Patents by Inventor Ning Yang

Ning Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111061
    Abstract: In an aspect, a user equipment (UE) receives a spoofing alert message from either a server or an internet-of-things (IOT) device that indicates whether a spoofed Global Navigation Satellite System (GNSS) condition is present. Based on determining that the spoofing alert message indicates that a spoofed GNSS condition is present, the UE determines, based on the spoofing alert message, a location of a spoofer broadcasting a spoofed GNSS signal, determines, based on the location of the spoofer and a current location of the UE, that the UE is within a receiving area of the spoofed GNSS signal, and determines a position of the UE without using the spoofed GNSS signal.
    Type: Application
    Filed: December 8, 2023
    Publication date: April 4, 2024
    Inventors: Han ZHANG, Ning LUO, Gengsheng ZHANG, Bo ZHENG, Yinghua YANG, Min WANG
  • Publication number: 20240110479
    Abstract: The present disclosure provides a multi-factor quantitative analysis method for deformation of a neighborhood tunnel. The method includes the following steps: analyzing monitoring data generated at a tunnel site; simulating collapse occurring at a shallow buried section of a tunnel; determining the degree of influence of each factor on the tunnel and a stratum; and determining quantitative influence of each factor on tunnel deformation. The present disclosure can not only provide an accurate theoretical basis for the construction of the shallow buried section of the small-distance tunnel, but also guarantee safety and cost saving during tunnel construction.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Inventors: Yongjun ZHANG, Fei LIU, Sijia LIU, Junyi WANG, Bin GONG, Yingming WU, Ruiquan LU, Qingsong WANG, Qinghui XU, Xiaoming GUAN, Mingdong YAN, Xiangyang NI, Pingan WANG, Shuguang LI, Lin YANG, Ning NAN, Dengfeng YANG
  • Publication number: 20240113242
    Abstract: The photovoltaic module includes multiple cell sheets arranged in an array including multiple rows and multiple columns, where each of the multiple rows of cell sheets is arranged at intervals along a first direction, each of the multiple columns of cell sheets is arranged at intervals along a second direction, and each of the multiple cell sheets has a first surface and a second surface. The photovoltaic module further includes a first flexible cover layer located on a side of the first surface of each of the multiple cell sheets, and a second flexible cover layer located on a side of the second surface of each of the multiple cell sheets. The photovoltaic module is configured to be folded along a gap between two adjacent rows of cell sheets or along a gap between two adjacent columns of cell sheets with the folding angle of 0 degree to 180 degrees.
    Type: Application
    Filed: July 21, 2023
    Publication date: April 4, 2024
    Inventors: Ning LI, Pengjun XIAO, Zhigang DAI, Sen YANG, Weichong KONG, Bo LI, Jiaxiang YIN, Chunhua TAO
  • Publication number: 20240113243
    Abstract: The photovoltaic module includes multiple cell sheets arranged in an array including multiple rows and multiple columns. Each of the multiple rows of cell sheets is arranged at intervals along a first direction, each of the multiple columns of cell sheets is arranged at intervals along a second direction. The photovoltaic module includes multiple support plates arranged at intervals, where each of the multiple support plates extends along a direction in which each of the multiple rows or multiple columns of cell sheets is arranged, and each of the multiple support plates is arranged on the second surface of each of the multiple rows or the multiple columns of cell sheets. The photovoltaic module further includes a first flexible cover layer arranged on a side of the first surface of each of the multiple cell sheets and a second flexible cover layer arranged on each of the multiple support plates.
    Type: Application
    Filed: July 21, 2023
    Publication date: April 4, 2024
    Inventors: Ning LI, Pengjun XIAO, Zhigang DAI, Sen YANG, Yuanqi GONG, Bo LI, Jiaxiang YIN, Chunhua TAO
  • Patent number: 11949016
    Abstract: A method of fabricating a device includes providing a fin element in a device region and forming a dummy gate over the fin element. In some embodiments, the method further includes forming a source/drain feature within a source/drain region adjacent to the dummy gate. In some cases, the source/drain feature includes a bottom region and a top region contacting the bottom region at an interface interposing the top and bottom regions. In some embodiments, the method further includes performing a plurality of dopant implants into the source/drain feature. In some examples, the plurality of dopant implants includes implantation of a first dopant within the bottom region and implantation of a second dopant within the top region. In some embodiments, the first dopant has a first graded doping profile within the bottom region, and the second dopant has a second graded doping profile within the top region.
