Patents by Inventor Nirmal Sharma

Nirmal Sharma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200355525
    Abstract: Methods and apparatus for sensor including a die, a leadframe having opposed first and second surfaces, the leadframe supporting the die on the first surface, lead fingers to provide electrical connections to the leadframe and to the die; and a component electrically coupled to the leadframe and to a first one of the lead fingers such that the component is an integrated part of the IC package. The leadframe may have a cutout region in which the component is positioned.
    Type: Application
    Filed: July 30, 2020
    Publication date: November 12, 2020
    Applicant: Allegro MicroSystems, LLC
    Inventors: William P. Taylor, Nirmal Sharma, Virgil Ararao, Leonardo Magpantay, Raymond W. Engel, Kirsten Doogue, Jay Gagnon
  • Publication number: 20180233410
    Abstract: Wafer dicing methods that simplify the singulation process for certain types of integrated circuit (IC) wafer substrates that improve device reliability and die strength, reduce the width of the cutting kerf, reduce cost, and improve yield. A first method includes making ablative scribing cuts on the front side of a wafer substrate along cutting streets around the perimeter of IC dies, followed by stealth laser dicing through the backside of the wafer substrate and in substantial alignment with the ablative scribing cuts. A second method includes making stealth laser dicing through the backside of the wafer substrate and in substantial alignment with cutting streets around the perimeter of IC dies, followed by ablative scribing cuts on the front side of a wafer substrate along the cutting streets.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 16, 2018
    Inventors: JOHN JAMES, SERGEI VORONOV, NIRMAL SHARMA, KIRBY KOETZ, VINCENT DEMAIORIBUS, DOUGLAS A. HAWKS
  • Patent number: 9228860
    Abstract: Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: January 5, 2016
    Assignee: Allegro Microsystems, LLC
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engle, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Publication number: 20150285874
    Abstract: Methods and apparatus for a sensor having a die supporting a magnetic field sensor element, a leadframe having opposed first and second surfaces and leadfingers, a passive component coupled to the first and second ones of the leadfingers such that the component is an integrated part of an IC package, and a magnet adjacent to the second surface of leadframe to back bias the magnetic field sensor element.
    Type: Application
    Filed: June 17, 2015
    Publication date: October 8, 2015
    Applicant: ALLEGRO MICROSYSTEMS, LLC
    Inventors: William P. Taylor, Virgil Ararao, Leonardo Magpantay, Raymond W. Engel, Nirmal Sharma, Kirsten Doogue, Jay Gagnon
  • Patent number: 8785250
    Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: July 22, 2014
    Assignee: Allegro Microsystems, LLC
    Inventors: Nirmal Sharma, Virgil Ararao
  • Publication number: 20130264667
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20130267043
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: March 15, 2013
    Publication date: October 10, 2013
    Applicant: Allegro Microsystems, Inc.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John B. Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 8486755
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: July 16, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 8461677
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: June 11, 2013
    Assignee: Allegro Microsystems, LLC
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Patent number: 8344301
    Abstract: A system for heat-treatment of large metallic samples including a microwave heating apparatus with a wave guide, means for monitoring and measuring temperature, holding means for holding the metallic sample. The holding means comprises a casket configuration made of low density alumina fiber board and wrapped with low density alumina fiber material to define a cavity and provided with susceptors along the inner walls of the cavity.
    Type: Grant
    Filed: February 23, 2006
    Date of Patent: January 1, 2013
    Assignee: Bharat Heavy Electricals Limited
    Inventors: Kulvir Singh, Nirmal Sharma, Jaipal Reddy Gurram, Swaminathan Gopalan
  • Publication number: 20120086090
    Abstract: Methods and apparatus provide a sensor including a component coupled to the leadframe such that the component is an integrated part of the IC package.
    Type: Application
    Filed: December 14, 2011
    Publication date: April 12, 2012
    Applicant: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Virgil Ararao, Leonardo T. Magpantay, Raymond W. Engel, William P. Taylor, Kirsten Doogue, Jay Gagnon
  • Patent number: 8143169
    Abstract: Methods for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: March 27, 2012
    Assignee: Allegro Microsystems, Inc.
    Inventors: Raymond W. Engel, Nirmal Sharma, William P. Taylor
  • Publication number: 20120013333
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: September 23, 2011
    Publication date: January 19, 2012
    Applicant: ALLEGRO MICROSYSTEMS, INC.
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20100330708
    Abstract: Methods for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
    Type: Application
    Filed: September 9, 2010
    Publication date: December 30, 2010
    Applicant: Allegro Microsystems, Inc.
    Inventors: Raymond W. Engel, Nirmal Sharma, William P. Taylor
  • Patent number: 7816772
    Abstract: Methods and apparatus for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
    Type: Grant
    Filed: March 29, 2007
    Date of Patent: October 19, 2010
    Assignee: Allegro Microsystems, Inc.
    Inventors: Raymond W. Engel, Nirmal Sharma, William P. Taylor
  • Publication number: 20100163554
    Abstract: A system for heat-treatment of large metallic samples including a microwave heating apparatus with a wave guide, means for monitoring and measuring temperature, holding means for holding the metallic sample. The holding means comprises a casket configuration made of low density alumina fiber board and wrapped with low density alumina fiber material to define a cavity and provided with susceptors along the inner walls of the cavity.
    Type: Application
    Filed: February 23, 2006
    Publication date: July 1, 2010
    Applicant: Bharat Heavy Electricals Limited
    Inventors: Kulvir Singh, Nirmal Sharma, Jaipal Reddy Gurram, Swaminathan Gopalan
  • Publication number: 20100141249
    Abstract: Magnetic field sensors and associated methods of manufacturing the magnetic field sensors include molded structures to encapsulate a magnetic field sensing element and an associated die attach pad of a lead frame and to also encapsulate or form a magnet or a flux concentrator.
    Type: Application
    Filed: December 5, 2008
    Publication date: June 10, 2010
    Inventors: Virgil Ararao, Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor, Elsa Kam-Lum
  • Publication number: 20080237818
    Abstract: Methods and apparatus for providing an integrated circuit using a multi-stage molding process to protect wirebonds. In one embodiment, a method includes attaching a die to a leadframe having a lead finger, attaching a wirebond between the die and the leadfinger, applying a first mold material over at least a portion of the wirebond and the die and the leadfinger to form an assembly, waiting for the first mold material to at least partially cure, and applying a second mold material over the assembly.
    Type: Application
    Filed: March 29, 2007
    Publication date: October 2, 2008
    Inventors: Raymond W. Engel, Nirmal Sharma, William P. Taylor
  • Publication number: 20080230879
    Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.
    Type: Application
    Filed: April 30, 2008
    Publication date: September 25, 2008
    Inventors: Nirmal Sharma, Virgil Ararao
  • Patent number: 7361531
    Abstract: Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder.
    Type: Grant
    Filed: November 1, 2005
    Date of Patent: April 22, 2008
    Assignee: Allegro Microsystems, Inc.
    Inventors: Nirmal Sharma, Virgil Ararao