Patents by Inventor Neelam Prabhu-Gaunkar

Neelam Prabhu-Gaunkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210408656
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 30, 2021
    Applicant: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Publication number: 20210408652
    Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
    Type: Application
    Filed: June 25, 2020
    Publication date: December 30, 2021
    Applicant: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu Gaunkar, Telesphor Kamgaing
  • Publication number: 20200304215
    Abstract: Embodiments may relate to a communications module comprising with a dispersion compensation module communicatively coupled between a baseband module and a radio frequency (RF) module. The dispersion compensation module may be configured to process a data signal at an intermediate frequency that is between a baseband frequency and a RF frequency. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Applicant: Intel Corporation
    Inventors: Diego Correas-Serrano, Georgios Dogiamis, Henning Braunisch, Neelam Prabhu-Gaunkar, Telesphor Kamgaing, Thomas W. Brown, Stefano Pellerano
  • Publication number: 20200304171
    Abstract: Embodiments may relate to a baseband module with communication pathways for a first data signal and a second data signal. The baseband module may also include a finite impulse response (FIR) filter in a communication path between the first signal input and the second signal output. Other embodiments may be described or claimed.
    Type: Application
    Filed: June 9, 2020
    Publication date: September 24, 2020
    Applicant: Intel Corporation
    Inventors: Henning Braunisch, Georgios Dogiamis, Diego Correas-Serrano, Neelam Prabhu-Gaunkar, Telesphor Kamgaing, Cooper S. Levy, Chintan S. Thakkar, Stefano Pellerano