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Hao Lin, Chih-Chuan Yang, Chih-Hsuan Chen, Bwo-Ning Chen, Cha-Hon Chou, Hsin-Wen Su, Chih-Hsiang Huang
  • Publication number: 20240100598
    Abstract: The present invention relates to a Si-containing high-strength and low-modulus medical titanium alloy, and an additive manufacturing method and use thereof. The additive manufacturing method comprises alloy ingredient design, powder preparation, model construction and substrate preheating, and additive manufacturing molding; wherein the Si-containing high-strength and low-modulus medical titanium alloy is designed in the ingredient proportion of Ti 60-70 at. %, Nb 16-24 at. %, Zr 4-14 at. %, Ta 1-8 at. %, Si 0.1-5 at. %.
    Type: Application
    Filed: October 29, 2020
    Publication date: March 28, 2024
    Inventors: Yuanyuan Li, Chao Yang, Xuan Luo, Dongdong Li, Yanguo Qin, Ning Li
  • Publication number: 20240105532
    Abstract: The present disclosure provides a chip packaging method and a chip packaging structure. The chip packaging method includes: providing an encapsulated grain and a packaging substrate, the encapsulated grain including a first hybrid bonding structure; wherein the packaging substrate includes a front side and a back side opposite to each other; a second hybrid bonding structure is formed on the front side of the packaging substrate and a connection pin is formed on the back side of the packing substrate; the second hybrid bonding structure and the connection pin are electrically connected through a third connecting metal column penetrating the packaging substrate; and bonding together the first hybrid bonding structure of the encapsulated grain and the second hybrid bonding structure of the packaging substrate by medium-to-medium and metal-to-metal aligned bonding such that the encapsulated grain is bonded to the packaging substrate.
    Type: Application
    Filed: December 31, 2022
    Publication date: March 28, 2024
    Inventors: Zhigang PAN, Ning WANG, Xiaoqin SUN, Peng SUN, Daohong YANG, Sheng HU, Guoliang YE
  • Publication number: 20240107350
    Abstract: The present disclosure provides a beamforming report transmission method, a communication node and a computer-readable storage medium, the beamforming report transmission method includes: receiving, by a first communication node, a beamforming report sent by a third communication node, where the beamforming report includes at least one of a beamforming result or a channel quality measurement result between the third communication node and at least one second communication node.
    Type: Application
    Filed: November 20, 2020
    Publication date: March 28, 2024
    Inventors: Dan YANG, Nan LI, Ning WEI, Bo SUN, Zhiqiang HAN
  • Publication number: 20240105351
    Abstract: A method for measuring drop time of a control rod cluster integrated with a rod position measurement device is provided, wherein the method is used to measure the drop time of each control rod cluster, and includes: Si, monitoring a voltage Ua of coils in Group A to capture a rod cluster drop signal; S2, searching a point (tmax, Vmax) with a maximum drop speed or with a local maximum drop speed; S3, retroactively calculating, from tmax, an end of a time period T4 when the control rod cluster starts to drop; S4, retroactively searching, from a minimum value point of a drop reference signal DROPref, a start of the time period T4 when the drop reference signal DROPref drops from a maximum value to 33% thereof; and S5, determining, from tmax forward, a time point t6 when a drop speed of the control rod cluster is lower than 0.
