Patents by Inventor Nicola Spring
Nicola Spring has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210199475Abstract: An example optical encoder includes a rotary shaft having a rotational axis. The rotary shaft is actuatable along the rotational axis. The optical encoder also includes at least one light generating element operable to generate light, and at least one light detecting element operable to detect light and convert the detected light into a signal. The rotary shaft includes a portion operable to reflect light generated from the at least one light generating element onto the at least one light detecting element wherein the signal is generated. The portion is configured such that an actuation of the rotary shaft from a first position to a second position generates a corresponding change in the signal generated in the at least one light detecting element.Type: ApplicationFiled: February 7, 2019Publication date: July 1, 2021Inventors: Markus Dantler, Alison Marie Jäggi, Robert Lenart, Nicola Spring
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Patent number: 11013123Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.Type: GrantFiled: October 9, 2019Date of Patent: May 18, 2021Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
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Patent number: 10877239Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.Type: GrantFiled: November 4, 2016Date of Patent: December 29, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
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Publication number: 20200395523Abstract: Optoelectronic modules exhibiting relatively small thickness and methods for their manufacture are disclosed. The optoelectronic modules include substrates and transparent covers. Each optoelectronic module includes a transparent substrate on which an optoelectronic component is mounted. The optoelectronic component can be sensitive to and/or operable to generate a particular wavelength of electromagnetic radiation. The transparent substrate is transmissive to the particular wavelength of electromagnetic radiation. In some instances, the transparent substrate is composed, at least partially of glass.Type: ApplicationFiled: December 26, 2018Publication date: December 17, 2020Inventors: Bojan Tesanovic, Nicola Spring
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Patent number: 10840396Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.Type: GrantFiled: April 11, 2017Date of Patent: November 17, 2020Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
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Publication number: 20200127147Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: ApplicationFiled: December 18, 2019Publication date: April 23, 2020Inventors: Martin Lukas BALIMANN, Matthias GLOOR, Philippe BOUCHILLOUX, Jukka ALASIRNIO, Hartmut RUDMANN, Nicola SPRING
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Patent number: 10566468Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: GrantFiled: March 23, 2017Date of Patent: February 18, 2020Assignee: AMS SENSORS SINGAPORE PTE. LTDInventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
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Publication number: 20200045828Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.Type: ApplicationFiled: October 9, 2019Publication date: February 6, 2020Inventors: Bojan Tesanovic, Nicola Spring, Simon Gubser, Robert Lenart, Mario Cesana
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Patent number: 10551602Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).Type: GrantFiled: August 24, 2016Date of Patent: February 4, 2020Assignee: AMS SENSORS SINGAPORE PTE. LTD.Inventors: Nicola Spring, Hartmut Rudmann, Markus Rossi
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Patent number: 10377094Abstract: The invention relates to wafer-level manufacturing of optical devices such as modules comprising micro-lenses. In one aspect, passive optical components such as truncated lenses are manufactured by providing a substrate on which a multitude of precursor optical structures is present; and removing material from each of said multitude of precursor optical structures. Another aspect comprises a method for manufacturing a device comprising a set of at least two passive optical components, said method comprising the steps of using a tool obtained by carrying out the steps of manufacturing a precursor tool having a replication surface; and modifying said replication surface by removing material from said precursor tool.Type: GrantFiled: September 3, 2013Date of Patent: August 13, 2019Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Hartmut Rudmann, Jürgen Soechtig, Nicola Spring, Alexander Bietesch
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Patent number: 10373996Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.Type: GrantFiled: July 17, 2017Date of Patent: August 6, 2019Assignee: ams Sensors Singapore Pte. LtdInventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
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Patent number: 10317254Abstract: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).Type: GrantFiled: March 18, 2015Date of Patent: June 11, 2019Assignee: ams Sensors Singapore Pte. Ltd.Inventors: Jens Geiger, Nicola Spring, Robert Lenart, Bassam Hallal, Hakan Karpuz
