Patents by Inventor Nicolas Boyer
Nicolas Boyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10918735Abstract: The synthesis of various pyrazino[1?,2?:1,5]pyrrolo[2,3-B]-indole-1,4-dione analogs has been successfully implemented in the present application. From these efforts, compounds having the structure of Formula I-a or Formula I-b: or a pharmaceutically acceptable salt, tautomer, or stereoisomer thereof, are provided herein. These biologically active derivatives have been used to effectively treat various diseases including cancer.Type: GrantFiled: March 5, 2019Date of Patent: February 16, 2021Assignees: Massachusetts Institute of Technology, The Board of Trustees of the University of IllinoisInventors: Mohammad Movassaghi, Justin Kim, Paul Hergenrother, Karen Morrison, Nicolas Boyer
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Patent number: 10338325Abstract: Systems and methods for nanofiller in an optical interface are provided. One system includes a fiber-optic interface for one or more optical fibers that includes a body including one or more grooves defined therein. At least one groove in the one or more grooves is configured to receive a corresponding optical fiber of the one or more optical fibers. The at least one groove of the one or more grooves is further configured to receive an adhesive to attach the body to a portion of the corresponding optical fiber. Further, fiber-optic interface includes a suspended structure associated with the at least one groove configured to couple light between the suspended structure and the corresponding optical fiber. Also, the adhesive comprises nanofiller configured to support an alignment of the suspended structure with the corresponding optical fiber within the at least one groove.Type: GrantFiled: June 1, 2018Date of Patent: July 2, 2019Assignee: International Business Machines CorporationInventors: Barnim Alexander Janta-Polczynski, Tymon Barwicz, Elaine Cyr, Nicolas Boyer, Marie-Claude Paquet, Richard D. Langlois, Paul Francis Fortier
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Patent number: 10302869Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.Type: GrantFiled: September 27, 2018Date of Patent: May 28, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Richard D. Langlois, Paul Francis Fortier
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Patent number: 10295749Abstract: A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.Type: GrantFiled: February 15, 2018Date of Patent: May 21, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Barnim Alexander Janta-Polczynski, Elaine Cyr, Tymon Barwicz, Nicolas Boyer, Richard D. Langlois, Paul Francis Fortier
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Patent number: 10220099Abstract: The synthesis of various pyrazino[1?,2?:1,5]pyrrolo[2,3-b]-indole-1,4-dione analogs has been successfully implemented in the present application. From these efforts, compounds having the structure of Formula I-c: or a pharmaceutically acceptable salt, tautomer, or stereoisomer thereof, wherein R1, R2, R4-R8, R3?, R6?, and n are as defined herein, are provided. These biologically active derivatives have been further used to prepare cell-specific drug conjugates effective in treating various diseases including cancer.Type: GrantFiled: May 10, 2016Date of Patent: March 5, 2019Assignees: Massachusetts Institute of Technology, The Board of Trustees of the University of IllinoisInventors: Mohammad Movassaghi, Justin Kim, Paul J. Hergenrother, Karen Morrison, Nicolas Boyer
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Patent number: 9810864Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: GrantFiled: April 5, 2017Date of Patent: November 7, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski
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Publication number: 20170242207Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: ApplicationFiled: April 5, 2017Publication date: August 24, 2017Inventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski
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Patent number: 9684133Abstract: A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.Type: GrantFiled: September 23, 2014Date of Patent: June 20, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Guy Brouilette, Paul F. Fortier, Stephane Harel, Roch Thivierge
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Patent number: 9662830Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.Type: GrantFiled: June 24, 2015Date of Patent: May 30, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul Fortier, Stephane Harel, Roch Thivierge
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Patent number: 9656420Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.Type: GrantFiled: April 30, 2015Date of Patent: May 23, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul Fortier, Stephane Harel, Roch Thivierge
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Patent number: 9651747Abstract: An optical fiber component includes an optical fiber array and at least one fiber lid. The optical fiber array has a plurality of individual optical fibers extending between a first end and an opposing second end. The fiber lid has a first surface and an opposing second surface. A portion of the second surface is attached to a portion of the optical fiber array adjacent the second end so as to partially define an adhesion region of the optical fiber component and a compliance region of the fiber pigtail assembly to enable high-yield fiber re-alignment in grooves.Type: GrantFiled: February 22, 2016Date of Patent: May 16, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski
