Abstract: An electronic pen includes a cylindrical housing including an opening on one end of the housing in an axial direction of the housing, a core body attached inside of the housing such that an end of the core body protrudes from the opening on the one end of the housing, and a signal generation circuit which, in operation, generates a signal that is transmitted from the core body. The core body includes a core rod that is conductive and a protection member. The core rod includes a front portion that protrudes from the opening on the one end of the housing, a back portion, and an intermediate portion between the front portion and the back portion. The intermediate portion has a tapered shape narrowing from the front portion toward the back portion. The core rod receives the signal from the signal generation circuit. The protection member covers a side surface of the intermediate portion of the core rod.

Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Abstract: To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

Abstract: A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

Abstract: The interconnection device includes a housing, and a first communication unit and an output unit which are accommodated in the housing. The housing includes a duct connector physically attachable and electrically connectable to a wiring duct for transferring first power. The first communication unit performs communication in a power line communication scheme through the wiring duct. The output unit includes a second communication unit and a conversion unit. The second communication unit communicates with a device in a telecommunication standard different from the power line communication scheme in accordance with the communication signal received by the first communication unit. The conversion unit generates second power of a different standard from the first power based on the first power obtained from the wiring duct through the duct connector and supply the second power to the device.

Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Abstract: A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

Abstract: To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput. Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

Abstract: The interconnection device includes a housing, and a first communication unit and an output unit which are accommodated in the housing. The housing includes a duct connector physically attachable and electrically connectable to a wiring duct for transferring first power. The first communication unit performs communication in a power line communication scheme through the wiring duct. The output unit includes a second communication unit and a conversion unit. The second communication unit communicates with a device in a telecommunication standard different from the power line communication scheme in accordance with the communication signal received by the first communication unit. The conversion unit generates second power of a different standard from the first power based on the first power obtained from the wiring duct through the duct connector and supply the second power to the device.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

Abstract: A socket includes power-supply blade receivers and a grounding blade receiver for retaining power-supply plug blades and a grounding plug blade of a plug, respectively. Each of the power-supply blade receivers includes a power-supply retaining portion and a power-supply contact portion. The grounding blade receiver includes a grounding retaining portion and a grounding contact portion which is installed further on the upstream side in the insertion direction of the plug than a position which is spaced away from the power-supply contact portion to the downstream side in the insertion direction by less than the certain distance. The grounding retaining portion is spaced away by the certain distance or more from the power-supply retaining portion to the downstream side in the insertion direction.

Abstract: Provided is a jet nozzle that varies a width of a flow of jetted molten solder. The jet nozzle contains a nozzle main body having a channel section at its part and a molten solder flow width varying member that varies a width of the upper opening end of the nozzle main body by a slide of the molten solder flow width varying member within the channel section of the nozzle main body to vary a width of the molten solder flow jetted from the upper opening end of the nozzle main body. The molten solder flow width varying member includes a molten solder flow width varying plate that varies the width of the molten solder flow, a rectangular rectifying piece that extends along a slide direction of the molten solder flow width varying member, and a sliding shaft that slides the rectifying piece.

Abstract: The first object is to increase the life of a selective CO methanation catalyst, and the second object is to enhance the CO removal rate of a selective CO methanation catalyst to reduce the outlet CO concentration in a wide temperature range. Provided a selective CO methanation catalyst including a supported metal catalyst which selectively methanizes CO in a hydrogen-rich gas containing CO and CO2 and a coating layer which covers a surface of the supported metal catalyst, has many pores, and is configured to reduce a CO concentration on the surface of the supported metal catalyst.

Abstract: A socket includes power-supply blade receivers and a grounding blade receiver for retaining power-supply plug blades and a grounding plug blade of a plug, respectively. Each of the power-supply blade receivers includes a power-supply retaining portion and a power-supply contact portion. The grounding blade receiver includes a grounding retaining portion and a grounding contact portion which is installed further on the upstream side in the insertion direction of the plug than a position which is spaced away from the power-supply contact portion to the downstream side in the insertion direction by less than the certain distance. The grounding retaining portion is spaced away by the certain distance or more from the power-supply retaining portion to the downstream side in the insertion direction.

Abstract: The first object is to increase the life of a selective CO methanation catalyst, and the second object is to enhance the CO removal rate of a selective CO methanation catalyst to reduce the outlet CO concentration in a wide temperature range. Provided a selective CO methanation catalyst including a supported metal catalyst which selectively methanizes CO in a hydrogen-rich gas containing CO and CO2 and a coating layer which covers a surface of the supported metal catalyst, has many pores, and is configured to reduce a CO concentration on the surface of the supported metal catalyst.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: A wave soldering tank includes a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body. An axial-flow, multiple-blade screw-type pump is disposed so as to draw molten solder into the solder feed chamber through an inlet and discharge the molten solder through an outlet. In a preferred embodiment, the pump includes a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub, each of the blades overlapping an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.

Abstract: There is provided a catalyst for a water gas shift reaction in a hydrogen gas which is able to effectively remove CO in the hydrogen gas within a broader temperature range. Such a catalyst for the water gas shift reaction is characterized in that a metal oxide carrier supports at least platinum. The catalyst can be used for removing carbon monoxide in the hydrogen gas. Particularly, such a catalyst can be used in the water gas shift reaction for removing carbon monoxide in a reformed gas in a fuel cell generation system.