Abstract: A method of producing vehicles comprises: in a vehicle production process, manufacturing vehicle components of different types, and assembling the vehicle components to form vehicles; creating a set of vehicle records, each being a record of one of the vehicles entering active service; performing vehicle repairs on a subset of the vehicles after they have entered active service; creating a respective record of each of the vehicle repairs, each of which comprises or indicates a vehicle age or usage value, and records a vehicle component fault identified in the vehicle repair; to receiving at a data processing stage the vehicle records and vehicle repair records, wherein a predictive algorithm executed at the data processing stage processes the received records so as to, for each type of vehicle component: 1) identify a respective set of the vehicle repair records relating to that type of vehicle component, and 2) use the respective set of vehicle repair records to predict a respective number of or resource val

Abstract: The invention relates to a system for manufacturing a plurality of integrated circuits, IC, mounted on a common support, the system comprising: an input station configured (adapted, arranged) to receive at least one common support; an output station configured (adapted, arranged) to receive at least one common support having a plurality of integrated circuits formed thereon; a plurality of processing modules each module being operable (configured, arranged, adapted) to perform at least one of the processing steps (e.g. deposition, patterning, etching) for forming an integrated circuit on the common support; a transfer means operable (configured, arranged, adapted) to transfer the at least one common support from the input station to the output station and to one or more of the processing modules therebetween; control means (e.g.

Abstract: Embodiments of the present disclosure are configured to assess the severity of a blockage in a vessel and, in particular, a stenosis in a blood vessel. In some particular embodiments, the devices, systems, and methods of the present disclosure are configured to assess the severity of a stenosis in the coronary arteries without the administration of a hyperemic agent.

Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

Abstract: A method of producing a product, for example a stretch blow moulded container having a metallic or pearlescent appearance, comprises selecting a mass, for example a container preform, comprising a thermoplastic polymer which incorporates a carrier polymer and stretching the thermoplastic polymer during production of said product, for example from said mass. Said carrier polymer is suitably polydimethylsiloxane and the mass may be made in a process which comprises contacting a thermoplastic polymer with a liquid formulation comprising carrier polymer and colourant.

Abstract: A gas turbine engine for an aircraft including a unit supplied with oil from a first oil circuit and a second oil circuit. The first oil circuit and the second oil circuit each are fluidly coupled with at least one inlet and with at least one outlet of the unit and with at least one inlet and with at least one outlet of an oil tank. The first oil circuit and the second oil circuit are configured to receive oil from the oil tank and to direct the received oil to the unit. The oil tank is incorporating offset outlets to each of the oil circuits. The offset outlet of the second oil circuit is positioned higher in the oil tank than the offset outlet of the first oil circuit.

Abstract: A gas turbine engine includes a gearbox receiving input from a core shaft and driving a fan at a lower speed than the core shaft. First and second oil circuits fluidly couple with an inlet and outlet of the gearbox. A third oil circuit fluidly couples with an inlet and outlet of the gearbox. The outlet of the gearbox includes a device directing oil from the gearbox to the first oil circuit, to the second oil circuit and to the third oil circuit when feeding to the gearbox exceeds a predefined oil flow rate, or deviates an operational value corresponding with that oil flow rate, and directs oil from the gearbox to the third oil circuit when feeding to the gearbox is the predefined flow rate or is a corresponding operational value or is greater than or equal to a further corresponding operational value.

Abstract: An exhaust system for an internal combustion engine (28) for controlling the release of undesirable emissions from the engine comprises an exhaust pipe (32) for receiving an exhaust flow from the engine, an SCR catalyst (48) arranged in the exhaust flow and means (80) for determining the temperature of the SCR catalyst. A NOx absorber (38), such as a diesel oxidation and NOx absorber catalyst (DONAC), is located in the exhaust flow at a position upstream of the SCR catalyst (48) for absorbing and releasing NOx contained in the exhaust flow. Means is provided for controlling the NOx absorber (38) so as to control the release of NOx to the SCR catalyst (48) in dependence on the temperature of the SCR catalyst, thereby to effect active management of release of NOx from the DONAC (38).

Abstract: A transistor is disclosed, comprising: a layer of semiconductor material comprising a first portion, a second portion, and a third portion connecting the first portion to the second portion and providing a semiconductive channel between the first portion and the second portion; a conductive first terminal covering and in electrical contact with said first portion of the layer of semiconductor material; a conductive second terminal covering and in electrical contact with said second portion of the layer of semiconductor material; a conductive gate terminal comprising a first overlapping portion covering at least part of the first terminal, and a channel portion covering the third portion of the layer of semiconductor material; and a layer of a first dielectric material, having a first dielectric constant, arranged between the first overlapping portion and the first terminal, and between the channel portion of the gate terminal and the third portion of the layer of semiconductor material.