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Patent number: 9568682Abstract: A component and chip assembly apparatus includes an assembly stage configured to support a chip, the chip including grooves defining a first pitch, the grooves including a first groove opening configured to receive a plurality of optical fibers and to align the plurality of optical fibers. A picker brings a fiber component including a plurality of optical fibers having a second pitch into contact with the chip such that each optical fiber is aligned with a respective groove. At least one of the assembly stage and the picker includes a comb having a plurality of teeth that define individual cavities therebetween, the cavities having a first cavity opening to receive the optical fibers and isolate each optical fiber from one another and pre-align the optical fibers so as to adjust the second pitch to substantially match the first pitch.Type: GrantFiled: February 8, 2016Date of Patent: February 14, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Tymon Barwicz, Nicolas Boyer, Paul F. Fortier, Alexander Janta-Polczynski, Stephan L. Martel, Jean-Francois Morissette
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COMPOUNDS, CONJUGATES AND COMPOSITIONS OF EPIPOLYTHIODIKETOPIPERAZINES AND POLYTHIODIKETOPIPERAZINES
Publication number: 20160354483Abstract: The present application provides, among other things, compounds, compositions and methods for treating various diseases including cancer.Type: ApplicationFiled: May 10, 2016Publication date: December 8, 2016Applicants: Massachusetts Institute of Technology, The Board of Trustees of the University of IllinoisInventors: Mohammad Movassaghi, Justin Kim, Paul J. Hergenrother, Karen Morrison, Nicolas Boyer -
Publication number: 20160318241Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.Type: ApplicationFiled: June 24, 2015Publication date: November 3, 2016Inventors: Tymon Barwicz, Nicolas Boyer, Paul Fortier, Stephane Harel, Roch Thivierge
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Publication number: 20160318240Abstract: A bondline control fixture and an active bondline control fixture are provided for affixing first and second components. The bondline control fixture includes a base fixable relative to a first component maneuvering device and comprising a first body defining an aperture and a first chamber and a second body disposable within the first chamber and defining a second chamber, a flexible membrane disposable to seal the second chamber, a mobile plate to which the second component is removably attachable, the mobile plate being disposable in contact with the flexible membrane and a pressure regulating system coupled to the second body and configured to regulate a pressure within the second chamber to deform the flexible membrane.Type: ApplicationFiled: April 30, 2015Publication date: November 3, 2016Inventors: Tymon Barwicz, Nicolas Boyer, Paul Fortier, Stephane Harel, Roch Thivierge
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Patent number: 9353150Abstract: The present application provides, among other things, a compound of Formula I-a and/or I-b, or a pharmaceutically acceptable salt thereof, wherein the variables are defined in the specification. The compounds of the invention are useful for treating various diseases including cancer.Type: GrantFiled: December 4, 2013Date of Patent: May 31, 2016Assignees: Massachusetts Institute of Technology, The Board of Trustees of the University of IllinoisInventors: Mohammad Movassaghi, Justin Kim, Paul J. Hergenrother, Karen Morrison, Nicolas Boyer
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Patent number: 9338935Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.Type: GrantFiled: December 6, 2014Date of Patent: May 10, 2016Assignee: International Business Machines CorporationInventors: Yvan Bessette, Eric Bouchard, Nicolas Boyer, Camille Dube, Eric Dube, Sarah Turgeon
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Publication number: 20160085044Abstract: A component assembly apparatus includes a first device supportive of a first component and a second device configured to bring a second component into contact with the first component. The second device is further configured to apply a first pressurizing force directed to force respective first surfaces of the first and second components together, and the first device is configured to convert a portion of the first pressurizing force into a second pressurizing force directed transversely with respect to the first pressurizing force to force respective second surfaces of the first and second components together.Type: ApplicationFiled: September 23, 2014Publication date: March 24, 2016Inventors: Tymon Barwicz, Nicolas Boyer, Guy Brouilette, Paul F. Fortier, Stephane Harel, Roch Thivierge
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Publication number: 20150089802Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a system includes a heating device to heat a substrate, wherein an electronic component such as a microchip is attached to the substrate by one or more solder connections. A thermally conductive picker head is placed in physical contact with the electronic component to apply tension to the electronic component and draw heat away from the electronic component through a thermally conductive interface between the electronic component and the thermally conductive picker head. This ideally generates a uniform temperature gradient across the solder connections. This will allow the electronic component along with most or all of the solder to be removed from the substrate.Type: ApplicationFiled: December 6, 2014Publication date: April 2, 2015Inventors: Yvan Bessette, Eric Bouchard, Nicolas Boyer, Camille Dube, Eric Dube, Sarah Turgeon
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Patent number: 8925170Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.Type: GrantFiled: April 22, 2011Date of Patent: January 6, 2015Assignee: International Business Machines CorporationInventors: Yvan Bessette, Eric Bouchard, Nicolas Boyer, Camille Dube, Eric Dube, Sarah Turgeon