Abstract: A method of operating power system includes generating compressed air, providing the compressed air and fuel to fuel cell power modules, and providing a cathode exhaust from the power modules to a heat exchanger.

Abstract: A fuel cell system includes a plurality of fuel cell stacks or columns, each fuel cell stack or column containing a plurality of fuel cells, and at least one pressure drop tool located in a fuel path of at least one first fuel cell stack or column but not in a fuel path of at least one second fuel cell stack or column.

Abstract: A fuel cell system includes a plurality of fuel cell stacks or columns, each fuel cell stack or column containing a plurality of fuel cells, and at least one pressure drop tool located in a fuel path of at least one first fuel cell stack or column but not in a fuel path of at least one second fuel cell stack or column.

Abstract: Methods, apparatuses, and systems for real-time monitoring and automated intervention of a power generation. Embodiments may include receiving operating data from components of the power generation system. A potential failure condition for the components may be determined from real-time operating data of the received operating data before an occurrence of the potential failure condition. An alert may be issued in response to determining the real-time operating data indicates a potential failure condition, and instructions for remedying the potential failure condition may be transmitted to the power generation system. An algorithm for determining whether the real-time operating data indicates the potential failure condition may be updated by using preceding operating data in response to detecting the potential failure condition.

Abstract: Methods, apparatuses, and systems for real-time monitoring and automated intervention of a power generation. Embodiments may include receiving operating data from components of the power generation system. A potential failure condition for the components may be determined from real-time operating data of the received operating data before an occurrence of the potential failure condition. An alert may be issued in response to determining the real-time operating data indicates a potential failure condition, and instructions for remedying the potential failure condition may be transmitted to the power generation system. An algorithm for determining whether the real-time operating data indicates the potential failure condition may be updated by using preceding operating data in response to detecting the potential failure condition.

Abstract: Various embodiments include interconnects and/or end plates having features for reducing stress in a fuel cell stack. In embodiments, an interconnect/end plate may have a window seal area that is recessed relative to the flow field to indirectly reduce stress induced by an interface seal. Other features may include a thicker protective coating and/or larger uncoated area of an end plate, providing a recessed portion on an end plate for an interface seal, and/or recessing the fuel hole region of an interconnect relative to the flow field to reduce stress on the fuel cell. Further embodiments include providing intermittent seal support to minimize asymmetric seal loading and/or a non-circular seal configuration to reduce stress around the fuel hole of a fuel cell.

Abstract: An apparatus for monitoring a position of a semiconductor process fluid interface in a dispense nozzle includes an extended optical source adapted to provide an optical beam propagating along an optical path. The optical beam is characterized by a path width measured in a first direction aligned with a dispense direction. The apparatus also includes an optical detector coupled to the optical path and adapted to detect at least a portion of the optical beam and a dispense nozzle disposed along the optical path at a location between the extended optical source and the optical detector. The apparatus further includes a nozzle positioning member coupled to the dispense nozzle and adapted to translate the dispense nozzle in the first direction.

Abstract: A method of reducing a temperature of a bake plate within a semiconductor processing tool includes (a) providing a substrate and (b) transferring the substrate to a position adjacent the bake plate. The bake plate is characterized by an initial bake plate temperature greater than a set point temperature. The method also includes (c) reducing the temperature of the bake plate by a first predetermined amount and (d) transferring the substrate from the position adjacent the bake plate to a position adjacent a chill plate. The chill plate is characterized by a chill plate temperature less than the set point temperature.

Abstract: A substrate transport module adapted to transport a substrate in a processing chamber of a semiconductor processing apparatus. The substrate transport module includes a substrate cooling surface and a plurality of coolant channels disposed in the substrate transport module and in thermal communication with the substrate cooling surface. The substrate transport module also includes a plurality of vacuum channels disposed in the substrate transport module and a plurality of proximity pins extending to a predetermined height above the substrate cooling surface. Each of the plurality of proximity pins is in fluid communication with one or more of the plurality of vacuum channels.

Abstract: A method of performing a temperature set point change for a bake plate of a track lithography tool includes positioning a cooling surface of an actively chilled transfer shuttle adjacent a process surface of the bake plate. The actively chilled transfer shuttle includes the cooling surface and a transfer surface opposing the cooling surface. The method also includes monitoring a temperature of the bake plate, initiating a flow of a cooling fluid through one or more orifices provided on the cooling surface of the actively chilled transfer shuttle, and determining that the temperature of the bake plate has decreased by a predetermined temperature. The method further includes terminating the flow of the cooling fluid and moving the actively chilled transfer shuttle to a robot transfer position.