    Type: Application
    Filed: January 14, 2021
    Publication date: March 28, 2024
    Applicant: NUCLEAR POWER OPERATIONS RESEARCH INSTITUTE (NPRI)
    Inventors: Zhengke CHANG, Minghui ZHANG, Yuan HUANG, Ye TIAN, Shaohua XU, Xinxin LIU, Weijian ZHU, Yiming MA, Shengfeng XU, Bo CHAO, Ning TAO, Zihua YANG, Desong LANG, Qichao WANG
  • Publication number: 20240105193
    Abstract: This application provides picture or audio encoding and decoding methods and apparatuses, and relates to the field of artificial intelligence (AI)—based picture or audio encoding and decoding technologies, and specifically, to the field of neural network-based picture feature map or audio feature variable encoding and decoding technologies. The encoding method includes: obtaining a to-be-encoded target, where the to-be-encoded target includes a plurality of feature elements, and the plurality of feature elements include a first feature element. The method further includes: obtaining a probability estimation result of the first feature element; determining, based on the probability estimation result of the first feature element, whether to perform entropy encoding on the first feature element; and performing entropy encoding on the first feature element only when it is determined that entropy encoding needs to be performed on the first feature element.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Jue Mao, Yin Zhao, Ning Yan, Haitao Yang, Lian Zhang, Jing Wang, Yibo Shi
  • Publication number: 20240084487
    Abstract: A knitted component comprising two yarns, forming at least a heel region of an upper for an article of footwear, where one of the yarns comprises a thermoplastic material. The outer surface may include a fused area comprising a first thermoplastic yarn. The inner surface may be at least partially formed with a second yarn and may substantially exclude the thermoplastic material. There may be a transitional area including a reduced amount of thermoplastic material relative to a fused area. The knitted component may include a cushioning material between layers of the knit element.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Jessica Green, Chun-Ying Hsu, Jaroslav J. Lupinek, Darryl Matthews, William C. McFarland, II, Chun-Yao Tu, Yi-Ning Yang, Cheng-Ying Han
  • Patent number: 11926572
    Abstract: Disclosed are a special fertilizer for intercropping maize and peanuts and a cultivation method for maintaining soil organic carbon (SOC) balance, belonging to the technical field of SOC balance. The special fertilizer for intercropping maize and peanuts includes the following raw materials: coated urea, heavy superphosphate, ammonium sulfate, fermented soybean meal, bentonite, sodium molybdate, borax, humic acid, ammonium dihydrogen phosphate, plant ash and zinc sulfate heptahydrate. The cultivation method includes the steps of land selection, land preparation, fertilizing, sowing, field management, and rotation.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 12, 2024
    Assignee: LIAONING ACADEMY OF AGRICULTURAL SCIENCES
    Inventors: Zhanxiang Sun, Liangshan Feng, Ning Yang, Fengyan Zhao, Yue Men, Chen Feng, Yilai Lou, Yongyong Zhang, Ping Wang, Xianglong Sun
  • Patent number: 11929418
    Abstract: A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped profile is disposed in the first trench. A gate dielectric contacts the first trench. An N-type work function layer is disposed between the gate dielectric layer and the first gate electrode. A second trench is embedded in the interlayer dielectric within the P-type transistor region. A second gate electrode having a first mushroom-shaped profile is disposed in the second trench. The gate dielectric layer contacts the second trench. The N-type work function layer is disposed between the gate dielectric layer and the second gate electrode. A first P-type work function layer is disposed between the gate dielectric layer and the N-type work function layer.
    Type: Grant
    Filed: November 11, 2021
    Date of Patent: March 12, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Jie-Ning Yang, Wen-Tsung Chang, Po-Wen Su, Kuan-Ying Lai, Bo-Yu Su, Chun-Mao Chiou, Yao-Jhan Wang
  • Publication number: 20240079604
    Abstract: A multifunctional mixed oxide electrocatalyst material including a metal oxide A with oxygen storage capacity and a metal oxide B with oxygen evolution reaction is prepared by two-steps hydrothermal reactions. The electrocatalyst material is a good free radical scavenger, oxygen evolution reagent and able to alleviate carbon monoxide poisoning on catalyst, when it is applied in a membrane electrode assembly for fuel cells.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Hongliang AO, Yunsong YANG, Yun CAI, Siyu YE, Yuquan ZOU, Junke TANG, Ning SUN
  • Publication number: 20240076848
    Abstract: A method for constructing a large-span station by two-wing open type semi-covered excavation and semi-reverse construction, is divided into three stages of excavation. First, excavate a first-stage inner small foundation pit, then excavate a second-stage annular foundation pit within the first-stage retaining piles and outside the range of the first-stage inner small foundation pit, and finally excavate a third-stage semi-covered excavation foundation pit below the first-stage inner small foundation pit and the second-stage annular foundation pit. By setting graded retaining piles, middle upright post piles, middle top plates, local waist beams and local concrete supports in the soil-rock combination strata, so that the force transfer between the foundation pit enclosure and the station main body structures and the underlying rock layer is clear and reliable, and a stable frame structure is achieved.
