Patents by Inventor Nicholas Vincent LICAUSI

Nicholas Vincent LICAUSI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140353802
    Abstract: A process is provided for methods of reducing damage to an ultra-low k layer during fabrication. In one aspect, a method includes: providing a cured ultra-low k film containing pores filled with a pore-stuffing material; and modifying an exposed surface of the ultra-low k film to provide a modified layer in the ultra-low k film. In another aspect, a semiconductor device comprising a modified layer on a surface of an ultra-low k film is provided.
    Type: Application
    Filed: May 28, 2013
    Publication date: December 4, 2014
    Applicant: GLOBALFOUNDRIES Inc.
    Inventors: Nicholas Vincent LICAUSI, Errol Todd RYAN, Ming HE, Moosung M. CHAE, Kunaljeet TANWAR, Larry ZHAO, Christian WITT, Ailian ZHAO, Sean X. LIN, Xunyuan ZHANG
  • Publication number: 20140353835
    Abstract: A process is provided for methods of reducing contamination of the self-forming barrier of an ultra-low k layer during semiconductor fabrication. In one aspect, a method includes: providing a cured ultra-low k film which contains at least one trench, and the pores of the film are filled with a pore-stuffing material; removing exposed pore-stuffing material at the surface of the trench to form exposed pores; and forming a self-forming barrier layer on the surface of the trench.
    Type: Application
    Filed: May 28, 2013
    Publication date: December 4, 2014
    Inventors: Moosung M. CHAE, Errol Todd RYAN, Nicholas Vincent LICAUSI, Christian WITT, Ailian ZHAO, Ming HE, Sean X. LIN, Xunyuan ZHANG, Kunaljeet TANWAR