Patents by Inventor Neil A. Edmunds
Neil A. Edmunds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11980011Abstract: A cold plate, comprises: a housing having a surface providing a thermal interface for cooling an electronic device; a channel within the housing proximate to the surface for a liquid coolant to flow therethough such that heat received by the thermal interface is transferred to the liquid coolant; and a coolant port extending outside the housing, for transferring liquid coolant to and/or from the channel. A cross-sectional area of an outlet from the coolant port to the channel may be no larger than that of the channel at the outlet. Pins and/or fins may be arranged within the channel adjacent to the coolant port. The coolant port may cause liquid coolant to enter and/or exit the channel in a direction perpendicular to the surface. The coolant port may comprise an independent rotating fluid connector thereby allowing adjustment in the direction of a pipe coupled to the coolant port.Type: GrantFiled: May 21, 2020Date of Patent: May 7, 2024Assignee: Iceotope Group LimitedInventors: Neil Edmunds, Alexander Cushen, Mustafa Kadhim
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Patent number: 11968802Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: March 16, 2023Date of Patent: April 23, 2024Assignee: Iceotope Group LimitedInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Patent number: 11963338Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.Type: GrantFiled: October 5, 2022Date of Patent: April 16, 2024Assignee: Iceotope Group LimitedInventors: Neil Edmunds, Jason Matteson, Nathan Longhurst, David Amos
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Publication number: 20240098944Abstract: A manifold is provided for distribution of dielectric coolant within a chassis, to allow the dielectric coolant to receive heat from at least one electronic component mounted within the chassis. The manifold comprises: a circuit board, having first and second opposing surfaces; and a substrate, at least partially spaced apart from the circuit board and a gap between a first surface of the circuit board and the substrate being configured to receive and contain dielectric coolant. One or more apertures are provided in the circuit board or substrate to allow dielectric coolant contained in the gap to flow across the opposing surfaces of the circuit board or substrate.Type: ApplicationFiled: December 14, 2021Publication date: March 21, 2024Inventors: Neil EDMUNDS, David AMOS
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Publication number: 20240032243Abstract: A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.Type: ApplicationFiled: November 18, 2021Publication date: January 25, 2024Inventors: Jason MATTESON, Neil EDMUNDS, David AMOS, William PAGE, Nathan LONGHURST, Mustafa KADHIM, Jasper KIDGER
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Patent number: 11778790Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.Type: GrantFiled: March 23, 2022Date of Patent: October 3, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: Neil Edmunds, Andrew Young, David Amos
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Patent number: 11737247Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.Type: GrantFiled: June 22, 2021Date of Patent: August 22, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: Neil Edmunds, Andrew Young, David Amos
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Patent number: 11726649Abstract: Systems and methods for presenting a sequence of medical images are provided herein. A use provides an input which indicates that additional frames are to be displayed. Frames from the sequence are displayed in succession, without skipping the display of any frames, based on a frame rate determined by an input provided by a user.Type: GrantFiled: January 10, 2020Date of Patent: August 15, 2023Assignee: MACH7 TECHNOLOGIES CANADA INC.Inventors: Bruno Monteiro Finelli, Scott Alexander Bohdanow, Neil Edmund James Hunt, Steven Andrew Rankin
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Publication number: 20230240042Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: March 16, 2023Publication date: July 27, 2023Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20230217629Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: March 16, 2023Publication date: July 6, 2023Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Patent number: 11653472Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: February 23, 2022Date of Patent: May 16, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20230096875Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.Type: ApplicationFiled: October 5, 2022Publication date: March 30, 2023Inventors: Neil Edmunds, Jason Matteson, Nathan Longhurst, David Amos
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Publication number: 20230083799Abstract: A housing is provided for mounting within an enclosure, for example a module for cooling electronic devices, that is arranged to contain a liquid coolant. The housing comprises: a wall structure, arranged to define a plurality of mounting chambers, each mounting chamber being configured to hold at least one respective electronic device and having a respective chamber coolant inlet for receiving liquid coolant, such that liquid coolant received through each chamber coolant inlet accumulates in the respective mounting chamber around the respective electronic device; a housing coolant inlet, for receiving liquid coolant from outside the housing; and a liquid coolant manifold, arranged to receive liquid coolant from the housing coolant inlet and provide the received liquid coolant to each of the chamber coolant inlets.Type: ApplicationFiled: February 11, 2021Publication date: March 16, 2023Inventors: Andrew SHAW, Jasper KIDGER, Neil EDMUNDS, David AMOS
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Patent number: 11596082Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: September 2, 2022Date of Patent: February 28, 2023Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20230029001Abstract: A cooling module for a printed circuit board having one or more heat generating components. The cooling module comprises a casing defining a first internal volume adapted for mounting a printed circuit board therein, the casing comprising a first internal major surface and a second internal major surface. The cooling module further comprises a chamber defining a second internal volume in fluid communication with the first internal volume. The first and/or second internal major surface comprises a first cavity. The first and/or second internal major surface further comprises a first channel connecting the first cavity to the second internal volume.Type: ApplicationFiled: December 24, 2020Publication date: January 26, 2023Inventors: Neil Edmunds, John Charlesworth
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Publication number: 20220418153Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: September 2, 2022Publication date: December 29, 2022Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20220418156Abstract: A cold plate is configured to use isolated primary and secondary liquid coolants and comprises: a thermally conductive body defining an internal volume and arranged for mounting with respect to an electronic device, so as to transfer heat from the electronic device to the internal volume; a coolant inlet for receiving the secondary liquid coolant into the internal volume to receive the transferred heat; and a coolant outlet for the secondary liquid coolant to flow out of the internal volume. The thermally conductive body is configured to define an external receptacle having a volume arranged to receive and retain the primary liquid coolant for heat transfer between the primary and secondary liquid coolants. The cold plate may form part of a system for cooling electronic devices.Type: ApplicationFiled: November 18, 2020Publication date: December 29, 2022Inventors: Alexander Cushen, Neil Edmunds, David Amos
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Patent number: 11490546Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.Type: GrantFiled: December 17, 2021Date of Patent: November 1, 2022Assignee: ICEOTOPE GROUP LIMITEDInventors: Neil Edmunds, Jason Matteson, Nathan Longhurst, David Amos
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Patent number: 11470739Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: GrantFiled: June 22, 2021Date of Patent: October 11, 2022Assignee: ICEOTOPE GROUP LIMITEDInventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst
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Publication number: 20220256734Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.Type: ApplicationFiled: February 23, 2022Publication date: August 11, 2022Inventors: David Amos, Neil Edmunds, Andrew Young, Jasper Kidger, Nathan Longhurst