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

Abstract: A method of producing a product, for example a stretch blow moulded container having a metallic or pearlescent appearance, comprises selecting a mass, for example a container preform, comprising a thermoplastic polymer which incorporates a carrier polymer and stretching the thermoplastic polymer during production of said product, for example from said mass. Said carrier polymer is suitably polydimethylsiloxane and the mass may be made in a process which comprises contacting a thermoplastic polymer with a liquid formulation comprising carrier polymer and colourant.

Abstract: A vertically integrated hybrid component is implemented in the form of a wafer level package including: at least two element substrates assembled one above the other; a molded upper sealing layer made of an electrically insulating casting; and an external electrical contacting of the component being implemented on the top side via at least one contact stamp which is embedded in the sealing layer so that (i) its lower end is connected to a wiring level of an element substrate and (ii) its upper end is exposed in the surface of the sealing layer.

Abstract: In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench.

Abstract: The present invention includes an oral pharmaceutical capsule comprising a shell, lanthanum carbonate or lanthanum carbonate hydrate, and a lubricant such as talc, wherein the shell encapsulates the lanthanum carbonate or its hydrate and the lubricant. Capsule shells comprise, for example, gelatin. The present invention also includes an oral pharmaceutical powder comprising lanthanum carbonate or lanthanum carbonate hydrate and a pharmaceutically acceptable excipient. The oral pharmaceutical capsules and powders of the present invention can be administered to treat a patient at risk of or suffering from hyperphosphatemia, at risk of or suffering from chronic kidney disease (CKD), at risk of or suffering from soft tissue calcification associated with CKD, or at risk of or suffering from secondary hyperparathyroidism.

Abstract: The present invention includes an oral pharmaceutical capsule comprising a shell, lanthanum carbonate or lanthanum carbonate hydrate, and a lubricant such as talc, wherein the shell encapsulates the lanthanum carbonate or its hydrate and the lubricant. Capsule shells comprise, for example, gelatin. The present invention also includes an oral pharmaceutical powder comprising lanthanum carbonate or lanthanum carbonate hydrate and a pharmaceutically acceptable excipient. The oral pharmaceutical capsules and powders of the present invention can be administered to treat a patient at risk of or suffering from hyperphosphatemia, at risk of or suffering from chronic kidney disease (CKD), at risk of or suffering from soft tissue calcification associated with CKD, or at risk of or suffering from secondary hyperparathyroidism.

Abstract: The present invention includes an oral pharmaceutical capsule comprising a shell, lanthanum carbonate or lanthanum carbonate hydrate, and a lubricant such as talc, wherein the shell encapsulates the lanthanum carbonate or its hydrate and the lubricant. Capsule shells comprise, for example, gelatin. The present invention also includes an oral pharmaceutical powder comprising lanthanum carbonate or lanthanum carbonate hydrate and a pharmaceutically acceptable excipient. The oral pharmaceutical capsules and powders of the present invention can be administered to treat a patient at risk of or suffering from hyperphosphatemia, at risk of or suffering from chronic kidney disease (CKD), at risk of or suffering from soft tissue calcification associated with CKD, or at risk of or suffering from secondary hyperparathyroidism.

Abstract: The present invention includes an oral pharmaceutical capsule comprising a shell, lanthanum carbonate or lanthanum carbonate hydrate, and a lubricant such as talc, wherein the shell encapsulates the lanthanum carbonate or its hydrate and the lubricant. Capsule shells comprise, for example, gelatin. The present invention also includes an oral pharmaceutical powder comprising lanthanum carbonate or lanthanum carbonate hydrate and a pharmaceutically acceptable excipient. The oral pharmaceutical capsules and powders of the present invention can be administered to treat a patient at risk of or suffering from hyperphosphatemia, at risk of or suffering from chronic kidney disease (CKD), at risk of or suffering from soft tissue calcification associated with CKD, or at risk of or suffering from secondary hyperparathyroidism.

Abstract: A vertically integrated hybrid component is implemented in the form of a wafer level package including: at least two element substrates assembled one above the other; a molded upper sealing layer made of an electrically insulating casting; and an external electrical contacting of the component being implemented on the top side via at least one contact stamp which is embedded in the sealing layer so that (i) its lower end is connected to a wiring level of an element substrate and (ii) its upper end is exposed in the surface of the sealing layer.