Patents by Inventor Nicola Spring

Nicola Spring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220227080
    Abstract: Techniques for controlling the flow of replication material (e.g., epoxy) during the formation of replicated optical elements include providing a transparent substrate (220) onto which the optical elements are to be replicated. The substrate (220) includes a structured UV curable shield (202) adhering to its surface. The UV curable shield (202), in turn, has openings (203) that expose portions of the surface of the transparent substrate (220) for replication of the optical elements. During the replication process, excess replication material (124A) may flow onto the UV curable shield (202), which subsequently can be cured so as to facilitate the release and removal of the shield (202) along with the excess replication material (124A).
    Type: Application
    Filed: June 12, 2020
    Publication date: July 21, 2022
    Inventors: Uros Markovic, Nicola Spring
  • Publication number: 20220176597
    Abstract: A method of manufacturing a plurality of optical elements (140) comprising the steps of providing a substrate (120), and a tool (101) comprising a plurality of replication sections (106), each defining a surface structure of one of the optical elements (140), the tool (101) further comprising at least one contact spacer portion (112), aligning the tool (101) and the substrate (120) with respect to each other and bringing the tool (101) and a first side of the substrate (122) together, with replication material (124) between the tool (101) and the substrate (120), the contact spacer portion (112) contacting the first side of the substrate (122), and thereby causing the spacer portion (112) to adhere to the first side of the substrate (122), hardening the replication material (124), wherein the substrate (120) has yard line features (138) around at least a portion of the replication sections (106), the yard line features (138) containing the replication material (124) on a first side of the yard line with respe
    Type: Application
    Filed: March 12, 2020
    Publication date: June 9, 2022
    Inventors: Bojan Tesanovic, Hartmut Rudmann, Nicola Spring, Sebastiano Lazzi Gazzini
  • Publication number: 20220168978
    Abstract: A method of manufacturing a plurality of optical elements includes providing a first wafer (200) having lower alignment features (192) arranged on a first surface of the substrate, providing a second wafer (201) comprising, on a replication side, a plurality of replication sections, each replication section defining a surface structure of one of the optical elements, the second wafer (201) further comprising upper alignment features (194) protruding, on the replication side, further than an outermost feature of the replication sections, depositing liquid droplets (196) on the first side of the first wafer (200), and bringing the second wafer (201) and the first side of the first wafer (200) together, with liquid droplets (196) between the first wafer (200) and the second wafer (201), the upper alignment features (194) contacting the liquid droplets (196) on the lower alignment features (192) on the first side of the first wafer (200), and thereby causing the second wafer (201) to align with the first wafer (2
    Type: Application
    Filed: March 11, 2020
    Publication date: June 2, 2022
    Inventors: Nicola Spring, Uros Markovic
  • Publication number: 20220137269
    Abstract: A method of manufacturing a plurality of optical elements (140), the method comprising providing a first wafer (120) having hardened replication material forming optical elements (140) on a first side of the first wafer (120), providing a second wafer (121) having hardened replication material forming optical elements (140) on a first side of the second wafer (121), depositing liquid droplets (180) on the first side of the first wafer (120) between the optical elements (140) aligning the first side of the first wafer (120) with the first side of the second wafer (121), and bringing the two wafers (120, 121) together such that the liquid droplets (180) on the first side of the first wafer (120) adhere to the first side of the second wafer (121).
    Type: Application
    Filed: March 11, 2020
    Publication date: May 5, 2022
    Inventors: Nicola Spring, QiChuan Yu
  • Publication number: 20220113464
    Abstract: Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.
    Type: Application
    Filed: September 13, 2019
    Publication date: April 14, 2022
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Nicola Spring, Jens Geiger, Diane Morgan
  • Patent number: 11296270
    Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: April 5, 2022
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Bojan Tesanovic, Nicola Spring
  • Publication number: 20210333445
    Abstract: The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.
    Type: Application
    Filed: May 12, 2021
    Publication date: October 28, 2021
    Inventors: Nicola Spring, Hartmut Rudmann, Markus Rossi
  • Patent number: 11114573
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: September 7, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirnio, Hartmut Rudmann, Nicola Spring
  • Publication number: 20210271058
    Abstract: An optics wafer includes replicated optical elements such as lenses that can be formed without the use of a separate glass or other substrate on which the optical elements would otherwise need to be replicated or mounted.
    Type: Application
    Filed: June 14, 2019
    Publication date: September 2, 2021
    Applicant: ams Sensors Singapore Pte. Ltd.
    Inventors: Uros MARKOVIC, Nicola SPRING
  • Publication number: 20210199475
    Abstract: An example optical encoder includes a rotary shaft having a rotational axis. The rotary shaft is actuatable along the rotational axis. The optical encoder also includes at least one light generating element operable to generate light, and at least one light detecting element operable to detect light and convert the detected light into a signal. The rotary shaft includes a portion operable to reflect light generated from the at least one light generating element onto the at least one light detecting element wherein the signal is generated. The portion is configured such that an actuation of the rotary shaft from a first position to a second position generates a corresponding change in the signal generated in the at least one light detecting element.
    Type: Application
    Filed: February 7, 2019
    Publication date: July 1, 2021
    Inventors: Markus Dantler, Alison Marie Jäggi, Robert Lenart, Nicola Spring
  • Patent number: 11013123
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: May 18, 2021
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Patent number: 10877239
    Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: December 29, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
  • Publication number: 20200395523
    Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.
    Type: Application
    Filed: December 26, 2018
    Publication date: December 17, 2020
    Inventors: Bojan Tesanovic, Nicola Spring
  • Patent number: 10840396
    Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: November 17, 2020
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
  • Publication number: 20200127147
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Application
    Filed: December 18, 2019
    Publication date: April 23, 2020
    Inventors: Martin Lukas BALIMANN, Matthias GLOOR, Philippe BOUCHILLOUX, Jukka ALASIRNIO, Hartmut RUDMANN, Nicola SPRING
  • Patent number: 10566468
    Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: February 18, 2020
    Assignee: AMS SENSORS SINGAPORE PTE. LTD
    Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
  • Publication number: 20200045828
    Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.
    Type: Application
    Filed: October 9, 2019
    Publication date: February 6, 2020
    Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
  • Patent number: 10551602
    Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: February 4, 2020
    Assignee: AMS SENSORS SINGAPORE PTE. LTD.
    Inventors: Nicola Spring, Hartmut Rudmann, Markus Rossi
  • Patent number: 10377094
    Abstract: The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool.
    Type: Grant
    Filed: September 3, 2013
    Date of Patent: August 13, 2019
    Assignee: ams Sensors Singapore Pte. Ltd.
    Inventors: Hartmut Rudmann, Jürgen Soechtig, Nicola Spring, Alexander Bietesch
  • Patent number: 10373996
    Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.
    Type: Grant
    Filed: July 17, 2017
    Date of Patent: August 6, 2019
    Assignee: ams Sensors Singapore Pte. Ltd
    Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart