Abstract: Solid state lamps and bulbs comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffuser. These are arranged on a heat sink in a manner that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omnidirectional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs.

Abstract: Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof and a contact on a front face thereof, wherein the light emitting device is electrically connected to the contact on the front face of the substrate. The substrate is compression molded to form an optical element on the front face of the substrate over the semiconductor light emitting device and a residual coating over a region of the front face of the substrate including the contact. The residual coating over the contact may be removed without damaging the contact. Packaged semiconductor light emitting devices are also provided.

Abstract: Solid state lamps and bulbs comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffuser. These are arranged on a heat sink in a manner that allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Various embodiments of the invention may be used to address many of the difficulties associated with utilizing efficient solid state light sources such as LEDs in the fabrication of lamps or bulbs suitable for direct replacement of traditional incandescent bulbs.

Abstract: A luminaire includes a housing, an optical waveguide disposed in the housing comprising a plurality of light coupling cavities, and a plurality of LEDs disposed in the housing adjacent the plurality of coupling cavities. A mounting apparatus is adapted to mount the luminaire on a roadway stanchion.

Abstract: A direct troffer-style fixture for solid state light sources and pan structures for use in these fixtures. The fixture comprises a door frame assembly that is attached to the pan. The pan housing is defined by a base and two angled side walls. End caps are attached to the side walls. End reflectors extend at an angle away from the end caps and attach to the base. The end caps, the end reflectors, and the base define compartments at both ends of the housing in which components can be housed. A light board is attached to the base using alignment holes in the base and cutout portions of the end reflectors. The multifunctional end reflectors retain elements within the compartments, provide added structural stability to the pan, aid in aligning a light board, and they reflect light that impinges on them toward the open end of the fixture.

Abstract: An LED light fixture including a housing and an LED assembly secured with respect to the housing. The LED assembly includes a heat sink and an LED illuminator secured with respect to an LED-supporting region of the heat sink with heat-dissipating surfaces extending therefrom. The heat sink having front, rear and lateral sides and being open to ambient-fluid flow to and from the heat-dissipating surfaces along each of the sides.

Abstract: A modular package for a light emitting device includes a leadframe including a first region having a top surface, a bottom surface and a first thickness and a second region having a top surface, a bottom surface and a second thickness that is less than the first thickness. The leadframe further includes an electrical lead extending laterally away from the second region, and the package further includes a thermoset package body on the leadframe and surrounding the first region. The thermoset package body may be on both the top and bottom surfaces of the second region. A leak barrier may be on the leadframe, and the package body may be on the leak barrier. Methods of forming modular packages including thermoset package bodies on leadframes are also disclosed.

Abstract: Solid state light emitting devices include one or more light affecting elements (e.g., of one or more light-transmissive, light-absorptive, light-reflective, and/or lumiphoric materials) formed on, over, or around at least one solid state light emitter, with the light affecting elements including multiple fused elements embodying plurality of dots, rods, or layers such as may be formed by three-dimensional (3D) printing. At least one electrically conductive path in electrical communication with a solid state light emitter may be formed by selective material deposition such as 3D printing. Light affecting elements may be individually tailored to individual solid state light emitters, such as to yield different optical distributions for interactions between each specific emitter and its corresponding light affecting element.

Abstract: A luminaire for use in lighting a large open space such as a parking lot or deck of a parking garage includes a plurality of optical waveguides disposed in side-by-side relationship and together defining a closed path and at least one LED associated with each optical waveguide and disposed at a first end of the associated optical waveguide.

Abstract: According to one aspect, a luminaire comprises a waveguide body including a central section and first and second separate side sections extending away from the central section along first and second opposed directions, respectively. The central section includes a coupling portion and the waveguide body has a length and includes a plurality of light extraction features that extract light out of the side sections. At least one LED is disposed adjacent the coupling portion and is operated by a power circuit to produce light that is directed into the waveguide body by the coupling portion. At least one structural member extends along the length of the waveguide body for supporting the waveguide body and encloses at least one of the power circuit and the at least one LED.

