Abstract: Techniques are disclosed to provide a reference signal via a switched capacitor filter for image detector arrays in accordance with one or more embodiments. For an example embodiment, a method of providing a sampled and filtered reference signal to an image detector array includes receiving a reference signal; sampling the reference signal with a first capacitor to store a sampled reference signal based on the reference signal; coupling a second capacitor to the first capacitor to share charge stored on the first and second capacitors to generate the sampled and filtered reference signal to store on the second capacitor; and decoupling the second capacitor from the first capacitor, wherein the sampled and filtered reference signal is stored on the second capacitor to provide for one or more image detectors within the image detector array.

Abstract: A microbolometer circuit includes, in accordance with an embodiment, a first microbolometer and a bias circuit, coupled to the first microbolometer, configured to provide a bias current to the first microbolometer to provide a first output signal based on a resistance of the first microbolometer. An output circuit, coupled to the bias circuit and the first microbolometer, is configured to provide an output signal based on the first output signal, wherein the bias circuit or the output circuit or both are configured to provide a varying signal level to compensate the first output signal for a change in the resistance of the first microbolometer due to the bias current increasing a temperature of the first microbolometer.

Abstract: Systems and methods for microbolometer focal plane arrays provide for the selection of microbolometers within the microbolometer focal plane arrays. In accordance with an embodiment, a microbolometer focal plane array includes a plurality of microbolometers forming a microbolometer array, wherein contacts within the microbolometer array are shared by the microbolometers; a first plurality of switches adapted to provide a voltage to respective ones of the plurality of microbolometers; a second plurality of switches adapted to receive an output signal from respective ones of the plurality of microbolometers; and a third plurality of switches adapted to selectively short respective ones of the plurality of microbolometers in the microbolometer array.

Abstract: Systems and methods for microbolometer focal plane arrays are disclosed. For example, in accordance with an embodiment of the present invention, microbolometer focal plane array circuitry is disclosed for a microbolometer array having shared contacts between adjacent microbolometers. Various techniques may be applied to compensate for non-uniformities, such as for example, to allow operation over a calibrated temperature range.

Abstract: Systems and methods are disclosed for measuring a distance (or gap) between substrates of a hybrid semiconductor. The measurements may be made during a hybridization process to, for example, provide alignment feedback during the hybridization process. The measurements may also be made after the hybridization process to further calibrate the process or to provide information useful for further processing operations.

Abstract: Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to reduce non-uniform behavior over the desired operating temperatures. For example, the relative mismatch in the temperature coefficient of resistance of an active microbolometer and a reference microbolometer is compensated by employing a variable resistor in series with the active microbolometer. The variable resistor can be calibrated over the desired temperature range to minimize the affect of the relative mismatch. Various other circuit implementations, calibration methods, and processing of the microbolometer circuit output can be employed to provide further compensation.

Abstract: Systems and methods for microbolometer focal plane arrays are disclosed. For example, in accordance with an embodiment of the present invention, microbolometer focal plane array circuitry is disclosed for a microbolometer array having shared contacts between adjacent microbolometers. Various techniques may be applied to compensate for non-uniformities, such as for example, to allow operation over a calibrated temperature range.

Abstract: Two-stage auto-zero amplifier circuits are disclosed, along with methods of auto-zeroing such amplifier circuits. The two-stage auto-zero amplifier circuit may be part of an electronics signal chain coupled to a detector element to process an electronic signal induced by illumination. In an exemplary embodiment, the auto-zero amplifier circuit includes a first stage, which includes a low-noise fixed gain amplifier, capacitively coupled to a second stage, which includes a high gain amplifier. In an exemplary embodiment of a method of auto-zeroing the two-stage auto-zero amplifier circuit, a first terminal of the detector element is decoupled from the auto-zero amplifier circuit, and the first stage of the auto-zero amplifier circuit is locally referenced to a second terminal of the detector element. An auto-zero voltage for the auto-zero amplifier circuit is stored between the first stage of the auto-zero amplifier circuit and the second stage of the auto-zero amplifier circuit.

Abstract: Systems and methods are disclosed for measuring a distance (or gap) between substrates of a hybrid semiconductor. The measurements may be made during a hybridization process to, for example, provide alignment feedback during the hybridization process. The measurements may also be made after the hybridization process to further calibrate the process or to provide information useful for further processing operations.

Abstract: Microbolometer circuitry and methods are disclosed to allow an individual microbolometer or groups of microbolometers, such as a microbolometer focal plane array, to operate over a wide temperature range. Temperature compensation is provided, such as through circuitry and/or calibration methods, to reduce non-uniform behavior over the desired operating temperatures. For example, the relative mismatch in the temperature coefficient of resistance of an active microbolometer and a reference microbolometer is compensated by employing a variable resistor in series with the active microbolometer. The variable resistor can be calibrated over the desired temperature range to minimize the affect of the relative mismatch. Various other circuit implementations, calibration methods, and processing of the microbolometer circuit output can be employed to provide further compensation.

Abstract: An electro-optical sensor includes a detector pixel including a plurality of detector elements responsive to electromagnetic radiation, and a plurality of switches configurable to selectively combine signals from the detector elements in the detector pixel to provide a signal corresponding to a pixel in an image. The sensor may include a plurality of such detector pixels arranged, for example, in a linear array or in a two-dimensional array. Each of the detector pixels may have an associated group of switches configurable to selectively combine signals from the detector elements in the detector pixel.

Abstract: A dual sample-and-hold architecture in each unit cell of a read-in-integrated-circuit (RIIC) provides maximum frame rate without frame overlap. Analog pixel signals are updated sequentially in one sample-and-hold capacitor, while an emitter element displays a pixel of a display frame in response to a stored analog signal voltage on an isolated second sample-and-hold capacitor. After all unit cells are updated, the signals on the two capacitors are combined, updating all emitter elements for the next frame. A voltage mode amplifier as an emitter driver provides a more nearly linear dependence of infrared power output on signal voltage than do previous transconductance amplifiers. A digital to analog converter (DAC) on the RIIC substrate results in a simplified interface to the RIIC and in an increased immunity to noise.