Patents by Inventor Nien-Tien Cheng

Nien-Tien Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170374762
    Abstract: A heat pipe assembly comprises a female heat pipe comprising at least one open end; and at least one male heat pipe. The at least one male heat pipe includes an inserting end where the inserting end of the at least one male heat pipe is able to be movably inserted into an open end of the female heat pipe. An electronic device using the heat pipe assembly is also provided.
    Type: Application
    Filed: April 12, 2017
    Publication date: December 28, 2017
    Inventors: NIEN-TIEN CHENG, JUI-WEN HUNG
  • Publication number: 20170305746
    Abstract: A method for making graphene comprises providing and stacking alternately a plurality of polyimide films and a plurality of carbon papers to form a laminate and conducting carbonization treatment to the laminate to form a intermediate product. The intermediate product is subjected to graphitization treatment to form a polyimide artificial graphite which can be stripped to achieve a graphene.
    Type: Application
    Filed: January 19, 2017
    Publication date: October 26, 2017
    Inventors: NIEN-TIEN CHENG, MING-HSIU CHUNG
  • Patent number: 9453689
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: September 27, 2016
    Assignees: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
  • Publication number: 20160120063
    Abstract: A liquid cooling system includes a liquid cooling radiator, a circulation device, and a plurality of circulation pipes coupling the circulation device with the liquid cooling radiator. A liquid circulation channel is defined in the liquid cooling radiator. A plurality of heat dissipation fins are arranged in the liquid circulation channel. The circulation device drives a liquid coolant through the liquid cooling radiator via the liquid circulation channel to make a heat exchange circulation.
    Type: Application
    Filed: December 12, 2014
    Publication date: April 28, 2016
    Inventors: NIEN-TIEN CHENG, WEI-HANG HSU
  • Patent number: 9276420
    Abstract: A battery power system includes a number of battery modules. Each battery module includes a number of battery cells, a management circuit positioned at a first side of the battery module, and a heat source positioned at a second side of the battery module and opposite to the first side. The management circuit is electrically connected to and manages charging and discharging of the cells of the corresponding battery module. The heat source is thermally coupled to the cells of the corresponding battery module and dissipates heat generated by the cells of the corresponding battery module. The battery modules are arranged in two lines, and the first sides of the battery modules in one line are positioned adjacent to and face the first sides of the battery modules in another line.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: March 1, 2016
    Assignee: UER Technology Corporation
    Inventors: Ray-Tang Sun, Tsung-Hsien Chuang, Nien-Tien Cheng, Chien-Lung Chen
  • Patent number: 9186832
    Abstract: A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.
    Type: Grant
    Filed: May 27, 2013
    Date of Patent: November 17, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ming-Hsiu Chung, Nien-Tien Cheng
  • Patent number: 9145895
    Abstract: An exemplary heat dissipation fan includes a housing and an impeller. The housing includes a casing. The casing includes a bottom wall and a side wall extending upwardly from the bottom wall. The impeller is received in the housing. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each blade has a distal end facing the side wall of the casing. The inner side of the side wall depressed towards an outer side of the casing.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: September 29, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Chih-Jen Liu
  • Publication number: 20150086827
    Abstract: A battery module includes a battery pack and a heat dissipating assembly for dissipating heat generated by the battery pack. The battery pack includes a number of battery cells. The heat dissipating assembly includes a heat dissipating sheet, a heat exchange element, and at least one heat pipe. The heat dissipating sheet is thermally coupled to the battery pack for collecting heat generated by the battery pack. The heat exchange element is fixed on a sidewall of the battery pack. The heat exchange element stores a coolant. The heat pipe is attached to the heat dissipating sheet. One end of each heat pipe is inserted into the heat exchange element to absorb the coolant. The absorbed coolant is evaporated by absorbing heat collected by the heat dissipating sheet.
    Type: Application
    Filed: October 31, 2013
    Publication date: March 26, 2015
    Applicant: UER TECHNOLOGY CORPORATION
    Inventors: RAY-TANG SUN, TSUNG-HSIEN CHUANG, NIEN-TIEN CHENG, CHIEN-LUNG CHEN
  • Publication number: 20150086828
    Abstract: A battery power system includes two battery modules stacked together and a heat dissipating unit. Each battery module includes a heat conductive sheet positioned at a side facing toward the other battery module. The heat dissipating unit includes heat pipes positioned between the battery modules and in contact with the heat conductive sheet of each battery module.
