Abstract: A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

Abstract: Method of forming a plastic element include dispensing a quantity of a liquid precursor material into a first die mold, positioning a carrier tape on the first die mold above the dispensed liquid precursor material, bringing a second die mold into contact with the carrier tape and the first die mold, and applying pressure to the first die mold and the second die mold. The liquid precursor material may include a liquid silicone.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

Abstract: A solid state lighting subassembly or fixture includes an anisotropic heat spreading material. A heat spreading layer may be placed between a light emitting diode (LED) and luminaire or reflector and serves to spread heat laterally away from the LED. Low profile, low weight heat spreading may be utilized both to retrofit existing light fixtures with LEDs or to replace existing incandescent and fluorescent fixtures with LED based fixtures.

Abstract: A light emitting diode (LED) lighting fixture for achieving a desired illumination pattern includes a panel and one or more LEDs attached to a surface of the panel. One or more of the LEDs may be mounted at an angle to the surface.

Abstract: Semiconductor light emitting device packaging methods include fabricating a substrate configured to mount a semiconductor light emitting device thereon. The substrate may include a cavity configured to mount the semiconductor light emitting device therein. The semiconductor light emitting device is mounted on the substrate and electrically connected to a contact portion of the substrate. The substrate is liquid injection molded to form an optical element bonded to the substrate over the semiconductor light emitting device. Liquid injection molding may be preceded by applying a soft resin on the electrically connected semiconductor light emitting device in the cavity. Semiconductor light emitting device substrate strips are also provided.

Abstract: A solid state lighting device includes a device-scale stamped heatsink with a base portion and multiple segments or sidewalls projecting outward from the base portion, and dissipates all steady state thermal load of a solid state emitter to an ambient air environment. The heatsink is in thermal communication with one or more solid state emitters, and may define a cup-like cavity containing a reflector. At least a portion of each one sidewall portion or segment extends in a direction non-parallel to the base portion. A dielectric layer and at least one electrical trace may be deposited over a metallic sheet to form a composite sheet, and the composite sheet may be processed by stamping and/or progressive die shaping to form a heatsink with integral circuitry. At least some segments of a heatsink may be arranged to structurally support a lens and/or reflector associated with a solid state lighting device.

Abstract: Methods of packaging semiconductor light emitting devices include providing a substrate having the semiconductor light emitting device on a front face thereof. A first optical element is formed from a first material on the front face proximate the semiconductor light emitting device. A second optical element is formed from a second material, different from the first material, over the semiconductor light emitting device and the first optical element. The first optical element and/or the second optical element are formed by compression molding the respective optical element.

Abstract: A thermal management apparatus includes a lighting assembly and a cooling module that is removably coupled to the lighting assembly. A recessed downlight fixture includes a housing having an open end, an electrical power access port, a cooling module in the housing that is removably coupled to the electrical power access port, and a light source in the housing that is removably coupled to the electrical power access port. The light source is operable to project light through the open end of the housing. A cooling device is provided that includes a male Edison or GU24 port interface and a female Edison or GU 24 port interface.

Abstract: A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.

Abstract: A packaged light emitting device includes a substrate, a solid state light emitting device on the substrate, a first generally toroidal lens on the substrate and defining a cavity relative to the solid state light emitting device and having a first index of refraction, and a second lens at least partially within the cavity formed by the first lens and having a second index of refraction that is different from the first index of refraction. The second index of refraction may be higher than the first index of refraction. The lenses may be mounted on the substrate and/or may formed by dispensing and curing liquid encapsulant materials.

Abstract: A radiation distribution system designed to produce a batwing distribution. The system may be used with radiative sources emitting in the visible spectrum or in other spectra. The system comprises a specially shaped lens disposed over a radiative source, such as an LED, for example. The lens and source are arranged between two reflector bodies, both of which have an elongated reflective surface that faces the source. The reflector bodies each have two different reflective surfaces that face outward and away from each other. The lens and both reflective surfaces work in concert to redirect a portion of the emitted radiation to create the desired batwing distribution. Several sources may be arranged linearly between a single pair of reflector bodies on a common surface to create a linear array of sources. Likewise, multiple linear arrays may be combined to form a two-dimensional array.

Abstract: A wire-bond free semiconductor device with two electrodes both of which are accessible from the bottom side of the device. The device is fabricated with two electrodes that are electrically connected to the oppositely doped epitaxial layers, each of these electrodes having leads with bottom-side access points. This structure allows the device to be biased with an external voltage/current source, obviating the need for wire-bonds or other such connection mechanisms that must be formed at the packaging level. Thus, features that are traditionally added to the device at the packaging level (e.g., phosphor layers or encapsulants) may be included in the wafer level fabrication process. Additionally, the bottom-side electrodes are thick enough to provide primary structural support to the device, eliminating the need to leave the growth substrate as part of the finished device.

Abstract: A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

Abstract: Some embodiments of the present invention provide a lighting system for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.

Abstract: Some embodiments of the present invention provide a lighting system for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.