Patents by Inventor Natsuo Tatsumi

Natsuo Tatsumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10584428
    Abstract: A method of manufacturing a diamond by a vapor phase synthesis method includes: preparing a substrate including a diamond seed crystal; forming a light absorbing layer lower in optical transparency than the substrate by performing ion implantation into the substrate, the light absorbing layer being formed at a predetermined depth from a main surface of the substrate; growing a diamond layer on the main surface of the substrate by the vapor phase synthesis method; and separating the diamond layer from the substrate by applying light from a main surface of at least one of the diamond layer and the substrate to allow the light absorbing layer to absorb the light and cause the light absorbing layer to be broken up.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: March 10, 2020
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Kazuo Nakamae
  • Patent number: 10569317
    Abstract: A single-crystal diamond includes a pair of main surfaces facing each other, an impurity concentration being changed along a first direction in each of the main surfaces.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: February 25, 2020
    Assignees: Sumitomo Electric Industries, Ltd., Sumitomo Electric Hardmetal Corp.
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Takuya Nohara, Yutaka Kobayashi, Akihiko Ueda
  • Publication number: 20200040446
    Abstract: A method of manufacturing a diamond substrate includes: forming an ion implantation layer at a side of a main surface of a diamond seed substrate by implanting ions into the main surface of the diamond seed substrate; producing a diamond structure by growing a diamond growth layer by a vapor phase synthesis method on the main surface of the diamond seed substrate, after implanting the ions; and performing heat treatment on the diamond structure. The performed heat treatment causes the diamond structure to be separated along the ion implantation layer into a first structure including the diamond seed substrate and failing to include the diamond growth layer, and a diamond substrate including the diamond growth layer. Thus, the method of manufacturing a diamond substrate is provided that enables a diamond substrate with a large area to be manufactured in a short time and at a low cost.
    Type: Application
    Filed: October 16, 2019
    Publication date: February 6, 2020
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Takuji Okahisa, Yoshiyuki Yamamoto, Yoshiki Nishibayashi, Natsuo Tatsumi
  • Patent number: 10487395
    Abstract: A method of manufacturing a diamond substrate includes: forming an ion implantation layer at a side of a main surface of a diamond seed substrate by implanting ions into the main surface of the diamond seed substrate; producing a diamond structure by growing a diamond growth layer by a vapor phase synthesis method on the main surface of the diamond seed substrate, after implanting the ions; and performing heat treatment on the diamond structure. The performed heat treatment causes the diamond structure to be separated along the ion implantation layer into a first structure including the diamond seed substrate and failing to include the diamond growth layer, and a diamond substrate including the diamond growth layer. Thus, the method of manufacturing a diamond substrate is provided that enables a diamond substrate with a large area to be manufactured in a short time and at a low cost.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: November 26, 2019
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Takuji Okahisa, Yoshiyuki Yamamoto, Yoshiki Nishibayashi, Natsuo Tatsumi
  • Publication number: 20190218685
    Abstract: In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20°. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than ?5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20° relative to an orientation of a hole for wire drawing.
    Type: Application
    Filed: March 20, 2019
    Publication date: July 18, 2019
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Akihiko Ueda, Yutaka Kobayashi
  • Patent number: 10316430
    Abstract: Single crystal diamond of which hardness and chipping resistance have been improved in a balanced manner, a method for manufacturing the single crystal diamond, and a tool containing the diamond are provided. Single crystal diamond contains nitrogen atoms, and a ratio of the number of isolated substitutional nitrogen atoms in the single crystal diamond to the total number of nitrogen atoms in the single crystal diamond is not lower than 0.02% and lower than 40%.
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: June 11, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Akihiko Ueda, Yutaka Kobayashi
  • Patent number: 10287708
    Abstract: In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20°. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than ?5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20° relative to an orientation of a hole for wire drawing.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 14, 2019
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC HARDMETAL CORP.
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Akihiko Ueda, Yutaka Kobayashi
  • Publication number: 20190031515
    Abstract: Provided is a method for manufacturing a single-crystal diamond, the method including the steps of: forming a protective film on at least a part of a surface of an auxiliary plate; preparing a diamond seed crystal substrate; disposing an auxiliary plate with a protective film that has the protective film formed on the auxiliary plate, and a diamond seed crystal substrate in a chamber; and growing a single-crystal diamond on a principal surface of the diamond seed crystal substrate by a chemical vapor deposition method while introducing a carbon-containing gas into the chamber.