Abstract: An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and an optical cavity. The optical cavity comprises a phosphor carrier having a conversions material and arranged over an opening to the cavity. The phosphor carrier comprises a thermally conductive transparent material and is thermally coupled to the heat sink structure. An LED based light source is mounted in the optical cavity remote to the phosphor carrier with light from the light source passing through the phosphor carrier. A diffuser dome is included that is mounted over the optical cavity, with light from the optical cavity passing through the diffuser dome. The properties of the diffuser, such as geometry, scattering properties of the scattering layer, surface roughness or smoothness, and spatial distribution of the scattering layer properties may be used to control various lamp properties such as color uniformity and light intensity distribution as a function of viewing angle.

Abstract: A multi-chip lighting emitting device (LED) lamp for providing white light includes a submount including first and second die mounting regions thereon. A first LED chip is mounted on the first die mounting region, and a second LED chip is mounted on the second die mounting region. The LED lamp is configured to emit light having a spectral distribution including at least four different color peaks to provide the white light. For example, a first conversion material may at least partially cover the first LED chip, and may be configured to absorb at least some of the light of the first color and re-emit light of a third color. In addition, a second conversion material may at least partially cover the first and/or second LED chips, and may be configured to absorb at least some of the light of the first and/or second colors and re-emit light of a fourth color. Related light fixtures and methods are also disclosed.

Abstract: Solid state light emitting devices include lumiphor elements that are spatially segregated from electrically activated solid state emitters with an intermediately arranged optical element (including but not limited to a dichroic filter). Curved or faceted optical elements, and curved or faceted reflectors, may be employed. Multiple solid state emitters may be arranged in multiple reflector cups or recesses. Characteristics of optical elements and/or lumiphor elements of such devices may be varied with respect to angular position.

Abstract: A direct troffer-style fixture for solid state light sources and pan structures for use in these fixtures. The fixture comprises a door frame assembly that is attached to the pan. The pan housing is defined by a base and two angled side walls. End caps are attached to the side walls. End reflectors extend at an angle away from the end caps and attach to the base. The end caps, the end reflectors, and the base define compartments at both ends of the housing in which components can be housed. A light board is attached to the base using alignment holes in the base and cutout portions of the end reflectors. The multifunctional end reflectors retain elements within the compartments, provide added structural stability to the pan, aid in aligning a light board, and they reflect light that impinges on them toward the open end of the fixture.

Abstract: A submount for mounting an LED chip includes a substrate, a die attach pad configured to receive an LED chip on an upper surface of the substrate, a first meniscus control feature on the substrate surrounding the die attach pad and defining a first encapsulant region of the upper surface of the substrate, and a second meniscus control feature on the substrate surrounding the first encapsulant region and defining a second encapsulant region of the upper surface of the substrate. The first and second meniscus control features may be substantially coplanar with the die attach pad. A packaged LED includes a submount as described above and further includes an LED chip on the die attach pad, a first encapsulant on the substrate within the first encapsulant region, and a second encapsulant on the substrate within the second encapsulant region and covering the first encapsulant. Method embodiments are also disclosed.

Abstract: A submount for a light emitting device package includes a substrate with a first bond pad and a second bond pad on a first surface. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are on the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad.

Abstract: Methods of packaging a semiconductor light emitting device include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device but not covering the semiconductor light emitting device and a second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. Packaged semiconductor light emitting devices are also provided.

Abstract: An LED light fixture including a housing and an LED assembly secured with respect to the housing. The LED assembly includes a heat sink and an LED illuminator secured with respect to an LED-supporting region of the heat sink with heat-dissipating surfaces extending therefrom. The heat sink having front, rear and lateral sides and being open to ambient-fluid flow to and from the heat-dissipating surfaces along each of the sides.

Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof. The body of material has a first side, a second side opposite the first side, and a plurality of interior bores extending between the first and second sides each adapted to receive a light emitting diode. Extraction features are disposed on the second side and the extraction features direct light out of at least the first side and at least one extraction feature forms a taper disposed at an outer portion of the body.

Abstract: A submount for a light emitting device package includes a substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.