Patents by Inventor Naoyuki Tajima

Naoyuki Tajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making tape carrier semiconductor device
    Patent number: 5336650
    Abstract: A tape carrier semiconductor device has a resin sealed area not so larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.
    Type: Grant
    Filed: August 27, 1993
    Date of Patent: August 9, 1994
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yasunori Chikawa, Yoshiaki Honda, Katsunobu Mori, Naoyuki Tajima, Takaaki Tsuda, Takamichi Maeda
  • Tape carrier semiconductor device
    Patent number: 5281848
    Abstract: A tape carrier semiconductor device has a resin sealed area not much larger than the size of the semiconductor chip, e.g. substantially not exceeding 2 mm to the outside. A device hole is not larger than an area formed by extending the outer periphery of the semiconductor chip to the outside by 0.3 mm and an epoxy resin of 500-1200 ps in viscosity is used for sealing the chip.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: January 25, 1994
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Yasunori Chikawa, Yoshiaki Honda, Katsunobu Mori, Naoyuki Tajima, Takaaki Tsuda, Takamichi Maeda
  • Tab package and a liquid-crystal panel unit using the same
    Patent number: 5153705
    Abstract: A TAB package for packaging a semiconductor chip includes a flexible base plate having a first surface and a second surface opposite to the first surface, an input and output leads being formed on the second surface of the flexible base plate and capable of being connected to the semiconductor chip, and a plurality of slits being formed on the first surface of the flexible base plate. Accordingly, the TAB package is allowed to be easily bent and kept in the bending state. The slits are formed in a manner to correspond to the intervals between the adjacent input and output leads so that the input and output leads can be reliably supported by the flexible base plate.
    Type: Grant
    Filed: March 6, 1991
    Date of Patent: October 6, 1992
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Kazuhiko Fukuta, Naoyuki Tajima, Yasunori Chikawa, Takaski Tsuda, Takamichi Maeda
  • Tape carrier for semiconductor chips
    Patent number: 4949155
    Abstract: A tape carrier for semiconductor chips including an insulating tape; a plurality of first conductor patterns longitudinally formed on the tape and spaced from each other each of the first conductor patterns having first leads connected with substrate electrodes of a semiconductor chip and second lead connected with the other electrodes of the chip; a second conductor shaped like a stripe and disposed near each of the first conductor patterns on the tape; and a third conductor pattern formed on the tape and having conductors electrically connecting the first leads with the second conductor pattern.
    Type: Grant
    Filed: July 14, 1988
    Date of Patent: August 14, 1990
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Naoyuki Tajima, Takaaki Tsuda, Yasunori Chikawa