    Type: Application
    Filed: July 24, 2023
    Publication date: March 7, 2024
    Applicants: Beijing Urban Construction Design&Development Group Co., Limited
    Inventors: Fucai HUA, Gang LEI, Zhihui YANG, Jianye ZHU, Liang ZHANG, Ning LI, Yanan DONG, Ningning LI
  • Publication number: 20240068308
    Abstract: A full-face shaft tunnel boring machine system includes a tunnel boring machine cutterhead device for tunneling downwards in a shaft; a full-hydraulic formwork device for supporting and walling in a wellbore; and an upper muck-discharge system for vertically conveying rock mucks generated by tunneling. The tunnel boring machine cutterhead device comprises a vertical guide frame, a cutter-expanded boring head and an advanced cutterhead that are fixedly connected in a vertical order from top to bottom so as to form an integrated structure. The vertical guide frame is a hollow cylindrical structure and driven to rotate around an axis of the vertical guide frame by a power mechanism, and an outer wall of the vertical guide frame is provided with multiple sets of first guide rollers.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Applicants: HEFEI DESIGN & RESEARCH INSTITUTE OF COAL INDUSTRY CO., LTD, UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING, CHINA COAL NO.3 CONSTRUCTION CORPORATION (GROUP) LTD, ANSTEEL GROUP MINING CORPORTION LIMITED
    Inventors: Huidong XU, Renshu YANG, Bin XU, Ning LIU, Guang LI, Yong ZHANG, Jinghui YE, Lin LV, Fei MA, Donghui MAN, Tingting BAO, Zheng LI, Yingcan LIU, Guozheng ZHOU, Bo DING
  • Publication number: 20240072562
    Abstract: A motor control circuit includes a first switch module, a three-phase inverter, and a control module. A power supply module, the first switch module, the three-phase inverter, and a three-phase alternating current motor form a current loop; midpoints of three phase legs of the three-phase inverter are respectively connected to three phase coils of the three-phase alternating current motor; the three-phase alternating current motor is configured to input or output a current by using a wire N extending from a connection point of the three phase coils; the control module is connected to the three-phase inverter, first switch module, three-phase alternating current motor, and power supply module; the control module is configured to control the three-phase inverter to enable the motor control circuit to receive a voltage of the power supply module and output a direct current, and to boost a voltage of the power supply module.
    Type: Application
    Filed: November 9, 2023
    Publication date: February 29, 2024
    Inventors: Changjiu LIU, Hua PAN, Ronghua NING, Yang LIU, Ning YANG
  • Patent number: 11913102
    Abstract: The present invention discloses a Nb and Al-containing titanium-copper alloy strip, characterized in that the weight percentage composition of the titanium-copper alloy strip comprises: 2.00-4.50 wt % Ti, 0.005-0.4 wt % Nb, and 0.01-0.5 wt % Al, balance being Cu and unavoidable impurities. Preferably, in the microstructure of the titanium-copper alloy strip, the number of Nb and Al-containing intermetallic compound particles with a particle size of 50-500 nm is not less than 1×105/mm2, and the number of Nb and Al-containing intermetallic compound particles with a particle size greater than 1 ?m is not more than 1×103/mm2. Under the condition of ensuring excellent bendability, the titanium-copper alloy strip has excellent stability, especially the stability of mechanical properties at high temperatures. The present invention also relates to a method for producing the titanium-copper alloy strip.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: February 27, 2024
    Assignee: NINGBO BOWAY ALLOY PLATE & STRIP CO., LTD.
    Inventors: Ning Tang, Zhenkai Zhang, Yuepeng Zhi, Jian Yang, Bo Wu
  • Patent number: 11916172
    Abstract: An epitaxial structure adapted to a semiconductor pickup element is provided. The semiconductor pickup element has at least one guiding structure and provided with a pickup portion. The epitaxial structure includes a semiconductor layer corresponding to the pickup portion and capable of being picked up by the semiconductor pickup element. The epitaxial structure also includes at least one alignment structure disposed on the semiconductor layer and corresponding to the at least one guiding structure, so that the epitaxial structure and the semiconductor pickup element are positioned relative to each other. The number of the at least one alignment structure matches the number of the at least one guiding structure.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: February 27, 2024
    Assignee: PLAYNITRIDE DISPLAY CO., LTD.
    Inventors: Shiang-Ning Yang, Yi-Min Su, Yu-Yun Lo, Bo-Wei Wu, Tzu-Yu Ting
  • Patent number: D1018326
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: March 19, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chien Wei Tang, Ning Yang, Xiang Yuan