape carrier package type, the gap width between inner leads connected with a first edge side of a semiconductor chip set within a device mounting hole provided in the tape carrier is larger than the gap width between leads connected with a second edge side opposite to the first edge side of the semiconductor chip, and the gap length of device mounting hole between the first edge of the semiconductor chip and the first edge of the device mounting hole corresponding to the first edge of the semiconductor chip is smaller than the gap length between the second edge of the semiconductor chip and the second edge of the device mounting hole corresponding to the second edge of the semiconductor chip. Such structure enables an encapsulation resin to fill uniformly the device mounting hole, and the encapsulation resin after encapsulation has a shape of a designed dimension.

Abstract: A tape carrier comprises an insulating film and a pattern formed of a metal foil on at least one side surface of said film, said tape carrier being characterized in that an adhesive resin overcoat is applied to the pattern surface portion around a portion to be coated with an IC sealing resin, and a polyimide resin-based overcoat is applied to the remaining pattern surface portion.

Abstract: A liquid crystal panel module includes a liquid crystal panel and a plurality of tape carrier packages arranged along a side of the liquid crystal panel. A semiconductor element is attached to the tape carrier packages for operating the liquid crystal panel. Further, outer leads are disposed in the tape carrier packages on both sides of the semiconductor element and connected to each other between adjacent tape carrier packages. Finally, wires are disposed in the semiconductor element to electrically connect the outer leads, disposed on both sides of the semiconductor element, to each other.

Abstract: A board for installation in a liquid crystal panel with at least one slit at a portion thereof to be bent has a resin coating applied to a bridge portion of a conductive pattern formed over the slit. The resin coating resists external load applied during bending of the board. This board may be made by a method having the steps of punching a slit in the board corresponding to a position where the board is to be bent; forming a metal laminate on the board; forming a conductive pattern by etching the metal laminate; applying a resin coating capable of resisting an external load, which is applied during subsequent bending of the board, onto the conductive pattern across the slit; and curing the resin coating. The board is thereafter bent and installed in a liquid crystal panel.

Abstract: A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

Abstract: A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.

Abstract: A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.

Abstract: A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.