Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: A cold plate, comprises: a housing having a surface providing a thermal interface for cooling an electronic device; a channel within the housing proximate to the surface for a liquid coolant to flow therethough such that heat received by the thermal interface is transferred to the liquid coolant; and a coolant port extending outside the housing, for transferring liquid coolant to and/or from the channel. A cross-sectional area of an outlet from the coolant port to the channel may be no larger than that of the channel at the outlet. Pins and/or fins may be arranged within the channel adjacent to the coolant port. The coolant port may cause liquid coolant to enter and/or exit the channel in a direction perpendicular to the surface. The coolant port may comprise an independent rotating fluid connector thereby allowing adjustment in the direction of a pipe coupled to the coolant port.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: Devices are provided that include a device housing defining and a maximum dielectric cooling liquid level, and a dielectric cooling liquid outlet weir in the device housing from which dielectric cooling liquid exits the interior space. The cooling liquid outlet weir can set the level of the dielectric cooling liquid within the interior space and establish a volumetric rate of flow of the dielectric cooling liquid within the interior space that is needed for the cooling of heat-generating electronic components.

Abstract: A mass spectrometry apparatus, including a mass spectrometer and a sample plate. The mass spectrometer includes: a sample plate holder configured to hold a sample plate in an engaged position. The mass spectrometer is configured to perform a mass spectrometric analysis of a sample only when the sample is located on a sample plate that is held in the engaged position by the sample plate holder. The mass spectrometer includes one or more engagement features configured to engage with a sample plate so as to prevent the sample plate from being held in the engaged position by the sample plate holder unless the sample plate includes one or more engagement features configured to limit use of the sample plate to a specific analytical technique or a range of analytical techniques to be performed using the mass spectrometer.

Abstract: A cooling module and/or a computing system comprising cooling modules are provided. The computing system may comprise: a server rack for holding computing units at different heights; at least two cooling modules for mounting in the server rack, comprising a first housing enclosing a first computing unit. The two cooling modules may house different types of information technology equipment, but have the same height. The cooling module may containing an electronic device and liquid coolant. It may have one or more of: a sidewall with a reinforcement adaptation; an lower and/or upper wall with a central portion that is close to the opposite wall an internal surface further from its outer surface than in another portion of the internal volume; a separable lid with an overlapping ridge; and a thermally conductive component passing through a sidewall.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant;. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: Systems and methods for presenting a sequence of medical images are provided herein. A use provides an input which indicates that additional frames are to be displayed. Frames from the sequence are displayed in succession, without skipping the display of any frames, based on a frame rate determined by an input provided by a user.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: An apparatus for cooling one or more heat generating components comprises: a sealable enclosure defining a volume for containing a first coolant and one or more heat generating components; a conduit surrounded by the volume, the conduit enabling a second coolant to enter and leave the enclosure, the conduit providing a fluid-tight seal between the first coolant and the second coolant when the first coolant within the volume surrounds the conduit; and a pump within the enclosure configured to direct the first coolant to the conduit such that heat is exchanged between the first coolant and the second coolant.

Abstract: An electrical interface provides an electrical connection to an electronic device immersed in a fluid. A circuit board has a plurality of surfaces on which electrical connections are provided. A connection port is mounted on a first surface for coupling with a corresponding connector that is electrically connected to the electronic device. A first electrical conductor is provided on the first surface and is connected to the connection port. A second electrical conductor is provided on a surface other than the first surface. The first electrical conductor is coupled to the second electrical conductor by a via comprising a hole in the electronic circuit board. A sealing gasket has an orifice and is mounted on the circuit board, such that: the connection port is accessible from the opposite side of the sealing gasket to the circuit board through the orifice; and the hole is covered by the sealing gasket.

Abstract: Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.

Abstract: A cooling system for cooling of a heat generating electrical component, in particular to reduce the likelihood of overheating of electrical components or chemical breakdown of coolant fluid. The cooling system has a coolant liquid to absorb excess energy from the heat generating electrical component, the coolant liquid having an energy input threshold above which chemical breakdown of the coolant liquid occurs. A cooling module defines a volume containing the coolant liquid, wherein the heat generating electrical component is mounted within the volume and immersed in the coolant liquid. A power input is arranged to supply power into the cooling module to the heat generating electrical component, and a power regulator is provided external to the volume of the cooling module and connected to the power input so as to regulate the power supplied into the cooling module.

Abstract: A method of producing hydrocarbons from a subterranean reservoir comprises pre-heating by exposure to electromagnetic radiation from a electromagnetic radiation source, injecting through at least one injection well a solvent into the reservoir to dilute the hydrocarbons contained in the pre-conditioned portion, and producing through at least one production well a mixture of hydrocarbons and solvent. An apparatus for producing hydrocarbons from a subterranean reservoir comprises at least one radio frequency antenna configured to transmit radio frequency energy into a subterranean reservoir, a power source to provide power to the at least one radio frequency antenna, at least one injection well configured to inject a solvent from a solvent supply source into the subterranean reservoir to lower the viscosity of the hydrocarbons, and at least one production well configured to produce a mixture comprising hydrocarbons and solvent from the subterranean reservoir.

Abstract: A method of producing hydrocarbons from a subterranean reservoir comprises pre-heating by exposure to electromagnetic radiation from a electromagnetic radiation source, injecting through at least one injection well a solvent into the reservoir to dilute the hydrocarbons contained in the pre-conditioned portion, and producing through at least one production well a mixture of hydrocarbons and solvent. An apparatus for producing hydrocarbons from a subterranean reservoir comprises at least one radio frequency antenna configured to transmit radio frequency energy into a subterranean reservoir, a power source to provide power to the at least one radio frequency antenna, at least one injection well configured to inject a solvent from a solvent supply source into the subterranean reservoir to lower the viscosity of the hydrocarbons, and at least one production well configured to produce a mixture comprising hydrocarbons and solvent from the subterranean reservoir.

Abstract: A method of producing hydrocarbons from a subterranean reservoir comprises pre-heating by exposure to electromagnetic radiation from a electromagnetic radiation source, injecting through at least one injection well a solvent into the reservoir to dilute the hydrocarbons contained in the pre-conditioned portion, and producing through at least one production well a mixture of hydrocarbons and solvent. An apparatus for producing hydrocarbons from a subterranean reservoir comprises at least one radio frequency antenna configured to transmit radio frequency energy into a subterranean reservoir, a power source to provide power to the at least one radio frequency antenna, at least one injection well configured to inject a solvent from a solvent supply source into the subterranean reservoir to lower the viscosity of the hydrocarbons, and at least one production well configured to produce a mixture comprising hydrocarbons and solvent from the subterranean reservoir.