Abstract: An exemplary method for manufacturing a heat pipe is disclosed. A mixture including metal powder and organic cement is made. The mixture is then injected to a mold to form two blanks. The two blanks are debinded to remove the organic cement therefrom. The two blanks are further sintered to join together and form a tube. A working liquid is filled in the tube from an open end thereof. The tube is then vacuumed to exhaust air therein. The open end of the tube is finally sealed to form a hermetic space in the tube.

Abstract: A bearing device includes a cylindrical body. The body defines an axial hole for rotatably receiving a rotatable member therein. The body defines a guiding groove at a side wall thereof. The guiding groove has a bottom end communicating a bottom of the axial hole and a top end at the body. The body defines a bore in a middle portion thereof to communicate the axial hole and the top end of the guiding groove, whereby lubricant can flow in a loop in the body.

Abstract: A method for manufacturing a bearing device includes steps: providing a hollow mold, then injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired perform of a cylindrical body and a desired perform of a cover; separating the binder from the desired perform of the body and the desired perform of the cover; sintering the desired perform of the body and the desired perform of the cover, thereby forming the body and the cover; and mounting the cover on the body, thereby forming the bearing device.

Abstract: An exemplary heat pipe includes an elongated casing, a first wick structure, a second wick structure, and working medium filled in the casing. The heat pipe has an evaporating section and a condensing section. The first wick structure is located within an inner wall of the casing and defines a window at the evaporating section of the heat pipe. The first wick structure has a first pore size. The second wick structure is received in the window of the first wick structure. The second wick structure is in direct physical contact with the inner wall of the evaporating section of the casing and the first wick structure. The second wick structure has a second pore size smaller than the first pore size of the first wick structure. The working medium saturates the first wick structure and the second wick structure.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An exemplary heat dissipation fan includes a housing and an impeller. The housing includes a casing. The casing includes a bottom wall and a side wall extending upwardly from the bottom wall. The impeller is received in the housing. The impeller includes a hub and a plurality of blades extending radially and outwardly from the hub. Each blade has a distal end facing the side wall of the casing. The inner side of the side wall depressed towards an outer side of the casing.

Abstract: A flat heat pipe includes a casing, a wick structure received in the casing, and a working medium contained in the casing and saturated in the wick structure. The casing has an upper plate and a bottom plate opposite to the upper plate. The wick structure is attached only to the bottom plate of the casing. The wick structure spaces from the upper plate with a vapor channel defined between the upper plate and the wick structure.

Abstract: An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer.

Abstract: A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An exemplary heat dissipation device for a portable electronic device includes a heat pipe and a heat dissipating member. The heat pipe includes an evaporator section and a condenser section. The evaporator section is attached to a heat source of the portable electronic device. The heat dissipating member includes a sheath, and a porous heat dissipating layer and a working fluid contained in the sheath. The porous heat dissipating layer defines gaps therein. The working fluid is filled in the gaps. The condenser section of the heat pipe is received in the porous heat dissipating layer and thermally contacts the porous heat dissipating layer.

Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.

Abstract: An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.

Abstract: A thermal module comprises a cooling fan, a heat pipe and a fin assembly. The cooling fan defines an air outlet therein. The fin assembly is mounted at the air outlet of the cooling fan. The heat pipe comprises an evaporating section attached to the cooling fan and a condensing section attached to the fin assembly. The evaporating section of the heat pipe is wholly located within an inner space of the cooling fan.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: An electronic device includes a casing, an electronic component received in the casing, and a fixing member. The casing includes a cutout defined in a side wall thereof for assembly or disassembly a heat dissipation member into or out of the electronic device. The fixing member is connected to the top wall of the casing. The fixing member includes an elongated pole, a guiding pole connected to an outer end of the elongated pole and located adjacent to the cutout, and a resilient element at an inner end of the elongated pole and located over the electronic component. The resilient element is compressed and abuts the heat dissipation member when the heat dissipation member is assembled into the electronic device to contact with the electronic component.

Abstract: An electronic device includes a chassis, an electronic component, a heat sink having a base and a thermal module. The chassis includes a bottom plate and a side plate surrounding the bottom plate. A cutout is defined in the side plate. The electronic component is arranged on the bottom plate and faces the cutout of the side plate. The base of the heat sink is arranged on the electronic component, and the thermal module is arranged on the base of the heat sink. The thermal module is assembled onto the base by extending through the cutout and can be taken out of the chassis through the cutout. The thermal module and the heat sink together dissipate heat generated by the electronic component when the thermal module is inserted into the chassis.