    Type: Application
    Filed: January 18, 2017
    Publication date: January 31, 2019
    Inventors: Takuya Nohara, Natsuo Tatsumi, Yoshiki Nishibayashi, Hitoshi Sumiya, Yutaka Kobayashi, Akihiko Ueda
  • Publication number: 20180236515
    Abstract: A single-crystal diamond includes a pair of main surfaces facing each other, an impurity concentration being changed along a first direction in each of the main surfaces.
    Type: Application
    Filed: October 14, 2016
    Publication date: August 23, 2018
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Takuya Nohara, Yutaka Kobayashi, Akihiko Ueda
  • Publication number: 20180209038
    Abstract: A method of manufacturing a diamond substrate includes: forming an ion implantation layer at a side of a main surface of a diamond seed substrate by implanting ions into the main surface of the diamond seed substrate; producing a diamond structure by growing a diamond growth layer by a vapor phase synthesis method on the main surface of the diamond seed substrate, after implanting the ions; and performing heat treatment on the diamond structure. The performed heat treatment causes the diamond structure to be separated along the ion implantation layer into a first structure including the diamond seed substrate and failing to include the diamond growth layer, and a diamond substrate including the diamond growth layer. Thus, the method of manufacturing a diamond substrate is provided that enables a diamond substrate with a large area to be manufactured in a short time and at a low cost.
    Type: Application
    Filed: June 25, 2015
    Publication date: July 26, 2018
    Inventors: Takuji Okahisa, Yoshiyuki Yamamoto, Yoshiki Nishibayashi, Natsuo Tatsumi
  • Publication number: 20180207697
    Abstract: A diamond die includes a diamond provided with a hole for drawing a wire material, the diamond being a CVD single-crystal diamond, an axis of the hole being inclined relative to a normal direction of a crystal plane of the diamond.
    Type: Application
    Filed: July 22, 2016
    Publication date: July 26, 2018
    Inventors: Makoto Yukawa, Bunya Suemitsu, Takuya Kinoshita, Shigetoshi Sumimoto, Yutaka Kobayashi, Akihiko Ueda, Natsuo Tatsumi, Yoshiki Nishibayashi, Hitoshi Sumiya
  • Publication number: 20170241042
    Abstract: In a single-crystal diamond material, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond material has a crystal growth main surface having an off angle of not more than 20°. A perforated tool includes a single-crystal diamond die, wherein in the single-crystal diamond die, a concentration of non-substitutional nitrogen atoms is not more than 200 ppm, a concentration of substitutional nitrogen atoms is lower than the concentration of the non-substitutional nitrogen atoms, and the single-crystal diamond die has a low-index plane represented by a Miller index of not less than ?5 and not more than 5 in an integer, a perpendicular line of the low-index plane having an off angle of not more than 20° relative to an orientation of a hole for wire drawing.
    Type: Application
    Filed: July 22, 2016
    Publication date: August 24, 2017
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Akihiko Ueda, Yutaka Kobayashi
  • Publication number: 20170233890
    Abstract: Provided are a diamond composite body capable of shortening a separation time for separating a substrate and a diamond layer, the substrate, and a method for manufacturing a diamond, as well as a diamond obtained from the diamond composite body and a tool including the diamond. The diamond composite body includes a substrate including a diamond seed crystal and having grooves in a main surface, a diamond layer formed on the main surface of the substrate, and a non-diamond layer formed on a substrate side at a constant depth from an interface between the substrate and the diamond layer.
    Type: Application
    Filed: August 10, 2015
    Publication date: August 17, 2017
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya
  • Publication number: 20170233889
    Abstract: A method of manufacturing a diamond by a vapor phase synthesis method includes: preparing a substrate including a diamond seed crystal; forming a light absorbing layer lower in optical transparency than the substrate by performing ion implantation into the substrate, the light absorbing layer being formed at a predetermined depth from a main surface of the substrate; growing a diamond layer on the main surface of the substrate by the vapor phase synthesis method; and separating the diamond layer from the substrate by applying light from a main surface of at least one of the diamond layer and the substrate to allow the light absorbing layer to absorb the light and cause the light absorbing layer to be broken up.
