Abstract: A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment prior to electroless (chemical) plating.

Abstract: Metallic surfaces are imparted to non-conductors or dielectric substrates by electroless (chemical) plating process comprised of coating the substrates with colloid(s) of non-precious metals and wherein the colloids are prepared in a manner as to impart resistance towards further deterioration.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.

Abstract: A composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the admixture of a principal catalytic agent and a catalytic promoting agent. The principal catalytic agent is selected preferably from the metals of Period 4 and Groups IB and VIII of the Periodic Table of the Elements while the catalytic promoting agents are selected from metals of Period 4, 5, 6 and Groups IVB, VB, VIB, and VIIB of the Periodic Table of the Elements.

Abstract: Metallic surfaces are imparted to non-conductive or di-electric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: In the electroless plating of dielectric or non-conductive substrates by first priming the surface of the substrate with aqueous solutions containing stannous and copper ions, followed by developing the substrate with a reducing agent capable of reducing the valence state of the copper ions, the substrate is contacted with a linking agent for the stannous ion either prior to or concurrently with the priming step permitting the use of lower amounts of stannous and copper ions while achieving improved plating and improved primer usefulness.

Abstract: A process is described for the reception of electrolytic or electroless plating onto a non-platable semiconductor substrate. The process comprises contacting of the semiconductor substrate with a promoter composition containing metal ions, preferably primary type, selected from the group consisting of nickel, cobalt, iron, and copper, and mixtures thereof, and a reducing agent selected from the group consisting of amine boranes, borohydrides, hydrazine, and derivatives thereof, and thereafter immersion of the substrate in conventional electrolytic or electroless plating baths, e.g., nickel or cobalt-hypophosphite type baths or copper-formaldehyde type baths, for the metallic build-up.

Abstract: A method for the formation of amorphous dispersions derived by the admixing of a stabilized colloidal dispersion of a higher degree of crystallinity with a modifier. The modified dispersions exhibit a shift towards lower particle size distribution. The resulting amorphous dispersions are useful in a wide variety of chemical processes ranging from catalysis and pigments to display devices.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal suspension further comprises antioxidant as to minimize the surface oxidation of the colloids and are further admixed in a manner resulting in good colloidal stability.

Abstract: A process for the preparation of non-conductors prior to electroless metal plating with a catalyst composition. The catalyst formulation comprises the product resulting from the admixture of an acid, a nucleophilic reactant, stannous ions, an hydrolyzable stannic compound, and precious metal ions. The stannous ions are in a molar excess relative to either the stannic compound or the precious metal ions.

Abstract: A process is described for the reception of electroless plating onto a non-catalytic metal or alloy substrate, non-catalytic to conventional electroless plating. The process comprises contacting the non-catalytic substrate with a promoter composition comprising ions selected from the group consisting of nickel, cobalt, iron and mixtures thereof; and a suitable reducing agent capable of chemically interacting with the non-catalytic metal or alloy and the metal ions in the promoter composition and further wherein the relative concentration of the reducing agent to metal ions is so adjusted as to yield first a reaction of the reducing agent with the non-catalytic metal or alloy and thereafter a heterogeneous reduction of the metal ions; and thereafter contacting the treated substrate with a conventional electroless plating bath, e.g, a nickel or cobalt-hypophosphite type bath or a copper-formaldehyde type bath for the metallic build-up.

Abstract: A process and method for the formation of novel colloidal catalytic electroless plating compositions comprising the admixture of at least one primary colloid stabilizer which otherwise renders the colloidal dispersion highly stable however weakly active with at least one secondary colloid stabilizer (or reactivity modifier) thereby activating the colloidal dispersion to a more active state when used in the catalytic treatment prior to electroless (chemical) plating.

Abstract: Electroless plating processes wherein a substrate is contacted with a catalytic composition, contacted with a reducing solution containing a deactivator and then contacted with an electroless plating solution.

Abstract: A process and composition for catalyzing a substrate prior to electroless metal deposition. The catalyst formulation comprises the colloidal product resulting from the admixture of a principal catalytic agent and a catalytic promoting agent. The principle catalytic agent is selected from the metals of Period 4 of Groups 1B and VIII of the Periodic Table of the Elements while the catalytic promoting agent is selected from the metals of Period 4, 5, 6 and Groups IVB, VB, VIB and VIIB of the Periodic Table of the Elements, and further the catalytic promoter agent is admixed subsequent to the colloid nucleation process.

Abstract: Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

Abstract: High efficiency deposition of silver onto substrates is obtained by utilizing admixed compositions comprising reducible silver ions, complexing agent, reducing agent in the presence of a promoter which is a soluble compound of germanium, tin or lead.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

Abstract: Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless (chemical) coating process comprised of coating the surface of the substrate with colloids of catalytic non-precious metals wherein the metals are either part of an alloy or in the elemental state or a compound and wherein the colloidal compositions are prepared by a special method which renders the colloids a greater catalytic activity when used in the plating process.

Abstract: A method for the formation of novel colloidal catalytic electroless plating compositions comprises admixing a highly stable non active (weakly active) colloidal dispersion with a reactivity modifier. The admixture so formed is used in electroless plating processes wherein a substrate is contacted with the novel colloidal catalytic composition, rinsed, contacted with a reducing or activating solution (which may be optional) and then contacted with an electroless plating solution.

Abstract: Catalysts for activating dielectric substrates preparatory to electroless metal deposition are prepared by admixing a soluble metal salt of a non-precious catalytic metal with a secondary compound which causes the formation of a colloidal dispersion and an extraneous colloid stabilizer. The substrates are immersed in the colloidal dispersion, rinsed, activated, rinsed, and then immersed in an electroless plating bath.