    Type: Application
    Filed: October 31, 2013
    Publication date: March 26, 2015
    Applicant: UER TECHNOLOGY CORPORATION
    Inventors: RAY-TANG SUN, TSUNG-HSIEN CHUANG, NIEN-TIEN CHENG, CHIEN-LUNG CHEN
  • Publication number: 20150084594
    Abstract: A battery power system includes a number of battery modules. Each battery module includes a number of battery cells, a management circuit positioned at a first side of the battery module, and a heat source positioned at a second side of the battery module and opposite to the first side. The management circuit is electrically connected to and manages charging and discharging of the cells of the corresponding battery module. The heat source is thermally coupled to the cells of the corresponding battery module and dissipates heat generated by the cells of the corresponding battery module. The battery modules are arranged in two lines, and the first sides of the battery modules in one line are positioned adjacent to and face the first sides of the battery modules in another line.
    Type: Application
    Filed: October 31, 2013
    Publication date: March 26, 2015
    Applicant: UER TECHNOLOGY CORPORATION
    Inventors: RAY-TANG SUN, TSUNG-HSIEN CHUANG, NIEN-TIEN CHENG, CHIEN-LUNG CHEN
  • Patent number: 8956483
    Abstract: A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: February 17, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ming-Hsiu Chung, Nien-Tien Cheng
  • Patent number: 8845315
    Abstract: An exemplary injection molding apparatus includes a first mold defining a passage therein, a second mold engaging with the first mold, working fluid received in the passage of the first mold, and a thermal conductive member engaged in the first mold and thermally interconnecting the first mold and the working fluid. The first mold and the second mold cooperatively define a molding chamber therebetween adapted to receive injected molten material therein. The thermal conductive member transfers heat from the first and second molds to the working fluid when the first and second molds are hotter than the working fluid, and transfers heat from the working fluid to the first and second molds when the working fluid is hotter than the first and second molds.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: September 30, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Nien-Tien Cheng, Ming-Hsiu Chung
  • Publication number: 20140102671
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.
    Type: Application
    Filed: December 26, 2013
    Publication date: April 17, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
  • Patent number: 8667684
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 11, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
  • Patent number: 8622117
    Abstract: A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: January 7, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Lin Wu, Yu-Liang Lo, Wen-Hu Chen, Yue Liu, Nien-Tien Cheng
  • Publication number: 20130323344
    Abstract: An exemplary injection molding apparatus includes a first mold defining a passage therein, a second mold engaging with the first mold, working fluid received in the passage of the first mold, and a thermal conductive member engaged in the first mold and thermally interconnecting the first mold and the working fluid. The first mold and the second mold cooperatively define a molding chamber therebetween adapted to receive injected molten material therein. The thermal conductive member transfers heat from the first and second molds to the working fluid when the first and second molds are hotter than the working fluid, and transfers heat from the working fluid to the first and second molds when the working fluid is hotter than the first and second molds.
    Type: Application
    Filed: August 28, 2012
    Publication date: December 5, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: NIEN-TIEN CHENG, MING-HSIU CHUNG
  • Publication number: 20130323348
    Abstract: A heat dissipating assembly of a mold includes an angular pin, a heat pipe, and a liquid passage passing through the angular pin. The angular pin defines a receiving chamber therein. The liquid passage passes through a lower portion of the receiving chamber of the angular pin. The heat pipe includes a condensing section, an evaporation section, and a connecting section interconnecting the condensing section and the evaporation section. The evaporation section is embedded in an upper portion of the receiving chamber opposite to the lower portion. The condensing section is located in the lower portion of the receiving chamber. A mold having the heat dissipating assembly is also provided.
    Type: Application
    Filed: May 27, 2013
    Publication date: December 5, 2013
    Inventors: MING-HSIU CHUNG, NIEN-TIEN CHENG
  • Publication number: 20130312938
    Abstract: An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section.
    Type: Application
    Filed: June 26, 2012
    Publication date: November 28, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: NIEN-TIEN CHENG, CHING-BAI HWANG
  • Patent number: 8578605
    Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.
    Type: Grant
    Filed: June 4, 2012
    Date of Patent: November 12, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Ming-Tang Zhang, Wei-Hsiang Chang, Nien-Tien Cheng
  • Publication number: 20130269858
    Abstract: A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.
    Type: Application
    Filed: October 25, 2012
    Publication date: October 17, 2013
    Inventors: MING-HSIU CHUNG, NIEN-TIEN CHENG