    Type: Application
    Filed: August 7, 2015
    Publication date: August 17, 2017
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Kazuo Nakamae
  • Publication number: 20170158514
    Abstract: In an X-ray topography image for a crystal growth main surface of a single-crystal diamond, a group of crystal defect points are gathered, each of the crystal defect points being a tip point of a crystal defect line reaching the crystal growth main surface, the crystal defect line representing a line in which a crystal defect exists. Further, in the single-crystal diamond, a plurality of crystal defect line-like gathered regions exist in parallel. In the plurality of crystal defect line-like gathered regions, groups of crystal defect points are gathered to extend in the form of lines in a direction angled by not more than 30° relative to one arbitrarily specified direction. Accordingly, a single-crystal diamond is provided which is used suitably for a cutting tool, a polishing tool, an optical component, an electronic component, a semiconductor material, and the like.
    Type: Application
    Filed: July 22, 2015
    Publication date: June 8, 2017
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Natsuo Tatsumi, Yoshiki Nishibayashi, Hitoshi Sumiya
  • Publication number: 20170130362
    Abstract: Single crystal diamond of which hardness and chipping resistance have been improved in a balanced manner, a method for manufacturing the single crystal diamond, and a tool containing the diamond are provided. Single crystal diamond contains nitrogen atoms, and a ratio of the number of isolated substitutional nitrogen atoms in the single crystal diamond to the total number of nitrogen atoms in the single crystal diamond is not lower than 0.02% and lower than 40%.
    Type: Application
    Filed: July 14, 2015
    Publication date: May 11, 2017
    Inventors: Yoshiki Nishibayashi, Natsuo Tatsumi, Hitoshi Sumiya, Akihiko Ueda, Yutaka Kobayashi
  • Patent number: 9403215
    Abstract: The present invention provides a cutting tool that achieves cutting with high precision. The cutting tool of the present invention includes a cutting edge composed of a polycrystalline body including high-pressure-phase hard grains that contain one or more elements selected from the group consisting of boron, carbon, and nitrogen, the polycrystalline body being formed by subjecting a non-diamond carbon material and/or boron nitride, serving as a starting material, to direct conversion sintering under ultra-high pressure and high temperature without adding a sintering aid or a catalyst, in which letting the radius of curvature of the nose of the cutting edge of the cutting tool be R1, the sintered grains constituting the polycrystalline body have an average grain size of 1.2×R1 or less and a maximum grain size of 2×R1 or less.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: August 2, 2016
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Natsuo Tatsumi, Katsuko Yamamoto, Hitoshi Sumiya
  • Publication number: 20140026492
    Abstract: The present invention provides a cutting tool that achieves cutting with high precision. The cutting tool of the present invention includes a cutting edge composed of a polycrystalline body including high-pressure-phase hard grains that contain one or more elements selected from the group consisting of boron, carbon, and nitrogen, the polycrystalline body being formed by subjecting a non-diamond carbon material and/or boron nitride, serving as a starting material, to direct conversion sintering under ultra-high pressure and high temperature without adding a sintering aid or a catalyst, in which letting the radius of curvature of the nose of the cutting edge of the cutting tool be R1, the sintered grains constituting the polycrystalline body have an average grain size of 1.2×R1 or less and a maximum grain size of 2×R1 or less.
    Type: Application
    Filed: April 10, 2012
    Publication date: January 30, 2014
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Natsuo Tatsumi, Katsuko Yamamoto, Hitoshi Sumiya
  • Patent number: 7902734
    Abstract: An electron emitting device 2 comprises an electron emitting portion 6 made of diamond. At an electron emission current value of 10 ?A or more, a deviation of the electron emission current value over one hour is within ±20% in the electron emitting device 2. The number of occurrence of step-like noise changing the electron emission current value stepwise is once or less per 10 minutes.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: March 8, 2011
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Yoshiyuki Yamamoto, Natsuo Tatsumi, Yoshiki Nishibayashi, Takahiro Imai
  • Patent number: 7710013
    Abstract: The present invention relates to an electron emitting device having a structure for efficiently emitting electrons. The electron emitting device has a substrate comprised of an n-type diamond, and a pointed projection provided on the substrate. The projection comprises a base provided on the substrate side, and an electron emission portion provided on the base and emitting electrons from the tip thereof. The base is comprised of an n-type diamond. The electron emission portion is comprised of a p-type diamond. The length from the tip of the projection (electron emission portion) to the interface between the base and the electron emission portion is preferably 100 nm or less.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: May 4, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Natsuo Tatsumi, Akihiko Namba, Yoshiki Nishibayashi, Takahiro Imai