Abstract: A process and compositions are described for the reception of electrolytic or electroless plating onto non-platable substrates, in particular, semiconductor substrates. The process comprises immersion of the non-platable substrate in a promoter composition containing primary metal ions, selected from the group consisting of nickel, cobalt, iron, and copper, and mixtures thereof, and a suitable reducing agent. The reducing agent is capable of chemically reacting with the non-platable substrate and the primary metal ions and the concentration of the reducing agent relative to the primary metal ions is so adjusted as to permit the initial chemical interaction of the reducing agent with the non-platable substrate and then the heterogeneous reduction of some of the primary metal ions present in the promoter composition.

Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.

Abstract: Disclosed are processes and articles for composite electroless coatings comprising at least two distinct layers, the first layer comprising a metal and/or a metal alloy plus particulate matter and the second layer comprising a metal and/or a metal alloy and being substantially free of particulate matter.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a non-catalytic metallic surface. The process comprises contacting the non-catalytic surface with a promoter composition containing ions selected from the group of nickel, cobalt, iron and mixtures thereof and a suitable reducing agent, and thereafter contacting the substrate with an electroless plating bath comprising hypophosphite for the metallic build-up.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment prior to electroless (chemical) plating.

Abstract: A process is described for the reception of composite electroless plating onto a non-catalytic metal or non-catalytic alloy, non-catalytic to composite electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with a composite electroless plating bath comprising particulate matter to deposit a metallic layer with finely divided particulate matter dispersed throughout.

Abstract: Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

Abstract: A composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the admixture of a principal catalytic agent and a catalytic promoting agent. The principal catalytic agent is selected preferably from the metals of Period 4 and Groups IB and VIII of the Periodic Table of the Elements while the catalytic promoting agents are selected from metals of Period 4, 5, 6 and Groups IVB, VB, VIB, and VIIB of the Periodic Table of the Elements.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids having a nucleus of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions further contain copper (I) which renders the colloids a greater catalytic activity when used in the plating process as well as when used in photochemical activity.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

Abstract: A process, article produced therefrom, and compositions are described for the reception of electroless plating onto a substrate of a non-catalytic metal or non-catalytic alloy. The process comprises contacting the surface of the non-catalytic substrate with a promotor composition containing ions selected from the group of nickel, cobalt, iron, and mixtures thereof and a suitable reducing agent, and thereafter contacting the treated surface with an electroless plating bath comprising hypophosphite for metallic build-up.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrate by an electroless (chemical) coating process comprised contacting said substrate with a composition comprising an adsorption modifier and thereafter coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound.

Abstract: A composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the admixture of a principal catalytic agent and a catalytic promoting agent. The principal catalytic agent is selected preferably from the metals of Period 4 and Groups IB and VIII of the Periodic Table of the Elements while the catalytic promoting agents are selected from metals of Period 4, 5, 6 and Groups IVB, VB, VIB, and VIIB of the Periodic Table of the Elements.

Abstract: A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment of non-conductors prior to electroless (chemical) plating.

Abstract: A process for the preparation of non-conductors prior to electroless metal plating with a catalyst composition. The catalyst formulation comprises the product resulting from the admixture of an acid, a nucleophillic reactant, stannous ions, a hydrolyzable stannic compound, and precious metal ions. The stannous ions are in a molar excess relative to either the stannic compound or the precious metal ions.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.