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Publication number: 20190088801Abstract: An optoelectronic module assembly includes an optoelectronic module. The module includes: an active optoelectronic component in or on a mounting substrate, an optical sub-assembly, and a spacer disposed between the mounting substrate and the optical sub-assembly so as to establish a particular distance between the active optoelectronic component and the optical sub-assembly. The optoelectronic module assembly also includes a recessed substrate including first and second surfaces, wherein the second surface is in a plane closer to the optical sub-assembly than is the first surface. The optoelectronic module is mounted on the first surface. The second surface is for mounting other components.Type: ApplicationFiled: March 23, 2017Publication date: March 21, 2019Inventors: Martin Lukas Balimann, Matthias Gloor, Philippe Bouchilloux, Jukka Alasirniö, Hartmut Rudmann, Nicola Spring
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Publication number: 20190081187Abstract: Optoelectronic modules, such as proximity sensors, two-dimensional and three-dimensional cameras, structured- or encoded-light emitters, and projectors include optical assemblies and active optoelectronic components that are light sensitive or emit light. The optical assemblies are aligned to the active optoelectronic components via alignment spacers and adhesive. The alignment spacers include surfaces operable to limit the lateral migration of adhesive thereby preventing the contamination of the active optoelectronic components with adhesive. In some instances, small optoelectronic module footprints can be maintained without compromising the integrity of the adhesive.Type: ApplicationFiled: April 11, 2017Publication date: March 14, 2019Inventors: Martin Lukas Balimann, Matthias Gloor, Hartmut Rudmann, Nicola Spring
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Publication number: 20180329175Abstract: Optical stack assemblies and fabrication techniques thereof. The optical stack assembly includes first and second sub-assemblies, each of which include a substrate and a sub-structure fixed to the respective substrate. Each sub-structures includes a respective first edge feature and a respective second edge feature that project away from the substrate of that sub-structure, each second edge feature being disposed laterally closer to an outer periphery of the respective sub-structure than the first edge feature of the same sub-structure. The first edge feature of the first sub-structure is in direct contact with the first edge feature of the second sub¬structure, while the second edge feature of the first sub-structure and the second edge feature of the second sub-structure are attached to one another by adhesive. At least one of the first or second sub-structures includes an optical element on a same side of the sub-structure as the first and second edge features of that sub-structure.Type: ApplicationFiled: November 4, 2016Publication date: November 15, 2018Inventors: Ji Wang, Kam Wah Leong, Bojan Tesanovic, Qichuan Yu, Tobias Senn, Nicola Spring, Robert Lenart
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Publication number: 20180329187Abstract: An optical device (1) includes two prism bodies (41, 42) and four side panels (71-74) attached to both prism bodies (41, 42). A cavity (9) is thereby enclosed. A first reflector (81) can be present at a first side face (81) of the first prism body (41), and a second reflector (82) can be present at a second side face (82) of the second prism body (42). At least one of the prism bodies (41, 42) and/or at least one of the side panels (71-74) can be at least in part made of a non-transparent dielectric material such as a printed circuit board. In some implementations, an optoelectronic component (90) can be attached to the respective constituent of the optical device (1).Type: ApplicationFiled: August 24, 2016Publication date: November 15, 2018Inventors: Nicola Spring, Hartmut Rudmann, Markus Rossi
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Publication number: 20180172483Abstract: Optical encoding systems include a generalized cylindrical code scale having one or more regions with different light reflective properties. In an example process, a code scale can be created by coating an elongated generalized cylinder with one or more different layers of materials having different light reflective properties. Portions of these layers can be removed selectively in order to expose a particular overlying material and create a particular pattern of features having different optical characteristics (e.g., absorbing, specularly reflecting, diffusely reflecting).Type: ApplicationFiled: March 18, 2015Publication date: June 21, 2018Inventors: Jens GEIGER, Nicola SPRING, Robert LENART, Bassam HALLAL, Hakan KARPUZ
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Publication number: 20170336543Abstract: The method for manufacturing optical light guide elements comprises a) providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; b) positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; c) fixing the plurality of initial bars with respect to each other in the position achieved in step b) to obtain a bar arrangement.Type: ApplicationFiled: November 11, 2015Publication date: November 23, 2017Inventors: Nicola SPRING, Hartmut RUDMANN, Markus ROSSI
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Publication number: 20170317126Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.Type: ApplicationFiled: July 17, 2017Publication date: November 2, 2017Applicant: Heptagon Micro Optics Pte. Ltd.Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart
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Patent number: 9748297Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.Type: GrantFiled: February 11, 2014Date of Patent: August 29, 2017Assignee: Heptagon Micro Optics Pte. Ltd.Inventors: Stephan Heimgartner, Ville Kettunen, Nicola Spring, Alexander Bietsch, Mario Cesana, Hartmut Rudmann, Jukka Alasirnio, Robert Lenart