Abstract: Embodiments disclosed herein include package substrates with antennas on the core. In an embodiment, a package substrate comprises a core with a first surface and a second surface. In an embodiment, a first conductive plane is formed into the core, where the first conductive plane is substantially orthogonal to the first surface, and a second conductive plane is formed into the core, where the second conductive plane is substantially orthogonal to the first surface. In an embodiment, an antenna is on the core, where the antenna is between the first conductive plane and the second conductive plane.

Abstract: Embodiments disclosed herein include electronic packages with magnetic features and methods of forming such packages. In an embodiment, a package substrate comprises a core and a conductive via through a thickness of the core. In an embodiment, a shell surrounds a perimeter of the conductive via and the shell is a magnetic material. In an embodiment, a surface of the conductive via is spaced away from the shell.

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating coaxial structures within glass package substrates. These techniques, in embodiments, may be extended to create other structures, for example capacitors within glass substrates. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include electronic packages with a core that includes an optical waveguide and methods of forming such electronic packages. In an embodiment, a package substrate comprises a core, and a photonics die embedded in the core. In an embodiment, the electronic package further comprises an optical waveguide embedded in the core. In an embodiment, the optical waveguide optically couples the photonics die to an edge of the core.

Abstract: Embodiments disclosed herein include coplanar waveguides and methods of forming coplanar waveguides. In an embodiment, a coplanar waveguide comprises a core, and a signal trace on the core. In an embodiment, the signal trace has a first edge and a second edge. In an embodiment, a first ground trace is over the core, and the first ground trace is adjacent to the first edge of the signal trace. In an embodiment, a first ground via plane is below the first ground trace. The coplanar waveguide may further comprise a second ground trace over the core, and the second ground trace is adjacent to the second edge of the signal trace. In an embodiment, a second ground via plane below the second ground trace.

Abstract: Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.

Abstract: Embodiments disclosed herein include package substrates and methods of fabricating such substrates. In an embodiment, a package substrate comprises a core with a first surface and a second surface opposite from the first surface. The package substrate further comprises a via hole through the core. In an embodiment the via hole comprises a first portion, a second portion, and a perforated ledge between the first portion and the second portion. In an embodiment, the package substrate further comprises a via filling the via hole.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related creating millimeter wave components within a glass core of a substrate within a semiconductor package. These millimeter wave components, which include resonators, isolators, directional couplers, and circulators, may be combined to form other structures such as filters or multiplexers. Other embodiments may be described and/or claimed.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to glass interposers or substrates that may be created using a glass etching process to enable highly integrated modules. Planar structures, which may be vertical planar structures, created within the glass interposer may be used to provide shielding for conductive vias in the glass interposer, to increase the signal density within the glass substrate and to reduce cross talk. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a core with a first surface and a second surface opposite from the first surface. In an embodiment, a buildup layer is over the first surface of the core. In an embodiment, a channel is through the core, where the channel extends in a direction that is substantially parallel to the first surface.

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to creating capacitors at the interface of a glass substrate. These capacitors may be three-dimensional (3-D) capacitors formed using trenches within the glass core of the substrate using laser-assisted etching techniques. A first electrode may be formed on the glass, including on the surface of trenches or other features etched in the glass, followed by a deposition of a dielectric material or a capacitive material. A second electrode may then be formed on top of the dielectric material. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein comprise package substrates and methods of forming such package substrates. In an embodiment, a package substrate comprises a core, where the core comprises glass. In an embodiment, an opening if formed through the core. In an embodiment, a magnetic region is disposed in the opening.

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a glass core, and a vertically oriented inductor embedded in the glass core. In an embodiment, the inductor comprises vertical vias through the glass core, and where the vertical vias are electrically coupled together by conductive traces over a surface of the glass core to provide a plurality of conductive turns.

Abstract: Low leakage thin film capacitors for decoupling, power delivery, integrated circuits, related systems, and methods of fabrication are disclosed. Such thin film capacitors include a titanium dioxide dielectric and one or more noble metal oxide electrodes. Such thin film capacitors are suitable for high voltage applications and provide low current density leakage.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.