Abstract: An apparatus for continuous electro-thermal poling of glass or glass ceramic material, includes a lower support conveying and contacting electrode structure, an upper contacting electrode structure positioned above the lower support structure, and one or more DC bias voltage sources connected to one or both of the upper contacting structure and the lower support structure. A process for continuous electro-thermal poling of glass or glass ceramic sheets or substrates includes heating the sheet or substrate, feeding the sheet or substrate continuously or continually, while applying a DC voltage bias, and cooling the sheet or substrate to within 0-30° C. of ambient temperature.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass or glass-ceramic carrier substrate, the substrate having undergone at least one complete cycle of a semiconductor fabrication process and having also undergone a reclamation process following the end of the semiconductor fabrication process; the glass or glass-ceramic carrier substrate comprising at least one of the following properties: (i) a coefficient of thermal expansion of less than 13 ppm/° C.; (ii) a Young's Modulus of 70 GPa to 150 GPa; (iii) an IR transmission of greater than 80% at a wavelength of 1064 nm; (iv) a UV transmission of greater than 20% at a wavelength of 255 nm to 360 nm; (v) a thickness tolerance within the same range as the thickness tolerance of the carrier substrate before undergoing at least one complete cycle of the semiconductor fabrication process; (vi) a total thickness variation of less than 2.5 ?m; (vii) a failure strength of greater than 80 MPa using a 4-point-bending test; (viii) a pre-shape of 50 ?m to 300 ?m.

Abstract: An apparatus for continuous electro-thermal poling of glass or glass ceramic material, includes a lower support conveying and contacting electrode structure, an upper contacting electrode structure positioned above the lower support structure, and one or more DC bias voltage sources connected to one or both of the upper contacting structure and the lower support structure. A process for continuous electro-thermal poling of glass or glass ceramic sheets or substrates includes heating the sheet or substrate, feeding the sheet or substrate continuously or continually, while applying a DC voltage bias, and cooling the sheet or substrate to within 0-30° C. of ambient temperature.

Abstract: A stack assembly is provided that includes a glass layer having a thickness, a first and second primary surface and a compressive stress region extending from the second primary surface to a first depth; and a second layer coupled to the second primary surface. The glass layer is characterized by: an absence of failure when the layer is held at a bend radius from about 3 to 20 mm, a puncture resistance of greater than about 1.5 kgf when the second primary surface is supported by (i) an ˜25 ?m thick PSA and (ii) an ˜50 ?m thick PET layer, and the first primary surface is loaded with a stainless steel pin having a flat bottom with a 200 ?m diameter, a pencil hardness of at least 8H, and a neutral axis within the glass layer located between the second primary surface and half of the first thickness.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Abstract: A glass substrate with modified surface regions is disclosed. The glass substrate includes a first side and an opposite second side, an alkali-containing bulk disposed between the first and second sides, and a first alkali-depleted region formed in the alkali-containing bulk on the first side. The first alkali-depleted region defines at least a portion of a first topographical feature. The first topographic feature includes a height that extends in a first direction from a base portion of the first topographical feature to an outermost portion of the first topographical feature. The first direction is oriented parallel to a thickness of the glass substrate between the first and second sides. The first topographic feature also includes a width that extends in a second direction between at least two, spaced apart wall portions of the first topographical feature. The second direction is oriented normal to the first direction.

Abstract: A glass substrate with modified surface regions is disclosed. The glass substrate includes an alkali-containing bulk, a first alkali-depleted region, a second alkali-depleted region, and a first ion-exchanged region. The alkali-containing bulk has a first surface and a second surface with the first and second surfaces on opposite sides. The first alkali-depleted region extends into the alkali-containing bulk from the first surface. The second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first ion-exchanged region extends into the alkali-containing bulk from the first surface. The first alkali-depleted region, the second alkali-depleted region, and the first ion-exchanged region each have a substantially homogenous composition. A method of forming the glass substrate is disclosed. The method includes simultaneously forming the first alkali-depleted region and the first ion-exchanged region in the first surface.

