Patents by Inventor Nicolas Boyer

Nicolas Boyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8309341
    Abstract: Compounds of formula (I): wherein: R1 represents a hydrogen atom or a group of formula COR4, or R1 represents a group of formula (A): R2 represents a group of formula NR5R6, or R2 represents a nitrogen-containing heterocyclic group, an aryl group or a heteroaryl group, R3 represents a hydrogen atom or an alkyl group, m represents an integer between 1 and 6 inclusive, n represents 0, 1 or 2, their optical isomers, and also addition salts thereof with a pharmaceutically acceptable acid. Medicinal products containing the same which are useful in treating and/or preventing thrombotic events.
    Type: Grant
    Filed: June 25, 2010
    Date of Patent: November 13, 2012
    Assignees: Les Laboratories Server, L'Institut National des Sciences Appliquées de Rouen, Le Centre National de la Recherche Scientifique, L'Universite de Rouen
    Inventors: Philippe Gloanec, Guillaume De Nanteuil, Jean-Gilles Parmentier, Anne-Françoise Guillouzic, Tony Verbeuren, Alain Rupin, Philippe Mennecier, Marie-Odile Vallez, Jean-Charles Quirion, Philippe Jubault, Nicolas Boyer
  • Publication number: 20120266459
    Abstract: A system and method for removing an electronic component from a substrate is described. In one embodiment, a method in accordance with the invention includes initially preheating a substrate, wherein an electronic component (such as a microchip or discrete electronic component) is attached to the substrate by one or more solder connections. A thermally conductive picker head is applied to the electronic component to quench the electronic component and generate a temperature gradient across the solder connections. Tension is applied to the electronic component using the picker head. The substrate is then heated until a melting point is reached at the interface between the substrate and the solder connections. When the melting point is reached, the tension applied by the picker head removes the electronic component from the substrate. Most if not all of the solder associated with the solder connections is removed with the electronic component.
    Type: Application
    Filed: April 22, 2011
    Publication date: October 25, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Yvan Bessette, Eric Bouchard, Nicolas Boyer, Camille Dube, Eric Dube, Sarah Turgeon
  • Publication number: 20100330064
    Abstract: Compounds of formula (I): wherein: R1 represents a hydrogen atom or a group of formula COR4, or R1 represents a group of formula (A): R2 represents a group of formula NR5R6, or R2 represents a nitrogen-containing heterocyclic group, an aryl group or a heteroaryl group, R3 represents a hydrogen atom or an alkyl group, m represents an integer between 1 and 6 inclusive, n represents 0, 1 or 2, their optical isomers, and also addition salts thereof with a pharmaceutically acceptable acid. Medicinal products containing the same which are useful in treating and/or preventing thrombotic events.
    Type: Application
    Filed: June 25, 2010
    Publication date: December 30, 2010
    Applicants: LES LABORATOIRES SERVIER, L'INSTITUT NATIONAL DES SCIENCES APPLIQUEES DE ROUEN, LE CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE, L'UNIVERSITE DE ROUEN
    Inventors: Philippe Gloanec, Guillaume De Nanteuil, Jean-Gilles Parmentier, Anne-Françoise Guillouzic, Tony Verbeuren, Alain Rupin, Philippe Mennecier, Marie-Odile Vallez, Jean-Charles Quirion, Philippe Jubault, Nicolas Boyer