Abstract: In one embodiment, harmful solar cell polarization is prevented or minimized by providing a conductive path that bleeds charge from a front side of a solar cell to the bulk of a wafer. The conductive path may include patterned holes in a dielectric passivation layer, a conductive anti-reflective coating, or layers of conductive material formed on the top or bottom surface of an anti-reflective coating, for example. Harmful solar cell polarization may also be prevented by biasing a region of a solar cell module on the front side of the solar cell.

Abstract: A carrier for use in processing of a plurality of wafers or other substrates includes a support frame on which the wafers are mounted and in one embodiment at least one auxiliary frame for holding the substrates on the support frame. A plurality of clips extend from the auxiliary frame and engage the substrates in pressure engagement, and fasteners retain the auxiliary frame in position with respect to the support frame. In one embodiment two auxiliary frames can be employed for holding wafers on opposing surfaces of the support frame. The support frame has electrically non-conducting surfaces whereby the processing does not affect the support frame, and the auxiliary frame is made of electrically non- conductive material. The clips are electrically conductive and bridge current from the support frame to the wafers during plating operations. In another embodiment, auxiliary frame are not used and the wafer retention clips are mounted on the support frame.

Abstract: In one embodiment, backside-contact solar cells in a solar cell array are connected using separate pieces of interconnect leads. Each interconnect lead may electrically connect a contact point on a backside-contact solar cell to a corresponding contact on another backside-contact solar cell. Each interconnect lead may be curved to provide strain relief.

Abstract: In one embodiment, a solar cell is fabricated using an ink pattern as a mask for a processing step. The ink pattern may comprise an ink that is substantially devoid of particles that may scratch a surface on which the ink pattern is formed. The ink pattern may be formed by screen printing. In one embodiment, the ink pattern is formed on an oxide layer and comprises an ink that is substantially free of silicon dioxide particles. The ink pattern may be employed as an etching or deposition mask, for example.

Abstract: Screen printing to an edge of an object without the flow of print ilk over the edge and to a supporting platen is realized by applying a flow of gas from the platen over the edge of the object and opposing the flow of print ink. The platen can have a support surface including a groove or a plurality of holes arranged to match the edge of the wafer. The wafer can include a semiconductor wafer such as a photovoltaic cell, and the gas can include air, nitrogen, or an inert gas.