Abstract: A glass substrate according to one or more embodiments is disclosed. The glass substrate includes an alkali-containing bulk, at least one first alkali-depleted region, and at least one second alkali-depleted region. The alkali-containing bulk has a first surface and a second surfaces with the first and second surfaces opposing one another. The at least one first alkali-depleted region extends into the alkali-containing bulk from the first surface. The at least one second alkali-depleted region extends into the alkali-containing bulk from the second surface. The first alkali-depleted region and the second alkali-depleted region are amorphous and have a substantially homogenous composition. The first alkali-depleted region in some embodiments is a first alkali-depleted surface layer that extends across the alkali-containing bulk. The first alkali-depleted region in some embodiments is plurality of first alkali-depleted regions that are spaced apart from one another.

Abstract: In some aspects, the techniques described herein relate to a tablet keyboard system for a creating a laptop experience with a clamshell design, including: a backplate bottom edge being flush with the bottom frame boundary when the tablet keyboard system is in a closed position, and below the bottom frame boundary when the tablet keyboard system is in an open position allowing the tablet keyboard system to pivot the frame front edge in an upwards position creating an angle between the bottom frame boundary and a resting surface of the bottom frame boundary for optimizing an ergonomic typing position for a user. Furthermore, an inverse object system including: an inverse object tab for contact with a thumb of the user; and an inverse object recession recessed for contact with an index finger of the user are used with the tablet keyboard system.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: A light guide plate that includes a glass substrate including an edge surface and at least two major surfaces defining a thickness and an edge surface, the edge surface configured to receive light from a light source and the glass substrate configured to distribute the light from the light source, wherein the glass substrate comprises an alkali-containing bulk and an alkali-depleted surface layer, the alkali-depleted surface layer comprising about 0.5 atomic % alkali or less. Display products and methods of processing a glass substrate for use as a light guide plate are also provided.

Abstract: Embodiments of a glass substrate including an alkali-containing bulk and an alkali-depleted surface layer, including a substantially homogenous composition with at least 51 mol % Al2O3 are disclosed. In some embodiments, the alkali-depleted surface layer includes about 0.5 atomic % alkali or less. The alkali-depleted surface layer can be substantially free of hydrogen and/or crystallites. Methods for forming a glass substrate with a modified surface layer are also provided.

Abstract: A glass glass-ceramic composite comprises a substrate comprising an alkali-containing glass bulk, the bulk comprising Al2O3 and SiO2 and alkali, and a glass-ceramic surface layer, the surface layer comprising an alkali-depleted glass ceramic comprising Al2O3 and SiO2 with at least 5% crystalline phase by volume, wherein the alkali-depleted glass ceramic surface layer comprises a mol % Al2O3 of at least 51%. A method of preparing the composite is also disclosed.

Abstract: An apparatus for continuous electro-thermal poling of glass or glass ceramic material, includes a lower support conveying and contacting electrode structure, an upper contacting electrode structure positioned above the lower support structure, and one or more DC bias voltage sources connected to one or both of the upper contacting structure and the lower support structure. A process for continuous electro-thermal poling of glass or glass ceramic sheets or substrates includes heating the sheet or substrate, feeding the sheet or substrate continuously or continually, while applying a DC voltage bias, and cooling the sheet or substrate to within 0-30° C. of ambient temperature.

Abstract: A glass or glass-ceramic carrier substrate, the substrate having undergone at least one complete cycle of a semiconductor fabrication process and having also undergone a reclamation process following the end of the semiconductor fabrication process; the glass or glass-ceramic carrier substrate comprising at least one of the following properties: (i) a coefficient of thermal expansion of less than 13 ppm/° C.; (ii) a Young's Modulus of 70 GPa to 150 GPa; (iii) an IR transmission of greater than 80% at a wavelength of 1064 nm; (iv) a UV transmission of greater than 20% at a wavelength of 255 nm to 360 nm; (v) a thickness tolerance within the same range as the thickness tolerance of the carrier substrate before undergoing at least one complete cycle of the semiconductor fabrication process; (vi) a total thickness variation of less than 2.5 ?m; (vii) a failure strength of greater than 80 MPa using a 4-point-bending test; (viii) a pre-shape of 50 ?m to 300 ?m.

Abstract: Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Abstract: Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.