Abstract: An apparatus for monitoring a position of a semiconductor process fluid interface in a dispense nozzle includes an extended optical source adapted to provide an optical beam propagating along an optical path. The optical beam is characterized by a path width measured in a first direction aligned with a dispense direction. The apparatus also includes an optical detector coupled to the optical path and adapted to detect at least a portion of the optical beam and a dispense nozzle disposed along the optical path at a location between the extended optical source and the optical detector. The apparatus further includes a nozzle positioning member coupled to the dispense nozzle and adapted to translate the dispense nozzle in the first direction.

Abstract: A method of operating a multi-chamber module including a first chamber, a second chamber, and a dispense arm area positioned between the first chamber and the second chamber. The method includes flowing a process gas into the first chamber, the second chamber, and the dispense arm area. The method also includes exhausting a first gas from the first chamber using a first exhaust path in fluid communication with a shared exhaust, exhausting a second gas from the second chamber using a second exhaust path in fluid communication with the shared exhaust, and exhausting a third gas from the dispense arm area using a dispense arm area exhaust in fluid communication with the shared exhaust.

Abstract: An integrated thermal unit comprising a housing; a bake station positioned within the housing, the bake station comprising a bake plate configured to heat a substrate supported on a surface of the bake plate; a chill station positioned within the housing, the chill station comprising a chill plate configured to cool a substrate supported on a surface of the chill plate; and a substrate receiving station positioned within the housing, the substrate receiving station configured to hold a substrate; wherein the bake station, chill station and substrate receiving station are arranged in a vertical stack within the housing. In some embodiments the integrated thermal unit further comprises a substrate transfer shuttle positioned within the housing and adapted to transfer substrates between the substrate receiving station, bake station and chill stations.

Abstract: The present invention relates generally to control schemes for controlling the temperature of a heater plate of a thermal unit, e.g., of a track lithography tool. In accordance with certain embodiments of the invention, a cold wafer compensation offset value is added to an initial target heater plate temperature setpoint, and this setpoint plus offset is used to control the temperature of the heater plate prior to placement of a semiconductor wafer, e.g., via Proportional-Integral-Derivative (PID) control. Further, in accordance with certain embodiments, upon cold wafer placement, the temperature control is turned off until the temperature of the heater plate reaches the initial target heater plate temperature setpoint. The temperature control (e.g., PID control) is then reinstated, and the heater plate and wafer are controlled to steady state.

Abstract: A robotic manufacturing system may include multiple robots for transporting materials between a series of stages in a manufacturing process. To provide enhanced efficiency, each of these robots may independently operate according to a reverse process flow, cyclical schedule of operation.

Abstract: A robotic manufacturing system may include multiple robots for transporting materials between a series of stages in a manufacturing process. To provide enhanced efficiency, each of these robots may independently operate according to a reverse process flow, cyclical schedule of operation.

Abstract: In an automated processing system, a system controller uses a meta-heuristic technique for identifying an optimal or near-optimal control schedule for controlling movements and operations of a robot. In particular embodiments, the system controller uses a genetic algorithm to breed a control schedule for the robot. In particular embodiments, the system controller dynamically updates the control schedule based on system operation.

Abstract: Described are heating members and related methods, the heating members being usefully for processing substrates such as microelectronic devices, the heating members optionally and preferably comprising a thermal conductive layer prepared to a superior flatness and having thermal transfer properties that facilitate rapid, agile, and uniform heat transfer, with ceramic material being preferred for its construction, and the heating member optionally and preferably including a multi-layer heating element.

Abstract: In an automated processing system, a system controller uses a meta-heuristic technique for identifying an optimal or near-optimal control schedule for controlling movements and operations of a robot. In particular embodiments, the system controller uses a genetic algorithm to breed a control schedule for the robot. In particular embodiments, the system controller dynamically updates the control schedule based on system operation.

Abstract: In an automated processing system, a system controller uses a meta-heuristic technique for identifying an optimal or near-optimal control schedule for controlling movements and operations of a robot. In particular embodiments, the system controller uses a genetic algorithm to breed a control schedule for the robot. In particular embodiments, the system controller dynamically updates the control schedule based on system operation.