Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: An automated high speed test solution for Quad Flat Pack device packages that enables connectivity between test equipment and the integrated circuit under test is described. A test probe geometry that provides highly repeatable and reliable connections suitable for use with consumer grade QFP devices coupled with ease of maintenance is provided. In some embodiments, the probe tip ends are chisel-shaped. The probes can be slightly slanted with respect to a vertical axis of the probe retaining block.

Abstract: High frequency operation of an integrated circuit test system is greatly extended by incorporation of a dedicated high frequency signal element that provides a circuit specific compensation network as part of the intermediation circuit board that enables connectivity between test equipment and the integrated circuit under test.

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.

Abstract: A test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact, for example, reliable grounding, with a corresponding plurality of DUT contacts when under a compliant force. Reliability and/or grounding can be accomplished by introducing a small angular differential between the bore axis of the upper block and the bore axis of the main block.

Abstract: A test probe contactor includes an angled depressible probe configuration that causes the tips of the compressible probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the depressible probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force. The contactor includes an upper block and a main block for housing the plurality of probes. The main block and the upper block include corresponding pluralities of slanted probe cavities. The upper bore axis of one or more of the upper probe cavities is laterally shifted relative to the main bore axis of a corresponding probe cavity of the main block, resulting in a lateral offset between the upper bore axis and the main bore axis.

Abstract: The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.

Abstract: A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

Abstract: A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

Abstract: A thermal control unit used to maintain a set point temperature on an integrated circuit device under test, has at least one cooling plate configured to facilitate the testing of integrated circuits where the device under test requires efficient cooling.

Abstract: In one embodiment of the present invention, a test probe assembly for testing packaged integrated circuit (IC) devices includes a plurality of probes, a pad and a PCB/interposer. The plurality of probes is configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contacts when under a compliant force. The pad provides mechanical support and/or electric coupling for the plurality of probes. In turn, the PCB/interposer supports the pad. In some embodiments, the plurality of probes includes a hard core material such as diamond. In other embodiments, the surface of the probes is hardened.

Abstract: A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

Abstract: A laminated heater socket useful in association with an integrated circuit (IC) device tester is having a socket with an embedded integrated heater. This laminated heater socket configuration allows for good thermal conductivity and better electrical signal transmission specially for testing high-speed integrated circuits.

Abstract: A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.

Abstract: The present invention relates to systems and methods for preventing over pressurization in a fluid management system used in an integrated circuit (IC) device tester. The prevention of the over pressurization in the fluid management system is based on the use of a pressure relief valve coupled to the fluid management system.

Abstract: A convex testing stack useful in association with a thermal control unit (TCU) that may be used to maintain a set point temperature for testing of a convex IC device under test (DUT) is configured to preserve the convex shape of the DUT.

Abstract: A test pusher assembly, useful in association with a thermal control unit used to maintain a set point temperature on an integrated circuit device under test, is provided with ejection mechanisms configured to facilitate the disengagement of the DUT at the end of the test. One example of the ejection mechanisms is to provide the substrate pusher assembly with spring-loaded pins that can push the substrate of the DUT away from the pedestal at the end of the test. Another example of the ejection mechanisms is to use a pressurized fluid that can push the substrate of the DUT away from the pedestal at the end of the test.

Abstract: A thermal control unit used to maintain a set point temperature on an integrated circuit device under test, has at least one cooling plate configured to facilitate the testing of integrated circuits where the device under test requires efficient cooling.